Abstract: A driving apparatus and an operation method thereof are provided. The driving apparatus includes a first driving circuit and a second driving circuit. The first driving circuit suspends performing at least one of a display driving operation and a touch sensing operation during a skip period under a driving mode, and the first driving circuit performs the at least one of the display driving operation and the touch sensing operation outside the skip period under the driving mode. The second driving circuit is coupled to the first driving circuit. The second driving circuit performs a fingerprint sensing operation during the skip period.

Abstract: A holder includes first and second support surfaces, first and second bases, pivotal first and second legs, and a folding linking assembly. Front ends of the first and second support surfaces are pivotably secured to front ends of the first and second base respectively; each of the first and second support surfaces include a transverse groove in a central portion, a recess below a bottom, a lengthwise trough in a rear portion of a top, and a limit member moveably disposed in the first trough; each of the first and second bases include parallel first slits on a rear portion of a top; each of the first and second legs have an upper end pivotably secured to the bottom of the first or second support surface; and the folding linking assembly is pivotably disposed between the front ends of the first and second support surfaces.

Abstract: An electronic device is provided. The electronic device includes a support substrate, a first substrate, a semiconductor element, and an adhesive layer. The first substrate is disposed on the support substrate. The semiconductor element is disposed on the first substrate. The adhesive layer is disposed between the support substrate and the first substrate. The adhesive layer includes a plurality of grooves. The electronic device provided by the disclosure is capable of improving the appearance flatness problem caused by air bubbles between the adhesive layer and other stacked layers through the grooves of the adhesive layer.

Abstract: A detection system for a vehicle comprises a blind spot detection module and a glasses module. The blind spot detection module comprises a first video recording device recording a vehicle surrounding image; a first identification device generating a blind spot identification result; a first determination device determining whether to transmit the vehicle surrounding image and/or a blind spot warning message; and a transmitting device transmitting the vehicle surrounding image and/or the blind spot warning message.

Abstract: The present invention discloses a method for pairing and interconnecting electronic devices, which cooperates with at least two electronic devices that are grouped as a transmitting end and a receiving end respectively, and the transmitting end operates in a first mode. The method for pairing and interconnecting electronic devices comprises at least Step 1 to Step 4. Step 1 refers to searching any available transmitting end in a wireless manner by the receiving end, and displaying a connection name of the transmitting end on the receiving end. Step 2 refers to prompting a dynamic operating instruction by the receiving end. Step 3 refers to executing operation by the transmitting end based on the dynamic operating instruction and thereby issuing an action instruction. Step 4 refers to receiving the action instruction by the receiving end, and establishing a connection with the transmitting end which issues the action instruction.

Abstract: A near field communication device and a method of determining the position of a tag are provided. The near field communication device includes a first coil, a second coil, and a control circuit. One end of the first coil is coupled to a first grounding end. One end of the second coil is coupled to a second grounding end. The control circuit includes a first current pin and a second current pin. The first current pin is coupled to the other end of the first coil. The second current pin is coupled to the other end of the second coil. The control circuit transmits a first current signal to the first coil by the first current pin, and transmits a second current signal to the second coil by the second current pin, the control circuit analyzes the change of the first current signal and the change of the second current signal to determine whether the position of a tag is close to the first coil or close to the second coil.

Abstract: An imaging system includes a scattering assembly with a scattering medium positioned a first distance from an object to be imaged. The scattering medium includes a plurality of particles suspended in a suspension medium and at least one field source generating an electromagnetic field to manipulate an orientation, concentration, spatial distribution, and/or other properties of the plurality of particles. The imaging system further includes a detector including a plurality of detector elements positioned a second distance from the scattering medium and an image processing system configured to reconstruct an image of the object from an object image signal detected by the detector using object light scattered by the scattering medium and incident on the detector.

Abstract: A semiconductor device and a method for manufacturing a semiconductor device are provided. The semiconductor device comprises a substrate, a conductive element disposed within a first region of the substrate, and a first transistor disposed within a second region adjacent to the first region of the substrate. The conductive element is electrically connected to an electrode of the first transistor, and the conductive element penetrates the substrate and is configured to receive a supply voltage.

Abstract: The present invention provides a method to establish cloned game accounts, when an auction information is posted on the game account trading platform, the game account trading platform will establish a testing game interface according to the game interface under the relevant game account, and generate a cloned game account based on the game objects, so that the buyer user primary account can enter this testing game interface to test the cloned game account.

Abstract: A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.

Abstract: The present invention is publish a method and system for game account valuation, through the establishment of a game account trading platform, provide different game accounts for valuation, acquisition and consignment, seller users can choose a suitable plan according to their personal needs, and through the management of the game account trading platform, increase the credibility and security of transaction information, and also can reduce the impact on the value of game data.

