Patents by Inventor Chi-hyun In

Chi-hyun In has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220377875
    Abstract: According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.
    Type: Application
    Filed: August 5, 2022
    Publication date: November 24, 2022
    Inventors: Chung-Hyo JUNG, Kang-Sik KIM, Young-San KIM, Won-Min KIM, Chi-Hyun CHO
  • Publication number: 20220367818
    Abstract: Provided are an organic electric element having a first electrode, a second electrode, and at least an organic material layer formed between the first electrode and the second electrode, the organic material layer comprising an emitting layer and the emitting layer comprising a mixture of host materials which improves luminous efficiency, stability, and lifespan of the element; and an organic electronic device comprising the element.
    Type: Application
    Filed: June 9, 2021
    Publication date: November 17, 2022
    Applicant: DUK SAN NEOLUX CO., LTD.
    Inventors: Soung Yun MUN, Sun Hee LEE, Jong Gwang PARK, Ki Ho SO, Won Sam KIM, Jung Hwan PARK, Chi Hyun PARK, Mi Young CHAE
  • Patent number: 11487323
    Abstract: Disclosed is an electronic device. The electronic device according to an embodiment may include an ultrasonic sensor and a processor electrically connected to the ultrasonic sensor. The processor may be configured to obtain a noise signal at a periphery of the electronic device, via the ultrasonic sensor, to determine an attribute of a first ultrasonic signal oscillated by the ultrasonic sensor, based on the obtained noise signal, and to obtain fingerprint information based on the second ultrasonic signal obtained via the ultrasonic sensor and the determined attribute. Moreover, various embodiment found through the disclosure are possible.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: November 1, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung Geol Baek, Moon Soo Kim, Jae Hyung Park, Chi Hyun Cho, Yun Jang Jin, Ho Chul Hwang
  • Patent number: 11489087
    Abstract: A light emitting device including a substrate, a first semiconductor layer disposed on the substrate, a mesa including a second semiconductor layer and an active layer disposed on the first semiconductor layer, a first contact electrode contacting the first semiconductor layer, a second contact electrode contacting the second semiconductor layer, a passivation layer covering the first contact electrode, the mesa, and the second contact electrode, and including a first opening disposed on the first contact electrode and a second opening disposed on the second contact electrode, and first and second bump electrodes electrically connected to the first and second contact electrodes through the first and second openings, respectively, in which the first and second bump electrodes are disposed on the mesa, the passivation layer is disposed between the first bump electrode and the second contact electrode, and the first contact electrode includes an alloy layer.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: November 1, 2022
    Assignee: Seoul Viosys Co. Ltd.
    Inventors: Seong Kyu Jang, Hong Suk Cho, Kyu Ho Lee, Chi Hyun In
  • Publication number: 20220298130
    Abstract: Embodiments of the present invention relate to an organic electronic device capable of ensuring high luminous efficiency, low driving voltage and high heat resistance, and improving color purity or lifespan.
    Type: Application
    Filed: July 30, 2020
    Publication date: September 22, 2022
    Inventors: Soung Yun MUN, Min Ji JO, Chi Hyun PARK, Yong Wook PARK, Sun Hee LEE
  • Patent number: 11445637
    Abstract: According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: September 13, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chung-Hyo Jung, Kang-Sik Kim, Young-San Kim, Won-Min Kim, Chi-Hyun Cho
  • Publication number: 20220281791
    Abstract: Provided is a method of decomposing phenol-based by-product, and more particularly, a method of decomposing phenol-based by-product including: introducing a phenol-based by-product stream, a first stream of a side discharge stream from a decomposition device, and a process water stream to a mixing device and mixing the streams; introducing a discharge stream from the mixing device to a layer separation device to phase-separate the discharge stream into an oil phase and an aqueous phase; passing an oil stream discharged from the layer separation device through any one or more of a first heat exchanger and a second heat exchanger and introducing the oil stream to the decomposition device to carry out decomposition; and supplying the first stream of the side discharge stream from the decomposition device to the mixing device, forming a mixed stream of a second stream of the side discharge stream with a lower discharge stream and discharging the mixed stream, and recovering effective components from an upper disc
    Type: Application
    Filed: May 31, 2021
    Publication date: September 8, 2022
    Inventors: Min Suk KANG, Sang Beom LEE, Chi Hyun JANG
  • Publication number: 20220259125
    Abstract: Provided is a method of decomposing phenolic by-products, and more particularly, a method of decomposing phenolic by-products including: supplying a phenolic by-product stream to a decomposition device to perform thermal decomposition; separating an upper discharge stream including effective components and a lower discharge stream including materials having a high boiling point in the decomposition device; supplying the lower discharge stream from the decomposition device, a side discharge stream from the decomposition device, and a process water stream to a mixing device and mixing these streams; and supplying a discharge stream from the mixing device to a layer separation device to separate the discharge stream from the mixing device into an oil phase and an aqueous phase.
