Patents by Inventor Cheng-wei Chen

Cheng-wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10814196
    Abstract: The present disclosure discloses a synthetic shuttlecock, which includes a base portion, a plurality of stems, and a plurality of feathers. One end of each of the stems is inserted into the base portion. Two of the feathers are connected to one of the stems. A connecting portion is formed on the stem, respectively. Each of the feathers has a first length and a first width. Each of the feathers has two holes, the two holes are located on the two sides of the connecting portion respectively, and the holes are close to a front end of the connecting portion. Each of the holes has a second length and a second width. The ratio of the second length to the first length is between 0.22 and 0.31, and the ratio of the second width to the first width is between 0.06 and 0.28.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: October 27, 2020
    Assignee: Victor Rackets Industrial Corp.
    Inventors: Shu-Jung Chen, Tzu-Wei Wang, Hsin-Chen Wang, Cheng-Yu Chang
  • Patent number: 10814187
    Abstract: The present invention discloses a badminton racket, which includes a frame, a grip, a cap and a shaft. The grip includes a gripping portion, a sleeved portion, and a fastening element connected to the gripping portion. The sleeved portion has a first top surface and a first opening. The fastening element is connected to the first top surface, and the fastening element extends from the first opening to the inside of the gripping portion. The cap is sleeved onto the sleeved portion and has a second top surface and a second opening. There is a spacing length between the first top surface and the second top surface, and the cap has a cap length. The ratio of the spacing length to the cap length is between 0.39 and 0.83. One end of the shaft is connected to the frame, and another end is inserted into the fastening element.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: October 27, 2020
    Assignee: Victor Rackets Industrial Corp.
    Inventors: Shu-Jung Chen, Tzu-Wei Wang, Hsin-Chen Wang, Cheng-Yu Chang
  • Patent number: 10804071
    Abstract: An electron microscope specimen includes a first electron-transport layer, a second electron-transport layer, a spacer layer, and a carrier layer. The second electron-transport layer has a first opening, a second opening, and a viewing area, wherein the viewing area is between the first opening and the second opening. The spacer layer is sandwiched between the first electron-transport layer and the second electron-transport layer, and the spacer layer has an accommodating space communicating with the first opening and the second opening. The carrier layer is disposed on the second electron-transport layer, and has a viewing window, a first injection hole, and a second injection hole, wherein the viewing window is substantially aligned with the viewing area and the accommodating space, and the first injection hole and the second injection hole respectively communicate with the first opening and the second opening.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: October 13, 2020
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Wen-Wei Wu, Wei-Huan Tsai, Jui-Yuan Chen, Cheng-Lun Hsin
  • Patent number: 10806044
    Abstract: A board structure for a cable passing therethrough includes a board body and a grommet. The board body includes a board hole and a first inner protrusion portion. A minimum diameter of the board hole is a diameter located corresponding to the first inner protrusion portion of the board hole. The grommet is made of an elastic material and disposed in the board hole. The grommet includes a grommet hole and an outer annular wall. The outer annular wall is connected to the first inner protrusion portion. The grommet hole is for the cable passing therethrough and coaxially disposed with the board hole. A diameter of the grommet hole is smaller than the minimum diameter of the board hole.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: October 13, 2020
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Hung-Wei Lee, Tung-Yi Chen, Cheng-Wei Yeh
  • Patent number: 10804444
    Abstract: A light-emitting device including at least one light-emitting unit, a wavelength conversion adhesive layer, and a reflective protecting element is provided. The light-emitting unit has an upper surface and a lower surface opposite to each other. The light-emitting unit includes two electrode pads, and the two electrode pads are located on the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface. The wavelength conversion adhesive layer includes a low-concentration fluorescent layer and a high-concentration fluorescent layer. The high-concentration fluorescent layer is located between the low-concentration fluorescent layer and the light-emitting unit. The width of the high-concentration fluorescent layer is WH. The width of the low-concentration fluorescent layer is WL. The width of the light-emitting unit is WE. The light-emitting device further satisfies the following inequalities: WE<WL, WH<WL and 0.8<WH/WE?1.2.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: October 13, 2020
    Assignee: Genesis Photonics Inc.