Abstract: In semiconductor manufacturing, deionized (DI) water or another process fluid is flowed through a nonmetallic pipe and onto a semiconductor wafer. Static electric charge is discharged from the DI water or other process fluid flowing through the nonmetallic pipe via an electrically conductive material disposed on an outside of the nonmetallic pipe. The electrically conductive material disposed on the outside of the nonmetallic pipe is electrically grounded. The nonmetallic pipe may comprise fluoropolymer (PFA) based tubing. In some embodiments, the nonmetallic pipe includes: a PFA-NE pipe connected with a chamber or housing containing the wafer, and a second pipe connected with the PFA-NE pipe by a pipe connector, in which the second pipe is more electrically insulating than the PFA-NE pipe.

Abstract: A method for manufacturing a light-emitting device, includes: forming a semiconductor stack on a substrate, wherein the semiconductor stack includes a first semiconductor layer, a second semiconductor layer and an active region formed therebetween; removing portions of the semiconductor stack to form a plurality of mesas and exposing a part of the first semiconductor layer, wherein the part of the first semiconductor layer includes a first portion and a second portion; forming a plurality of trenches by removing the first portion of the part of the first semiconductor to exposing a top surface of the substrate and a side wall of the first semiconductor, wherein the plurality of trenches defining a plurality of light-emitting units in the semiconductor stack; wherein in a top view, the plurality of trenches includes a first trench extending along a first direction and a second trench extending along a second direction not parallel with the first trench; and wherein the second trench includes an end; forming co

Abstract: A device includes a fin extending from a semiconductor substrate; a gate stack over the fin; a first spacer on a sidewall of the gate stack; a source/drain region in the fin adjacent the first spacer; an inter-layer dielectric layer (ILD) extending over the gate stack, the first spacer, and the source/drain region, the ILD having a first portion and a second portion, wherein the second portion of the ILD is closer to the gate stack than the first portion of the ILD; a contact plug extending through the ILD and contacting the source/drain region; a second spacer on a sidewall of the contact plug; and an air gap between the first spacer and the second spacer, wherein the first portion of the ILD extends across the air gap and physically contacts the second spacer, wherein the first portion of the ILD seals the air gap.

Abstract: An image sensor includes a semiconductor substrate, a first isolation structure, a visible light detection structure, and an infrared light detection structure. The semiconductor substrate has a first surface and a second surface opposite to the first surface in a vertical direction. The first isolation structure is disposed in the semiconductor substrate for defining pixel regions in the semiconductor substrate. The visible light detection structure and the infrared light detection structure are disposed within the same pixel region, and a first portion of the visible light detection structure is disposed between the second surface of the semiconductor substrate and the infrared light detection structure in the vertical direction.

Abstract: An integrated circuit (IC) device includes a substrate, and a cell over the substrate. The cell includes at least one active region and at least one gate region extending across the at least one active region. The cell further includes at least one input/output (IO) pattern configured to electrically couple one or more of the at least one active region and the at least one gate region to external circuitry outside the cell. The at least one IO pattern extends obliquely to both the at least one active region and the at least one gate region.

Abstract: Some embodiments relate to a CMOS image sensor disposed on a substrate. A plurality of pixel regions comprising a plurality of photodiodes, respectively, are configured to receive radiation that enters a back-side of the substrate. A boundary deep trench isolation (BDTI) structure is disposed at boundary regions of the pixel regions, and includes a first set of BDTI segments extending in a first direction and a second set of BDTI segments extending in a second direction perpendicular to the first direction to laterally surround the photodiode. The BDTI structure comprises a first material. A pixel deep trench isolation (PDTI) structure is disposed within the BDTI structure and overlies the photodiode. The PDTI structure comprises a second material that differs from the first material, and includes a first PDTI segment extending in the first direction such that the first PDTI segment is surrounded by the BDTI structure.

Abstract: Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary semiconductor device comprises a substrate, at least two gate structures disposed over the substrate, each of the at least two gate structures including a gate electrode and a spacer disposed along sidewalls of the gate electrode, wherein the spacer includes a refill portion and a bottom portion, the refill portion of the spacer has a funnel shape such that a top surface of the refill portion of the spacer is larger than a bottom surface of the refill portion of the spacer, and a source/drain contact disposed over the substrate and between the spacers of the at least two gate structures.

Abstract: A substrate structure, a method for manufacturing the same and a semiconductor device structure including the same are provided. The substrate structure includes a heat pipe, a first conductive layer and an insulation layer. The heat pipe has an upper surface and a lower surface. The heat pipe includes an opening extending from the upper surface to the lower surface. The first conductive layer is disposed on the upper surface and includes a via structure passing through the opening. The insulation layer is disposed between the heat pipe and the conductive layer.