    Type: Application
    Filed: June 15, 2021
    Publication date: August 18, 2022
    Inventors: Min Suk KANG, Sang Beom LEE, Ji Hyang SON, Chi Hyun JANG
  • Patent number: 11414364
    Abstract: The present disclosure provides a method for decomposing a phenolic by-product, the method including: a step S10 of feeding a phenolic by-product stream to a decomposition apparatus and thermally cracking the phenolic by-product stream; a step S20 of recovering an active ingredient from a top discharge stream of the decomposition apparatus and discharging a substance having a high boiling point through a bottom discharge stream of the decomposition apparatus; a step S30 of passing a part of the bottom discharge stream of the decomposition apparatus through a reboiler and then feeding the part of the bottom discharge stream of the decomposition apparatus to the decomposition apparatus and discharging a residual stream of the bottom discharge stream of the decomposition apparatus; and a step S40 of feeding a side discharge stream of the decomposition apparatus to the reboiler.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: August 16, 2022
    Assignee: LG Chern, Ltd.
    Inventors: Min Suk Kang, Sang Beom Lee, Chi Hyun Jang
  • Publication number: 20220251012
    Abstract: The present disclosure relates to a method of decomposing a phenolic by-product, including: a step of feeding and thermally cracking a phenolic by-product stream to and in a decomposition apparatus, recovering an active ingredient from a top discharge stream, and discharging a high-boiling substance through a bottom discharge stream; a step of pressurizing each of a side discharge stream of the decomposition apparatus and a bottom discharge stream of the decomposition apparatus; a step of mixing the pressurized side discharge stream of the decomposition apparatus and the pressurized bottom discharge stream of the decomposition apparatus with each other to form a mixed stream; and a step of passing a part of the mixed stream through a reboiler, circulating the part of the mixed stream to the decomposition apparatus, and discharging a residual mixed stream.
    Type: Application
    Filed: November 23, 2020
    Publication date: August 11, 2022
    Inventors: Min Suk KANG, Sang Beom LEE, Chi Hyun JANG
  • Patent number: 11299452
    Abstract: Provided are an organic electric element comprising as a phosphorescent host material, a mixture of the compounds of Formula (1) and Formula (2), and an organic electronic device or apparatus thereof for achieving a high luminous efficiency, a low driving voltage, and an improved lifespan.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: April 12, 2022
    Assignee: Duk San Neolux Co., Ltd.
    Inventors: Mun Jae Lee, Soung Yun Mun, Jae Taek Kwon, Dae Sung Kim, Moo Jin Park, Chi Hyun Park, Sun Hee Lee, Hyun Ju Song, Bum Sung Lee
  • Publication number: 20220106241
    Abstract: The present disclosure provides a method for decomposing a phenolic by-product, the method including: a step S10 of feeding a phenolic by-product stream to a decomposition apparatus and thermally cracking the phenolic by-product stream; a step S20 of recovering an active ingredient from a top discharge stream of the decomposition apparatus and discharging a substance having a high boiling point through a bottom discharge stream of the decomposition apparatus; a step S30 of passing a part of the bottom discharge stream of the decomposition apparatus through a reboiler and then feeding the part of the bottom discharge stream of the decomposition apparatus to the decomposition apparatus and discharging a residual stream of the bottom discharge stream of the decomposition apparatus; and a step S40 of feeding a side discharge stream of the decomposition apparatus to the reboiler.
