Patents by Inventor Chi-Chih Shen
Chi-Chih Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230060584Abstract: There is provided an optical machine of a smoke detector including a substrate, a light source, a light sensor and a light blocking member. The light source and the light sensor are arranged on the substrate in a first direction. The light blocking member is arranged upon the light source and blocks a part of an emission angle of the light source in the first direction far away from the light sensor.Type: ApplicationFiled: April 15, 2022Publication date: March 2, 2023Inventors: Cheng-Nan TSAI, Yen-Chang CHU, Chih-Ming SUN, Chi-Chih SHEN, Kuo-Hsiung LI
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Publication number: 20230020236Abstract: An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.Type: ApplicationFiled: September 29, 2022Publication date: January 19, 2023Inventors: YI-CHANG CHANG, YEN-HSIN CHEN, CHI-CHIH SHEN
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Patent number: 11495697Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.Type: GrantFiled: December 7, 2020Date of Patent: November 8, 2022Assignee: PIXART IMAGING INC.Inventors: Yi-Chang Chang, Yen-Hsin Chen, Chi-Chih Shen
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Publication number: 20220157775Abstract: A package structure includes: 1) a circuit substrate; 2) a first semiconductor device disposed on the circuit substrate; 3) a first insulation layer covering a sidewall of the first semiconductor device; 4) a second insulation layer covering the first insulation layer; and 5) a third insulation layer disposed on the circuit substrate and in contact with the second insulation layer.Type: ApplicationFiled: January 11, 2022Publication date: May 19, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chi-Chih SHEN, Jen-Chuan CHEN, Tommy PAN
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Publication number: 20220140173Abstract: There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.Type: ApplicationFiled: October 29, 2020Publication date: May 5, 2022Inventors: Chi-Chih SHEN, Kuo-Hsiung LI, Shang-Feng HSIEH, Jui-Cheng CHUANG, Yi-Chang CHANG
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Patent number: 11222866Abstract: A package structure includes: 1) a circuit substrate; 2) a first semiconductor device disposed on the circuit substrate; 3) a first insulation layer covering a sidewall of the first semiconductor device; 4) a second insulation layer covering the first insulation layer; and 5) a third insulation layer disposed on the circuit substrate and in contact with the second insulation layer.Type: GrantFiled: June 12, 2017Date of Patent: January 11, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chi-Chih Shen, Jen-Chuan Chen, Tommy Pan
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Patent number: 11156796Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly includes a frame and a shielding element. The shielding element has a first light-permeable region disposed above at least a first subset of the pixels, the first subset is configured to receive corresponding light, and the first light-permeable region is transparent to the corresponding light. The shielding element includes an engaging structure formed thereon, and the shielding element is engaged with the frame by the engaging structure.Type: GrantFiled: December 3, 2019Date of Patent: October 26, 2021Assignee: PIXART IMAGING INC.Inventor: Chi-Chih Shen
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Patent number: 10964839Abstract: A manufacturing method of a sensor chip package structure is provided. In the manufacturing method, a wafer including a plurality of sensor chips is provided, and each sensor chip has an active region and defines a pre-thinned region thereon. Each pre-thinned region is located at one side of the active region and covers a boundary line of each sensor chip. The pre-thinned region of each sensor chip is etched to form a concave portion. A redistribution layer is formed on the wafer. Subsequently, the wafer is cut to separate the sensor chips from one another, and each separated sensor chip has a wiring layer extending from the active region along a sidewall surface to a bottom surface of the concave portion. The separated sensor chips are respectively mounted on a plurality of substrates, and the active region is electrically connected to the substrate through the wiring layer.Type: GrantFiled: April 22, 2020Date of Patent: March 30, 2021Assignee: PIXART IMAGING INC.Inventor: Chi-Chih Shen
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Publication number: 20210091238Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.Type: ApplicationFiled: December 7, 2020Publication date: March 25, 2021Inventors: YI-CHANG CHANG, YEN-HSIN CHEN, CHI-CHIH SHEN
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Patent number: 10896983Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.Type: GrantFiled: August 9, 2019Date of Patent: January 19, 2021Assignee: PIXART IMAGING INC.Inventors: Yi-Chang Chang, Yen-Hsin Chen, Chi-Chih Shen