    Inventors: Cheng-Wei Hung, Long-Chi Tu, Jui-Fu Chang, Chun-Ming Tseng, Yun-Chu Chen
  • Publication number: 20200315050
    Abstract: A board structure for a cable passing therethrough includes a board body and a grommet. The board body includes a board hole and a first inner protrusion portion. A minimum diameter of the board hole is a diameter located corresponding to the first inner protrusion portion of the board hole. The grommet is made of an elastic material and disposed in the board hole. The grommet includes a grommet hole and an outer annular wall. The outer annular wall is connected to the first inner protrusion portion. The grommet hole is for the cable passing therethrough and coaxially disposed with the board hole. A diameter of the grommet hole is smaller than the minimum diameter of the board hole.
    Type: Application
    Filed: December 10, 2019
    Publication date: October 1, 2020
    Inventors: Hung-Wei LEE, Tung-Yi CHEN, Cheng-Wei YEH
  • Publication number: 20200304165
    Abstract: A testing system includes: a bilinear polarized antenna for receiving and dividing a circularly polarized radio wave associating with a horizontal and a vertical polarization path of an object-to-be-tested into a first and a second high frequency signal; a phase retarder for delaying a phase of the first high frequency signal by 90 degrees to form a first high frequency signal with a phase delay of 90 degrees; a power splitter for receiving or synthesizing the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal; and a high frequency signal transceiver for measuring power of the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal and determining states of the horizontal and vertical polarization paths of the object-to-be-tested based on the power. Therefore, the testing system can speed up testing of the object-to-be-tested.
    Type: Application
    Filed: April 8, 2020
    Publication date: September 24, 2020
    Inventors: Bo-Siang Fang, Kuan-Ta Chen, Ying-Wei Lu, Chia-Chu Lai, Cheng-Tsai Hsieh
  • Patent number: 10775237
    Abstract: Disclosed is a resonant wavelength measurement apparatus, including a light source and a measurement unit. The measurement unit has a guided-mode resonance filter and a photosensitive element. The guided-mode resonance filter has a plurality of resonant areas, and each resonant area has a different filtering characteristic, to receive first light in the light source transmitted by a sensor or receive second light in the light source reflected by the sensor. The first light has a first corresponding pixel on the photosensitive element, the second light has a second corresponding pixel on the photosensitive element, and the first corresponding pixel and the second corresponding pixel correspond to a same resonant wavelength.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: September 15, 2020
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Cheng-Sheng Huang, Chih-Wei Chang, Shi-Ting Chen
  • Patent number: 10770356
    Abstract: An apparatus includes a first source and a common drain and on opposite sides of a first gate surrounded by a first gate spacer, a second source and the common drain on opposite sides of a second gate surrounded by a second gate spacer, a first protection layer formed along a sidewall of the first gate spacer, wherein a top surface of the first protection layer has a first slope, a second protection layer formed along a sidewall of the second gate spacer, wherein a top surface of the second protection layer has a second slope, a lower drain contact between the first gate and the second gate and an upper drain contact over the lower drain contact and between the first gate and the second gate, wherein at least a portion of the upper drain contact is in contact with the first slope and the second slope.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: September 8, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wan Hsuan Hsu, I-Hsiu Wang, Yean-Zhaw Chen, Cheng-Wei Chang, Yu Shih Wang, Hsin-Yan Lu, Yi-Wei Chiu
  • Patent number: 10770014
    Abstract: A display device includes a display panel having a display region and a peripheral region. The display panel includes a substrate and a scan driving circuit. The scan driving circuit disposed on the substrate includes a plurality of scan driving blocks and a plurality of first conductive lines. The first conductive lines are respectively coupled to and disposed between adjacent scan driving blocks. The scan driving blocks are disposed corresponding to the peripheral region, and the first conductive lines are disposed corresponding to the display region and the peripheral region.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: September 8, 2020
    Assignee: INNOLUX CORPORATION
    Inventors: Chia-Min Yeh, Hung-Hsun Chen, Hui-Min Huang, Cheng-Tso Chen, Li-Wei Sung
  • Patent number: 10763571
    Abstract: An antenna structure includes a housing and a feeding source. The housing forms a radiating portion, a first coupling portion, and a second coupling portion. The first coupling portion and the second coupling portion are grounded. The feeding source is electrically connected to the radiating portion for feeding current to the radiating portion and divides the radiating portion into a first radiating section and a second radiating section. When the feeding source supplies current, the current flows through the first radiating section and is coupled to the first coupling portion to activate a first operation mode and a second operation mode. When the feeding source supplies current, the current flows through the second radiating section and is coupled to the second coupling portion to activate a third operation mode and a fourth operation mode.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: September 1, 2020
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Jin-Bo Chen, Cheng-An Chen, Chih-Wei Liao
  • Publication number: 20200273827
    Abstract: A micro-connection structure is provided. The micro-connection structure includes an under bump metallurgy (UBM) pad, a bump and an insulating ring. The UBM pad is electrically connected to at least one metallic contact of a substrate. The bump is disposed on the UBM pad and electrically connected with the UBM pad. The insulating ring surrounds the bump and the UBM pad. The bump is separate from the insulating ring with a distance and the bump is isolated by a gap between the insulating ring and the bump.