    Type: Application
    Filed: August 11, 2020
    Publication date: April 7, 2022
    Inventors: Min Suk KANG, Sang Beom LEE, Chi Hyun JANG
  • Patent number: 11275458
    Abstract: There is provided a device that includes: a display; at least one sensor disposed to be adjacent to the display; a biometric sensor disposed in at least a partial region of the display; and at least one processor, wherein the at least one processor can be set up to receive an input in the at least a partial region from an external object, by using the at least one sensor or the biometric sensor, and to obtain biometrics of the external object by using the biometric sensor on the basis, at least partially, of the input by the external object.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: March 15, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kem-Suk Seo, Bong-Jae Rhee, Sun-A Kim, Jeong-Hoo Kim, Chi-Hyun Cho
  • Publication number: 20220064100
    Abstract: Provided are an organic electric element comprising as a phosphorescent host material, a mixture of the compounds of Formula (1) and Formula (2), and an organic electronic device or apparatus thereof for achieving a high luminous efficiency, a low driving voltage, and an improved lifespan.
    Type: Application
    Filed: November 12, 2021
    Publication date: March 3, 2022
    Applicant: DUK SAN NEOLUX CO., LTD.
    Inventors: Mun Jae LEE, Soung Yun MUN, Jae Taek KWON, Dae Sung KIM, Moo Jin PARK, Chi Hyun PARK, Sun Hee LEE, Hyun Ju SONG, Bum Sung LEE
  • Patent number: 11216636
    Abstract: An electronic device is disclosed. According to an embodiment, an electronic device may comprise: a transparent member; a display panel that is disposed beneath the transparent member and comprises multiple pixels and at least one transmission area which is formed between the multiple pixels and through which light can pass; a biometric sensor which is disposed beneath the display panel and can acquire light that has been output through at least some of the multiple pixels, has been reflected by an external object near or in contact with the transparent member, and then has passed through the at least one transmission area; and a light path changing member disposed between the biometric sensor and the display panel and spaced a predetermined distance apart from the biometric sensor, the light path changing member being able to change an optical path with respect to at least a part of the light having passed through the at least one transmission area.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: January 4, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung Hoon Song, Jeong Hoo Kim, Sun A Kim, Kwang Sub Lee, Se Young Jang, Chi Hyun Cho
  • Patent number: 11178799
    Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: November 16, 2021
    Inventors: Hae-Jin Lee, Oh-Hyuck Kwon, Min Park, Jung-Je Bang, Jae-Deok Lim, Kyung-Ha Koo, Jae-Heung Ye, Chang-Tae Kim, Chi-Hyun Cho
  • Publication number: 20210341229
    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
    Type: Application
    Filed: July 14, 2021
    Publication date: November 4, 2021
    Inventors: Haejin LEE, Kyungha KOO, Chunghyo JUNG, Se-Young JANG, Jungje BANG, Jaeheung YE, Chi-Hyun CHO
  • Patent number: 11128038
    Abstract: Disclosed is an electronic device. According to an embodiment, the electronic device includes a housing that covers at least a portion of a back surface of the electronic device, a plurality of slits being formed in parallel from one end to an opposite end and the at least a portion of the housing being formed of a conductive material, a feeder that is electrically connected with at least one point of the housing, and a ground part that is electrically connected with at least one point of the housing. A part of the plurality of slits includes a section greater in width than another part of the plurality of slits. Moreover, various embodiment found through the disclosure are possible.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: September 21, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyi Hyun Jang, Kyung Kyun Kang, Ji Ho Kim, Gyu Bok Park, Kyung Moon Seol, Hyun Jeong Lee, So Young Lee, Chang Ho Lee, Chi Hyun Cho, Jae Bong Chun
  • Patent number: 11113504
    Abstract: Disclosed is an electronic device including a transparent member, a display, wherein at least part of the display is disposed under the transparent member, wherein the display includes an active area, in which a plurality of pixels capable of outputting light to display contents, a biometric sensor, wherein at least part of the biometric sensor is disposed in a first area outside the active area, and a reflector positioned to direct light reflected by an external object in contact with at least a partial area of the transparent member to the biometric sensor through at least a portion of the transparent member, wherein at least some of the plurality of pixels are positioned to irradiate the external object, thereby resulting in the light reflected by the external object.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: September 7, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yun Jang Jin, Jeong Hoo Kim, Kyung Hoon Song, Bong Jae Rhee, Se Young Jang, Chi Hyun Cho
  • Patent number: 11098959
    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: August 24, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Haejin Lee, Kyungha Koo, Chunghyo Jung, Se-Young Jang, Jungje Bang, Jaeheung Ye, Chi-Hyun Cho