Patents by Inventor Chi Hung Cheng

Chi Hung Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10714279
    Abstract: A keyboard device includes a substrate and several keycaps disposed on the substrate. The substrate includes a long slit and an elastic bridge connecting member. The long slit divides the substrate into a first plate having a first side edge and a second plate having a second side edge opposite to the first side edge. A gap is between the first side edge and the second side edge. The elastic bridge connecting member is connected between the first side edge and the second side edge. The first plate is movable relative to the second plate. The first side edge includes a first stopping member, the second side edge includes a second stopping member, and a certain interval is between the first stopping member and the second stopping member.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: July 14, 2020
    Assignee: CHICONY ELECTRONICS CO., LTD.
    Inventors: Mitsuo Horiuchi, Chia-Hsin Chen, Chi-Hung Cheng
  • Publication number: 20200197987
    Abstract: Embodiments of the present disclosure relate to apparatus and methods for cleaning an exhaust path of a semiconductor process tool. One embodiment provides an exhaust pipe section and a pipe cleaning assembly connected between a semiconductor process tool and a factory exhaust. The pipe cleaning assembly includes a residue remover disposed in the exhaust pipe section. The residue remover is operable to move in the exhaust pipe section to dislodge accumulated materials from an inner surface of the exhaust pipe section.
    Type: Application
    Filed: February 27, 2020
    Publication date: June 25, 2020
    Inventors: Wei Chang CHENG, Cheng-Kuang CHEN, Chi-Hung LIAO
  • Patent number: 10678133
    Abstract: A method for forming a photoresist layer includes the following steps. A first photoresist layer is formed on a first wafer provided on a platen. The platen includes a plurality of temperature zones being at a first set of process temperatures. A first etching process is performed on the first wafer to form a first patterned metal layer. A profile variation of the first patterned metal layer with respect to a reference profile is determined. The first set of process temperatures is adjusted to a second set of process temperatures according to the profile variation. A second photoresist layer is formed on a second wafer provided on the platen with the temperature zones being at the second set of process temperatures respectively.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: June 9, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Hung Liao, Wei-Chang Cheng
  • Patent number: 10677773
    Abstract: A device includes a main body and at least one actuating and sensing module. A length of the main body is 35˜55 mm. A width of the main body is 25˜30 mm. A height of the main body is 9˜13 mm. The actuating and sensing module is disposed in the main body. The actuating and sensing module includes a carrier, at least one sensor, at least one actuating device, a driving and transmitting controller and a battery. The sensor, the actuating device, the driving and transmitting controller and the battery are disposed on the carrier. The actuating device is disposed on one side of the sensor. The actuating device includes at least one guiding channel. The actuating device is enabled to transport fluid to flow toward the sensor through the guiding channel so as to make the fluid measured by the sensor.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: June 9, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Ching-Sung Lin, Shih-Hung Cheng, Chi-Feng Huang, Yung-Lung Han, Hsuan-Kai Chen
  • Publication number: 20200177909
    Abstract: A motion vector (MV) projection method includes generating motion field motion vectors (MFMVs) for a first portion of a current frame by applying MV projection to MVs of a portion of each of reference frames and storing the MFMVs of the first portion of the current frame into an MFMV buffer, and generating MFMVs for a second portion of the current frame by applying MV projection to MVs of a portion of each of the reference frames and storing the MFMVs of the second portion of the current frame into the MFMV buffer. The second portion does not overlap the first portion. Before generating the MFMVs for the second portion of the current frame is done, at least one of the MFMVs of the first portion is read from the MFMV buffer and involved in motion vector determination of at least one coding block included in the first portion.
    Type: Application
    Filed: November 26, 2019
    Publication date: June 4, 2020
    Inventors: Yung-Chang Chang, Chia-Yun Cheng, Cheng-Han Li, Hong-Cheng Lin, Chi-Hung Chen
  • Patent number: 10670540
    Abstract: A photolithography method includes dispensing a first liquid onto a first target layer formed over a first wafer through a nozzle at a first distance from the first target layer; capturing an image of the first liquid on the first target layer; patterning the first target layer after capturing the image of the first liquid; comparing the captured image of the first liquid to a first reference image to generate a first comparison result; responsive to the first comparison result, positioning the nozzle and a second wafer such that the nozzle is at a second distance from a second target layer on the second wafer; dispensing a second liquid onto the second target layer formed over the second wafer through the nozzle at the second distance from the second target layer; and patterning the second target layer after dispensing the second liquid.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 2, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Hung Liao, Wei Chang Cheng
  • Patent number: 10648061
    Abstract: Producing high purity lithium solution from a lithium source containing dissolved Na+, Ca2+, and Mg2+, by: passing the source into and out of a bed of sorbent composed of hydrated alumina intercalated with LiX, preferably LiCl, to extract lithium from the lithium source into the sorbent; washing the bed of sorbent with dilute aqueous LiCl to remove lithium from the sorbent to obtain a lithium eluent of increased Li+ concentration; subjecting this eluent to nanofiltration to produce a lithium permeate from which Ca2+, Mg2+, and other nanofilterable components are concurrently removed, yielding a permeate solution with 25% or less, and a retentate solution with 75% or more Ca2+ and Mg2+, as compared to the eluent from washing; and subjecting the permeate solution to a particular forward osmosis yielding a solution having 13,000-25,000 ppm dissolved lithium. Specified optional steps and new features can be used to increase lithium concentrations and purity.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: May 12, 2020
    Assignee: ALBEMARLE CORPORATION
    Inventors: Chi Hung Cheng, Jackson R. Switzer, Jan Nieman
  • Publication number: 20200145658
    Abstract: A post processing apparatus includes a super-resolution (SR) filtering circuit and a loop restoration (LR) filtering circuit. The SR filtering circuit applies SR filtering to a processing result of a preceding circuit. The LR filtering circuit applies LR filtering to a processing result of the SR filtering circuit. Before the SR filtering circuit finishes SR filtering of all pixels of a frame that are generated by the preceding circuit, the LR filtering circuit starts LR filtering of pixels that are derived from applying SR filtering to pixels included in the frame.
