Abstract: The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.50. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted biphenyl group.

Abstract: The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.50. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted biphenyl group.

Abstract: The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.50. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted carbazole group.

Abstract: A method for the manufacture of an adhesive id described, comprising: (A) Providing an initial reaction product of a solution polymerization reaction, the initial reaction product comprising polymer, unreacted polymerizable reactant, non-polymerizable material, and solvent; and (B) Purifying the initial reaction product by adding an oxidizing agent and a reducing agent to the initial reaction product and allowing the unreacted polymerizable reactant in the initial reaction product to further react, thereby providing a second reaction product comprising additional polymer and a lower level of unreacted polymerizable reactant than was present in the initial reaction product.

Abstract: Pressure-sensitive adhesives and adhesive tapes containing the pressure-sensitive adhesive are described. The pressure-sensitive adhesive contains a crosslinked acrylic copolymer plus inorganic particles that are dispersed or suspended in the crosslinked acrylic copolymer. The pressure-sensitive adhesive and adhesive tapes containing the pressure-sensitive adhesive can be removed after being adhered to a substrate by stretching.

Abstract: Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.

Abstract: The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.50. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted carbazole group.

Abstract: Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.

Abstract: The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.50. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted biphenyl group.

Abstract: The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.50. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted biphenyl group.

Abstract: A method for the manufacture of an adhesive id described, comprising: (A) Providing an initial reaction product of a solution polymerization reaction, the initial reaction product comprising polymer, unreacted polymerizable reactant, non-poly-merizable material, and solvent; and (B) Purifying the initial reaction product by adding an oxidizing agent and a reducing agent to the initial reaction product and allowing the unreacted polymerizable reactant in the initial reaction product to further react, thereby providing a second reaction product comprising additional polymer and a lower level of unreacted polymerizable reactant than was present in the initial reaction product.

Abstract: The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.48. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted aromatic moiety.

Abstract: The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.48. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted aromatic moiety.

Abstract: A transdermal drug delivery device involving a macromonomer-containing acrylate or methacrylate copolymer, a softener, and a drug. Also a pressure sensitive skin adhesive involving a macromonomer containing acrylate or methacrylate copolymer and a softener.

Abstract: The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.48. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted aromatic moiety.

Abstract: The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.48. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted aromatic moiety.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: A pressure sensitive adhesive tape that employs a water-dispersible polymer is provided. The adhesive can comprise microparticles and a water-dispersible component; or microparticles and a novel water-dispersible polymer that contains a plurality of poly(alkoxyalkyl)acrylate units as a major component. The tape may be used with labels for containers, sterilization indicator tapes and labels, surgical wrappers, mammalian body coverings, and in the preparation of paper web splices. The tape may be repulpable and/or laundearable.