    Type: Application
    Filed: May 10, 2020
    Publication date: August 27, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Hsiung Lu, Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Chin-Wei Kang, Kai-Jun Zhan
  • Publication number: 20200263933
    Abstract: A fast heat-sinking, current stabilization and pressure boosting device for condenser is disclosed, comprising a heat exchange module and an outer case. The heat exchange module is further divided into a high pressure area and a low pressure area, and an air in channel is installed in the high pressure area and a water out channel is installed in the low pressure area; also, the heat exchange module is provided with at least one channel, and the heat exchange module is assembled inside the outer case. As such, the pressure difference between the low pressure area and the high pressure area can drive the water in each of the inner channels to flow faster toward the low pressure area.
    Type: Application
    Filed: February 6, 2020
    Publication date: August 20, 2020
    Inventors: Chi-Feng HSU, Cheng-Jen LIANG, Chih-Wei CHEN
  • Patent number: 10739671
    Abstract: In a method of manufacturing a photo mask, a resist layer is formed over a mask blank, which includes a mask substrate, a phase shift layer disposed on the mask substrate and a light blocking layer disposed on the phase shift layer. A resist pattern is formed by using a lithographic operation. The light blocking layer is patterned by using the resist pattern as an etching mask. The phase shift layer is patterned by using the patterned light blocking layer as an etching mask. A border region of the mask substrate is covered with an etching hard cover, while a pattern region of the mask substrate is opened. The patterned light blocking layer in the pattern region is patterned through the opening of the etching hard cover. A photo-etching operation is performed on the pattern region to remove residues of the light blocking layer.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: August 11, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Chieh Tien, Cheng-Hsuen Chiang, Chih-Ming Chen, Cheng-Ming Lin, Yen-Wei Huang, Hao-Ming Chang, Kuo Chin Lin, Kuan-Shien Lee
  • Publication number: 20200235272
    Abstract: A manufacturing method of a light emitting device package structure is provided. The method includes following operations: (i) providing a circuit redistribution structure; (ii) providing a first substrate; (iii) forming a circuit layer structure over the first substrate, wherein the circuit layer structure includes a first circuit layer; (iv) before or after operation (iii), placing a light emitting device between the first substrate and the circuit layer structure or over the circuit layer structure, wherein the light emitting device is electrically connected with the first circuit layer; and (v) placing the circuit redistribution structure over the light emitting device, wherein the circuit redistribution structure includes a first redistribution layer, a second redistribution layer, and a chip, and the first redistribution layer includes a second circuit layer and a conductive contact that contacts the second circuit layer.