    Type: Application
    Filed: October 28, 2019
    Publication date: May 7, 2020
    Inventors: Yung-Chang Chang, Chih-Ming Wang, Chia-Yun Cheng, Chi-Hung Chen, Kai-Chun Lin, Chih-Wen Yang, Hsuan-Wen Peng
  • Publication number: 20200134124
    Abstract: A method (of generating a layout diagram) includes generating a cell, representing at least part of a circuit in a semiconductor device, which is arranged at least in part according to second tracks of the M_2nd level (M_2nd tracks), and first tracks of the M_1st level (M_1st tracks). The generating the cell includes: selecting, based on a chosen site for the cell in the layout diagram, one of the M_2nd tracks; generating a first M_2nd pin pattern representing an output pin of the circuit; arranging a long axis of the first pin pattern substantially along the selected M_2nd track; generating second, third, fourth and fifth M_1st pin patterns representing corresponding input pins of the circuit; and arranging long axes of the second to fifth pin patterns substantially along corresponding ones of the M_1st tracks.
    Type: Application
    Filed: October 21, 2019
    Publication date: April 30, 2020
    Inventors: Pin-Dai SUE, Chin-Chou LIU, Sheng-Hsiung CHEN, Fong-Yuan CHANG, Lee-Chung LU, Yen-Hung LIN, Li-Chun TIEN, Po-Hsiang HUANG, Yi-Kan CHENG, Chi-Yu LU
  • Publication number: 20200117090
    Abstract: A method for forming a photoresist layer includes the following steps. A first photoresist layer is formed on a first wafer provided on a platen. The platen includes a plurality of temperature zones being at a first set of process temperatures. A first etching process is performed on the first wafer to form a first patterned metal layer. A profile variation of the first patterned metal layer with respect to a reference profile is determined. The first set of process temperatures is adjusted to a second set of process temperatures according to the profile variation. A second photoresist layer is formed on a second wafer provided on the platen with the temperature zones being at the second set of process temperatures respectively.
    Type: Application
    Filed: December 16, 2019
    Publication date: April 16, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Hung Liao, Wei-Chang Cheng
  • Patent number: 10618085
    Abstract: Embodiments of the present disclosure relate to apparatus and methods for cleaning an exhaust path of a semiconductor process tool. One embodiment provides an exhaust pipe section and a pipe cleaning assembly connected between a semiconductor process tool and a factory exhaust. The pipe cleaning assembly includes a residue remover disposed in the exhaust pipe section. The residue remover is operable to move in the exhaust pipe section to dislodge accumulated materials from an inner surface of the exhaust pipe section.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: April 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei Chang Cheng, Cheng-Kuang Chen, Chi-Hung Liao
  • Publication number: 20200080463
    Abstract: A vortex generator including an annular bearing for mounting on an interior surface of an exhaust line. The vortex generator further includes an annular blade assembly mounted on the annular bearing. The annular blade assembly includes a leading face with an upstream opening having a first radius. The annular blade assembly further includes a trailing face with a downstream opening having a second radius, wherein the upstream opening and the downstream opening are centered around a longitudinal axis of the exhaust line, and the second radius is different from the first radius. The annular blade assembly further includes a side extending from the leading face to the trailing face, wherein the side has a plurality of openings, each opening of the plurality of openings containing a blade, and each opening of the plurality of openings extends beyond the annular bearing in a direction parallel to the longitudinal axis.
