Abstract: A semiconductor device includes first and second active regions extending in parallel in a substrate, a plurality of conductive patterns, each conductive pattern of the plurality of conductive patterns extending on the substrate across each of the first and second active regions, and a plurality of metal lines, each metal line of the plurality of metal lines overlying and extending across each of the first and second active regions. Each conductive pattern of the plurality of conductive patterns is electrically connected in parallel with each metal line of the plurality of metal lines.

Abstract: Briefly, embodiments, such as methods, systems and/or circuits for controlling a power signal to be supplied to a processing device. In one aspect, a magnitude of a power supplied to a processing device may be changed based, at least in part on an estimated and/or predicted load.

Abstract: Various implementations described herein are related to a device having a power stage that provides an output signal and a first feedback signal based on an input signal and a control signal. The device may have a digital stage with digital circuitry that provides a second feedback signal based on operational activity of the digital circuitry using the output signal. The device may have a control stage that provides the control signal based on the input signal, the first feedback signal and the second feedback signal.

Abstract: A substrate and a substrate bonding device using the same are provided. The substrate includes a base, upper and lower metal layers, and upper and lower covering layers. The base has an upper surface, a lower surface and a through-hole passing there through, wherein the upper and lower covering layers respectively covers the upper and lower metal layers respectively disposed on the upper and lower surfaces of the base. The lower metal layer has an electrical bonding portion and a strengthening bonding portion insulated with each other. The strengthening bonding portion enhances the bonding strength between the substrate and another substrate. The upper metal layer is electrically connected to the electrical bonding portion via the through hole. The lower covering layer exposes the electrical bonding portion and the strengthening bonding portion so as to be respectively connected with two bonding portions of the another substrate.

Abstract: A liquid crystal display device includes a light guide plate, a light source module, a first tape, a circuit board holder and an elastic support piece, an optical film, a panel, and an elastic buffer piece. By implement of the liquid crystal display device of this invention, the thickness and the weight of the liquid crystal display device can be reduced.

Abstract: A liquid crystal display device includes a light guide plate, a light source module, a first tape, a circuit board holder and an elastic support piece, an optical film, a panel, and an elastic buffer piece. By implement of the liquid crystal display device of this invention, the thickness and the weight of the liquid crystal display device can be reduced.

Abstract: A substrate and a substrate bonding device using the same are provided. The substrate includes a base, upper and lower metal layers, and upper and lower covering layers. The base has an upper surface, a lower surface and a through-hole passing there through, wherein the upper and lower covering layers respectively covers the upper and lower metal layers respectively disposed on the upper and lower surfaces of the base. The lower metal layer has an electrical bonding portion and a strengthening bonding portion insulated with each other. The strengthening bonding portion enhances the bonding strength between the substrate and another substrate. The upper metal layer is electrically connected to the electrical bonding portion via the through hole. The lower covering layer exposes the electrical bonding portion and the strengthening bonding portion so as to be respectively connected with two bonding portions of the another substrate.