    Type: Application
    Filed: April 7, 2020
    Publication date: July 23, 2020
    Inventors: Pei-Wei WANG, Cheng-Ta KO, Yu-Hua CHEN, De-Shiang LIU, Tzyy-Jang TSENG
  • Publication number: 20200219945
    Abstract: A display may have an array of pixels. Display driver circuitry may supply data and control signals to the pixels. Each pixel may have seven transistors, a capacitor, and a light-emitting diode such as an organic light-emitting diode. The seven transistors may receive control signals using horizontal control lines. Each pixel may have first and second emission enable transistors that are coupled in series with a drive transistor and the light-emitting diode of that pixel. The first and second emission enable transistors may be coupled to a common control line or may be separately controlled so that on-bias stress can be effectively applied to the drive transistor. The display driver circuitry may have gate driver circuits that provide different gate line signals to different rows of pixels within the display. Different rows may also have different gate driver strengths and different supplemental gate line loading structures.
    Type: Application
    Filed: March 23, 2020
    Publication date: July 9, 2020
    Inventors: Cheng-Ho Yu, Chin-Wei Lin, Shyuan Yang, Ting-Kuo Chang, Tsung-Ting Tsai, Warren S. Rieutort-Louis, Shih-Chang Chang, Yu Cheng Chen, John Z. Zhong
  • Publication number: 20200206595
    Abstract: The present disclosure discloses a synthetic shuttlecock, which includes a base portion, a plurality of stems, and a plurality of feathers. One end of each of the stems is inserted into the base portion. Two of the feathers are connected to one of the stems. A connecting portion is formed on the stem, respectively. Each of the feathers has a first length and a first width. Each of the feathers has two holes, the two holes are located on the two sides of the connecting portion respectively, and the holes are close to a front end of the connecting portion. Each of the holes has a second length and a second width. The ratio of the second length to the first length is between 0.22 and 0.31, and the ratio of the second width to the first width is between 0.06 and 0.28.
    Type: Application
    Filed: October 23, 2019
    Publication date: July 2, 2020
    Inventors: SHU-JUNG CHEN, TZU-WEI WANG, HSIN-CHEN WANG, CHENG-YU CHANG
  • Patent number: 10700045
    Abstract: Package structures and methods of forming them are described. In an embodiment, a package structure includes an integrated circuit die embedded in an encapsulant and a redistribution structure on the encapsulant. The redistribution structure includes a metallization layer distal from the encapsulant and the integrated circuit die, and a dielectric layer distal from the encapsulant and the integrated circuit die and on the metallization layer. The package structure also includes a first under metallization structure on the dielectric layer and a Surface Mount Device and/or Integrated Passive Device (“SMD/IPD”) attached to the first under metallization structure. The first under metallization structure includes first through fourth extending portions extending through first through fourth openings of the dielectric layer to first through fourth patterns of the metallization layer, respectively.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: June 30, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu
  • Patent number: 10700151
    Abstract: An organic light-emitting diode display may have an array of pixels. The pixels may each have an organic light-emitting diode with a respective anode and may be formed from thin-film transistor circuitry formed on a substrate. A mesh-shaped path may be used to distribute a power supply voltage to the thin-film circuitry. The mesh-shaped path may have intersecting horizontally extending lines and vertically extending lines. The horizontally extending lines may be zigzag metal lines that do not overlap the anodes. The vertically extending lines may be straight vertical metal lines that overlap the anodes. The pixels may include pixels of different colors. Angularly dependent shifts in display color may be minimized by ensuring that the anodes of the differently colored pixels overlap the vertically extending lines by similar amounts.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: June 30, 2020
    Assignee: Apple Inc.
    Inventors: Warren S. Rieutort-Louis, Ting-Kuo Chang, Chieh-Wei Chen, Cheng-Ho Yu
  • Publication number: 20200203523
    Abstract: A semiconductor device includes: a fin-shaped structure on the substrate; a shallow trench isolation (STI) around the fin-shaped structure; a single diffusion break (SDB) structure in the fin-shaped structure for dividing the fin-shaped structure into a first portion and a second portion; a first gate structure on the fin-shaped structure; a second gate structure on the STI; and a third gate structure on the SDB structure, wherein a width of the third gate structure is greater than a width of the second gate structure.
    Type: Application
    Filed: January 21, 2019
    Publication date: June 25, 2020
    Inventors: Cheng-Han Wu, Hsin-Yu Chen, Chun-Hao Lin, Shou-Wei Hsieh, Chih-Ming Su, Yi-Ren Chen, Yuan-Ting Chuang