    Type: Application
    Filed: November 11, 2019
    Publication date: March 12, 2020
    Inventors: Wei Chang CHENG, Ping-Hsu CHEN, Chi-Hung LIAO, T. S. LO, Yung-Yao LEE
  • Publication number: 20200061559
    Abstract: A method includes mixing a first deionized water (DI) water from a first pipe and a second DI water from a second pipe in a merging pipe that is in fluid communication with the first pipe and the second pipe. An electrical resistivity of the first DI water is different from an electrical resistivity of the second DI water. A mixture of the first DI water and the second DI water is applied from the merging pipe onto a wafer.
    Type: Application
    Filed: November 4, 2019
    Publication date: February 27, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Hung LIAO, Wei-Chang CHENG, Chien-Hung WANG
  • Publication number: 20200058123
    Abstract: The present invention seeks to provide a method of analyzing medical image, the method comprises receiving a medical image; applying a model stored in a memory; analyzing the medical image based on the model; determining the medical image including a presence of fracture; and, transmitting an indication indicative of the determination.
    Type: Application
    Filed: August 19, 2019
    Publication date: February 20, 2020
    Inventors: Chien-Hung Liao, Chi-Tung Cheng, Tsung-Ying Ho, Tao-Yi Lee, Ching-Cheng Chou
  • Publication number: 20200055160
    Abstract: A chemical mechanical polishing method includes holding a wafer in a carrier over a polishing pad, dispensing a first slurry comprising a plurality of first abrasive particles into the carrier, rotating at least one of the carrier and the polishing pad, halting the dispensing of the first slurry, and dispensing a second slurry into the carrier after halting the dispensing of the first slurry, wherein the second slurry comprises a plurality of second abrasive particles smaller than the first abrasive particles.
    Type: Application
    Filed: December 5, 2018
    Publication date: February 20, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chang CHENG, Chi-Hung LIAO
  • Publication number: 20200057367
    Abstract: A method for cleaning a reticle includes rotating the reticle, providing a cleaning liquid to clean the reticle, detecting a static charge value on the reticle during rotating the reticle, and reducing static charges on the reticle in response to the detected static charge value. Hence, the electrostatic discharge (ESD) occurred to the reticle can be prevented.
    Type: Application
    Filed: October 26, 2018
    Publication date: February 20, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chang CHENG, Chi-Hung LIAO
  • Publication number: 20200050462
    Abstract: A controlling device and a drone controlling method are provided. The method includes: detecting a first program block that is towed in a human machine interface; bonding the first program block to a bonding position corresponding to at least one target program block in the human machine interface to obtain a first program block sequence composed of a plurality of second program blocks; and transmitting a plurality of control commands respectively corresponding to the plurality of second program blocks or controlling a virtual drone to execute the plurality of control commands according to a sequence order of the plurality of second program blocks in the first program block sequence.
    Type: Application
    Filed: August 8, 2019
    Publication date: February 13, 2020
    Applicant: Wistron Corporation
    Inventors: Kuan-Hung Chen, Chia-Yin Li, Chi-Tung Wang, Hong-Ting Cheng, Chih-Ming Chang, Yen-Hung Chen
  • Publication number: 20200003701
    Abstract: A photolithography method includes dispensing a first liquid onto a first target layer formed over a first wafer through a nozzle at a first distance from the first target layer; capturing an image of the first liquid on the first target layer; patterning the first target layer after capturing the image of the first liquid; comparing the captured image of the first liquid to a first reference image to generate a first comparison result; responsive to the first comparison result, positioning the nozzle and a second wafer such that the nozzle is at a second distance from a second target layer on the second wafer; dispensing a second liquid onto the second target layer formed over the second wafer through the nozzle at the second distance from the second target layer; and patterning the second target layer after dispensing the second liquid.
    Type: Application
    Filed: December 19, 2018
    Publication date: January 2, 2020
    Inventors: Chi-Hung Liao, Wei Chang Cheng
  • Publication number: 20200004153
    Abstract: An apparatus for dispensing fluid includes a fluid source; a nozzle having an inner layer and an outer layer, the inner layer defining a bore in fluid communication with the fluid source; and a plurality of pins each moveable to be in physical contact with the outer layer, wherein the plurality of pins is operable to apply a force towards the outer layer to adjust a cross-section of the bore.
    Type: Application
    Filed: September 7, 2018
    Publication date: January 2, 2020
    Inventors: Wei Chang Cheng, Chi-Hung Liao
  • Patent number: 10509321
    Abstract: A temperature controlling apparatus includes a platen, a fluid source, a chiller, a first conduit and a second conduit. The fluid source supplies a fluid. The chiller is coupled to the fluid source to cool the fluid in the fluid source to a cooling temperature. The first conduit includes a first inlet in communication with the fluid source, a first outlet and a first heater that heats the fluid from the cooling temperature to a first heating temperature. The fluid heated by the first heater is dispensed on the platen through the first outlet. The second conduit includes a second inlet in communication with the fluid source, a second outlet and a second heater that heats the fluid from the cooling temperature to a second heating temperature different from the first heating temperature. The fluid heated by the second heater is dispensed on the platen through the second outlet.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Hung Liao, Wei-Chang Cheng