Patents by Inventor Cheng-Lung SHE

Cheng-Lung SHE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device packages and methods of manufacturing the same
    Patent number: 11120988
    Abstract: A semiconductor device package includes a first semiconductor device, a first redistribution layer (RDL) structure and a second RDL structure. The first semiconductor device has a first conductive terminal and a second conductive terminal. The first RDL structure covers the first conductive terminal. The second RDL structure covers the second conductive terminal and being separated from the first RDL structure.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: September 14, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Pei-Jen Lo, Cheng-Lung She
  • SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20210035794
    Abstract: A semiconductor device package includes a first semiconductor device, a first redistribution layer (RDL) structure and a second RDL structure. The first semiconductor device has a first conductive terminal and a second conductive terminal. The first RDL structure covers the first conductive terminal. The second RDL structure covers the second conductive terminal and being separated from the first RDL structure.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 4, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pei-Jen LO, Cheng-Lung SHE