Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.

Abstract: A method includes etching a first semiconductor fin and a second semiconductor fin to form first recesses. The first and the second semiconductor fins have a first distance. A third semiconductor fin and a fourth semiconductor fin are etched to form second recesses. The third and the fourth semiconductor fins have a second distance equal to or smaller than the first distance. An epitaxy is performed to simultaneously grow first epitaxy semiconductor regions from the first recesses and second epitaxy semiconductor regions from the second recesses. The first epitaxy semiconductor regions are merged with each other, and the second epitaxy semiconductor regions are separated from each other.

Abstract: Semiconductor structures and methods are provided. A semiconductor structure according to the present disclosure includes a first fin structure and a second fin structure over a substrate, a first source/drain feature disposed over the first fin structure and a second source/drain feature disposed over the second fin structure, a dielectric feature disposed over the first source/drain feature, and a contact structure formed over the first source/drain feature and the second source/drain feature. The contact structure is electrically coupled to the second source/drain feature and is separated from the first source/drain feature by the dielectric feature.

Abstract: To predict a temperature of a chip of a PCIe card of a server, use a gated recurrent unit of a recurrent neural network to define a temperature prediction model for the chip, collect training data of the temperature prediction model according to mutual response changes of control variables, use the training data to train the temperature prediction model to obtain a training result close to a measured temperature of the chip and evaluate the training result to obtain features that best reflect the temperature change of the chip, perform an error analysis on the training result to obtain a set of key features from the features, form a temperature predictor according to the set of key features and the temperature prediction model, and generate a predicted temperature of the chip by the temperature predictor.

Abstract: A method for controlling an angular speed of a fan of a computer system includes obtaining an error value; obtaining an adjusted error value by adjusting the error value using an adjustment constant when an absolute value of the error value is not larger than a predetermined value; obtaining a total output value according to at least the adjusted error value; and controlling the angular speed of the fan according to the total output value. The total output value is positively related to a pulse width modulation value, and the angular speed of the fan increases when the pulse width modulation value increases.

Abstract: A diamond manufacturing apparatus for forming at least one diamond is provided. The diamond manufacturing apparatus comprises a growth base and an electric field device. The growth base comprises a top portion and a bottom portion opposite to each other, and the top portion has a growth surface that is concave toward the bottom portion. A plurality of electric field lines of an electric field that is generated by the electric field device are substantially perpendicular to the growth surface.

Abstract: A temperature control device comprises a fan, a temperature sensor, a modeling circuit and a PID controller, with the PID controller connected with the fan, the temperature sensor and the modeling circuit. The fan drives airflows for controlling the temperature of a controlled region. The temperature sensor is disposed in the controlled region and obtains a detected temperature indicating the temperature of the controlled region. The modeling circuit obtains at least one cooling parameter group based on a transfer function. The PID controller controls the fan based on an initial parameter group when the detected temperature is lower than a first temperature, and controls the fan based on said at least one cooling parameter group when the detected temperature is equal to or higher than the first temperature. The initial parameter group comprises initial parameters, with the value of each of the initial parameters equal to a preset value.

Abstract: A method for controlling an angular speed of a fan of a computer system includes obtaining an error value; obtaining an adjusted error value by adjusting the error value using an adjustment constant when an absolute value of the error value is not larger than a predetermined value; obtaining a total output value according to at least the adjusted error value; and controlling the angular speed of the fan according to the total output value. The total output value is positively related to a pulse width modulation value, and the angular speed of the fan increases when the pulse width modulation value increases.

Abstract: After a temperature point of the cooling fan is set according to a plurality of temperatures corresponding to a plurality of first consecutive time intervals, control a duty cycle of the cooling fan according to the temperature point, acquire temperature variation data of the cooling fan during a plurality of second consecutive time intervals, generate a gain factor and a frequency factor of the cooling fan according to the temperature variation data, and generate a proportional gain factor, an integral time factor and a derivative time factor of a proportional-integral-derivative controller of the cooling fan according to the gain factor and the frequency factor of the cooling fan. The plurality of first consecutive time intervals are followed by the plurality of second consecutive time intervals.

Abstract: A gift packaging device includes a support member, a stem slidably engaged through the support member and moveable up and down relative to the support member, a carrier member disposed on the stem for supporting a gift, a number of flaps pivotally attached to the support member and rotateable relative to the support member between a folded position where the gift is shielded with the flaps, and an opened position where the gift is viewable, and a number of links are coupled between the stem and the flaps for allowing the flaps to be rotated relative to the support member between the folded position and the opened position when the stem is moved relative to the support member of the support device.

Abstract: A temperature-controlling method adapted to a server comprises: getting a detected temperature; selecting a schedule from a plurality of schedules according to the detected temperature by a gain-scheduling unit, wherein the plurality of schedules comprises an initial parameter set and at least one cooling parameter set; calculating and outputting a control signal of fan speed according to the initial parameter set or said at least one cooling parameter set by a PID controller; and adjusting a rotating speed according to the control signal of fan speed by a fan.