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Publication number: 20200251606Abstract: A manufacturing method of a sensor chip package structure is provided. In the manufacturing method, a wafer including a plurality of sensor chips is provided, and each sensor chip has an active region and defines a pre-thinned region thereon. Each pre-thinned region is located at one side of the active region and covers a boundary line of each sensor chip. The pre-thinned region of each sensor chip is etched to form a concave portion. A redistribution layer is formed on the wafer. Subsequently, the wafer is cut to separate the sensor chips from one another, and each separated sensor chip has a wiring layer extending from the active region along a sidewall surface to a bottom surface of the concave portion. The separated sensor chips are respectively mounted on a plurality of substrates, and the active region is electrically connected to the substrate through the wiring layer.Type: ApplicationFiled: April 22, 2020Publication date: August 6, 2020Inventor: CHI-CHIH SHEN
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Patent number: 10672937Abstract: An optical sensor module and a sensor chip thereof are provided. The optical sensor module includes a substrate, a sensor chip and a passive chip. The sensor chip is disposed on the substrate, and the sensor chip includes a chip body having an active region located at a top side thereof and a recess portion depressed from a top surface of the chip body. The passive chip is accommodated in the recess portion, and a depth of the recess portion is greater than a thickness of the passive chip.Type: GrantFiled: July 11, 2017Date of Patent: June 2, 2020Assignee: PIXART IMAGING INC.Inventor: Chi-Chih Shen
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Publication number: 20200103613Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly includes a frame and a shielding element. The shielding element has a first light-permeable region disposed above at least a first subset of the pixels, the first subset is configured to receive corresponding light, and the first light-permeable region is transparent to the corresponding light. The shielding element includes an engaging structure formed thereon, and the shielding element is engaged with the frame by the engaging structure.Type: ApplicationFiled: December 3, 2019Publication date: April 2, 2020Inventor: CHI-CHIH SHEN
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Patent number: 10529759Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.Type: GrantFiled: May 13, 2019Date of Patent: January 7, 2020Assignee: PIXART IMAGING INC.Inventor: Chi-Chih Shen
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Patent number: 10527488Abstract: An optical detecting device has gas emission and pressure reduction function and includes a holder, a light penetrating component, a light detecting component, a hole structure, and a. The light penetrating component is disposed on the holder to form an accommodating space whereinside the light detecting component is disposed. The hole structure is formed on the holder to connect with the accommodating space. The waterproofing and ventilating component is disposed on the holder and covers the hole structure to prevent liquid from leaking into the accommodating space via the hole structure. While an inner gas pressure of the accommodating space is decreased, part of the gas is exhausted from the accommodating space via the hole structure and the waterproofing and ventilating component.Type: GrantFiled: June 5, 2016Date of Patent: January 7, 2020Assignee: PixArt Imaging Inc.Inventor: Chi-Chih Shen
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Publication number: 20190363199Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.Type: ApplicationFiled: August 9, 2019Publication date: November 28, 2019Inventors: YI-CHANG CHANG, YEN-HSIN CHEN, CHI-CHIH SHEN
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Patent number: 10439077Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.Type: GrantFiled: May 15, 2018Date of Patent: October 8, 2019Assignee: PIXART IMAGING INC.Inventors: Yi-Chang Chang, Yen-Hsin Chen, Chi-Chih Shen
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Publication number: 20190267419Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.Type: ApplicationFiled: May 13, 2019Publication date: August 29, 2019Inventor: CHI-CHIH SHEN
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Patent number: 10378952Abstract: An optical detecting device capable of preventing environmental pollution includes a casing, an optical detecting component and a transparent component. The casing includes a light through unit and at least one accommodating structure. The optical detecting component is disposed inside the accommodating structure. The transparent component is disposed inside the accommodating structure and located above the optical detecting component, to partly fill the accommodating structure at least and block between the light through unit and the optical detecting component.Type: GrantFiled: April 8, 2016Date of Patent: August 13, 2019Assignee: PixArt Imaging Inc.Inventors: Chi-Chih Shen, Hung-Ching Lai
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Patent number: 10340299Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.Type: GrantFiled: September 11, 2017Date of Patent: July 2, 2019Assignee: PIXART IMAGING INC.Inventors: Chi-Chih Shen, Kuo-Hsiung Li, Jui-Cheng Chuang