Patents by Inventor Chi Keung Alex Chan

Chi Keung Alex Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180005999
    Abstract: Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.
    Type: Application
    Filed: June 13, 2017
    Publication date: January 4, 2018
    Inventors: Chak Hau Charles Pang, Chi Keung Alex Chan, David Emerson, Yue Kwong Victor Lau, Zhenyu Zhong
  • Patent number: 9711489
    Abstract: Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: July 18, 2017
    Assignee: CREE HUIZHOU SOLID STATE LIGHTING COMPANY LIMITED
    Inventors: Chak Hau Charles Pang, Chi Keung Alex Chan, David Emerson, Yue Kwong Victor Lau, Zhenyu Zhong
  • Publication number: 20170009971
    Abstract: Emitter panels and displays utilizing solid state packages and methods for fabricating the same are disclosed. One emitter panel comprises a raised barrier on a submount defining a plurality of cavities, each cavity having at least one LED in a pixel area. The panel is capable of receiving electrical signals for independently controlling the emission from the emitters. Solid state displays utilize the emitter panels mounted in relation to one another to generate a message or image. The panels comprise multiple pixels each having at least one light emitter, with each panel capable of receiving electrical signals for independently controlling the emission of at the pixels.
    Type: Application
    Filed: February 8, 2014
    Publication date: January 12, 2017
    Applicant: CREE HUIZHOU SOLID STATE LIGHTING COMAPNY LIMITED
    Inventors: Chi Keung Alex CHAN, Zhenyu ZHONG, Chak Hau Charies PANG, Yue Kwong Victor LAU, Erzhuang LIU
  • Publication number: 20140367712
    Abstract: A side view surface mount light emitting device is disclosed. The light emitting device comprises a side oriented package comprising a floor and a plurality of light emitting diodes (LEDs) mounted on the floor. The device further includes a plurality of contact pins in electrical contact, such that the plurality of contact pins protrude from a side of the package, in which at least one of the contact pins is oriented in a direction opposite the remaining contact pins. The LEDs of the device are disposed to emit light in a direction parallel to said mount surface. Some configurations also include a plurality of bond pads, on or a part of the floor, to facilitate electrical connection between the LEDs and the contact pins, in which adjacent bond pads have a tapered shape such that the widest portion of a first bond pad is adjacent to the narrowest portion of a second bond pad. Displays including such devices are also disclosed.
    Type: Application
    Filed: June 11, 2014
    Publication date: December 18, 2014
    Inventors: CHI KEUNG ALEX CHAN, YUE KWONG VICTOR LAU, CHAK HAU CHARLES PANG, ZHENYU ZHONG
  • Publication number: 20140353694
    Abstract: Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.
    Type: Application
    Filed: May 29, 2013
    Publication date: December 4, 2014
    Inventors: Chak Hau Charles Pang, Chi Keung Alex Chan, David Emerson, Yue Kwong Victor Lau, Zhanyu Zhong
  • Patent number: 8368112
    Abstract: A multiple element emitter package is disclosed for increasing color fidelity and heat dissipation, improving current control, increasing rigidity of the package assembly. In one embodiment, the package comprises a surface-mount device a casing with a cavity extending into the interior of the casing from a first main surface is provided. A lead frame is at least partially encased by the casing, the lead frame comprising a plurality of electrically conductive parts carrying a linear array of light emitting devices (LEDs). Electrically conductive parts, separate from parts carrying the LEDs have a connection pad, wherein the LEDs are electrically coupled to a connection pad, such as by a wire bond. This lead frame arrangement allows for a respective electrical signal can be applied to each of the LEDs. The emitter package may be substantially waterproof, and an array of the emitter packages may be used in an LED display such as an indoor and/or outdoor LED screen.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: February 5, 2013
    Assignee: Cree Huizhou Opto Limited
    Inventors: Chi Keung Alex Chan, Yue Kwong Victor Lau, Xuan Wang, David Emerson
  • Publication number: 20100155748
    Abstract: A multiple element emitter package is disclosed for increasing color fidelity and heat dissipation, improving current control, increasing rigidity of the package assembly. In one embodiment, the package comprises a surface-mount device a casing with a cavity extending into the interior of the casing from a first main surface is provided. A lead frame is at least partially encased by the casing, the lead frame comprising a plurality of electrically conductive parts carrying a linear array of light emitting devices (LEDs). Electrically conductive parts, separate from parts carrying the LEDs have a connection pad, wherein the LEDs are electrically coupled to a connection pad, such as by a wire bond. This lead frame arrangement allows for a respective electrical signal can be applied to each of the LEDs. The emitter package may be substantially waterproof, and an array of the emitter packages may be used in an LED display such as an indoor and/or outdoor LED screen.
    Type: Application
    Filed: January 14, 2009
    Publication date: June 24, 2010
    Inventors: Chi Keung Alex Chan, Yue Kwong Victor Lau, Xuan Wang