Abstract: A temperature control device comprises a fan, a temperature sensor, a modeling circuit and a PID controller, with the PID controller connected with the fan, the temperature sensor and the modeling circuit. The fan drives airflows for controlling the temperature of a controlled region. The temperature sensor is disposed in the controlled region and obtains a detected temperature indicating the temperature of the controlled region. The modeling circuit obtains at least one cooling parameter group based on a transfer function. The PID controller controls the fan based on an initial parameter group when the detected temperature is lower than a first temperature, and controls the fan based on said at least one cooling parameter group when the detected temperature is equal to or higher than the first temperature. The initial parameter group comprises initial parameters, with the value of each of the initial parameters equal to a preset value.

Abstract: A gift packaging device includes a support member, a stem slidably engaged through the support member and moveable up and down relative to the support member, a carrier member disposed on the stem for supporting a gift, a number of flaps pivotally attached to the support member and rotateable relative to the support member between a folded position where the gift is shielded with the flaps, and an opened position where the gift is viewable, and a number of links are coupled between the stem and the flaps for allowing the flaps to be rotated relative to the support member between the folded position and the opened position when the stem is moved relative to the support member of the support device.

Abstract: After a temperature point of the cooling fan is set according to a plurality of temperatures corresponding to a plurality of first consecutive time intervals, control a duty cycle of the cooling fan according to the temperature point, acquire temperature variation data of the cooling fan during a plurality of second consecutive time intervals, generate a gain factor and a frequency factor of the cooling fan according to the temperature variation data, and generate a proportional gain factor, an integral time factor and a derivative time factor of a proportional-integral-derivative controller of the cooling fan according to the gain factor and the frequency factor of the cooling fan. The plurality of first consecutive time intervals are followed by the plurality of second consecutive time intervals.

Abstract: A drive circuit structure for LED lamp tube is disclosed, wherein the LED lamp tube comprises a lampshade, at least an LED lamp strap and at least a drive circuit structure. The LED lamp strap is disposed inside the lampshade, and drive circuit structure connected with the LED lamp strap is disposed on any side within the lampshade. Moreover, the drive circuit structure includes multiple general-sized electronic components, at least a large-sized electronic component and a drive circuit board, wherein such general-sized electronic components are inserted on a plane of the drive circuit board, and the large-sized electronic component is disposed upright on any side of the drive circuit board. Accordingly, though the large-sized electronic component becomes voluminous, by disposing it upright on one side of the drive circuit board, it is possible to prevent the drive circuit structure from occupying larger accommodation space due to the large-sized electronic component.

Abstract: An improved light emitting diode (LED) lamp tube structure, comprising a lampshade, at least an LED lamp strap installed inside the lampshade and at least a drive circuit installed on any side of the interior of the lampshade, wherein the drive circuit includes multiple electronic components and a drive circuit board, in which the electronic components are insertion installed on one side of the drive circuit board, and at least an LED is insertion installed on the other side of the drive circuit board. Therefore, when the drive circuit drives the LED lamp strap to illuminate, it also drives the LEDs insertion installed on the other side of the drive circuit board to light up at the same time so the entire lampshade can illuminate completely.

Abstract: A cooling device for a diamond-wire cutting system includes a fluid retarding space as a cooling tank enclosed and defined by one or more surfaces for temporarily holding a cooling fluid. The surfaces provide a closed or semi-open sidewall that allows a cutting part of a diamond wire for cutting a workpiece to pass through the cooling tank and get immersed in the cooling fluid. A sorting collector is connected to the cooling tank. Thereby, cutting the hard-brittle workpiece is always performed in the cooling fluid, so as to prevent the cooling fluid and cutting chips from splashing, and improve heat dissipation and dust removal, thereby enhancing the cutting capability and efficiency. The tooled workpiece has cut surfaces with improved smoothness. The sorting collector performs solid-liquid separation to the cooling fluid containing cutting chips, so that the cutting chips and the cooling fluid can be recycled.

Abstract: An ESD protection circuit with impedance matching for radio frequency integrated circuits is provided. Nodes at the ends of a transmission line, respectively have at least one ESD component coupled between each and one of the power rails. The ESD components discharge ESD currents and the transmission lines provide RF matching.

Abstract: An integrally formed gear set with a plurality of gears comprises a first, a second and a third gear. Each gear has a plurality of teeth and a plurality of recess portions. The teeth and recess portions are alternatively arranged. The first, second and third gears are formed by a sheet which is firstly formed as a stepped structure containing three layers which are the first gear, second gear and third gears; the rings between two gears are formed with a plurality of teeth which are bent to be at the same plane of the second and third gears.

Abstract: An ESD protection circuit design incorporating a single, or a plurality of, parallel inductor and capacitor, also known as LC tank(s), to avoid power loss by parasitic capacitance in ESD circuits. The first design described incorporates a LC tank structure. The second includes two LC tank structures. These structures can be expanded to form ESD protection circuit structures stacked with n-stages LC tanks. The last design described is ESD protection circuits formed by stacking the first design. These designs can avoid power gain loss from parasitic capacitance of ESD, because the parameters of LC tank can be designed to resonant at a desired operating frequency. Each of these designs can be altered slightly to create variant designs with equal identical ESD protection capabilities.