Patents by Inventor Chi-Ming Huang

Chi-Ming Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10050148
    Abstract: A semiconductor device includes a substrate, at least one semiconductor fin, and at least one epitaxy structure. The semiconductor fin is present on the substrate. The semiconductor fin has at least one recess thereon. The epitaxy structure is present in the recess of the semiconductor fin. A topmost location of the epitaxy structure has an n-type impurity concentration lower than an n-type impurity concentration of a location of the epitaxy structure below the topmost location.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: August 14, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Ming Chang, Chi-Wen Liu, Hsin-Chieh Huang, Cheng-Chien Li
  • Publication number: 20180228036
    Abstract: A flexible display device comprises a main body, a gas transportation device, and a flexible module comprising a flexible panel and a soft cushion. The flexible panel comprises a flexible substrate having a first surface and a second surface, and a display assembly. The display assembly is disposed on the first surface. The soft cushion is adhered on the second surface. The gas transportation device is disposed in the main body. The gas transportation device has a gas inlet and a gas outlet communicated with the soft cushion. The flexible module is received by a receiving space. When the flexible panel and the soft cushion are unfolded outwardly, gas is inputted from the gas inlet and transmitted to the soft cushion through the gas outlet, so that the soft cushion is inflated, and the flexible panel is stably supported by the soft cushion and not easy to be deformed.
    Type: Application
    Filed: January 31, 2018
    Publication date: August 9, 2018
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan MOU, Ta-Wei HSUEH, Shih-Chang CHEN, Jia-Yu LIAO, Yung-Lung HAN, Chi-Feng HUANG, Wei-Ming LEE
  • Patent number: 10035929
    Abstract: The present disclosure relates to a method of forming a CMP slurry that is free of pH-adjusters (i.e., chemicals added solely for the purpose of adjusting a pH of a CMP slurry), and an associated a pH-adjuster free CMP slurry. In some embodiments, the method is performed by forming a CMP slurry having a first pH value. A desired pH value of the CMP slurry is determined. A chelating agent configured to bond to metallic ions is provided to the CMP slurry. The chelating agent is configured to adjust a pH value of the CMP slurry from the first pH value to the desired pH value. By using the chelating agent to adjust a pH value of the CMP slurry to achieve a desired pH value, the method is able to form a CMP slurry that is free of pH-adjusters, thereby reducing the cost and complexity of the CMP slurry.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: July 31, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shu-Hao Huang, Horng-Huei Tseng, Chi-Ming Yang, Jeng-Jyi Hwang
  • Patent number: 10032873
    Abstract: A semiconductor device includes a substrate, at least one semiconductor fin, and at least one epitaxy structure. The semiconductor fin is present on the substrate. The semiconductor fin has at least one recess thereon. The epitaxy structure is present in the recess of the semiconductor fin. The epitaxy structure includes a topmost portion, a first portion and a second portion arranged along a direction from the semiconductor fin to the substrate. The first portion has a germanium atomic percentage higher than a germanium atomic percentage of the topmost portion and a germanium atomic percentage of the second portion.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: July 24, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Ming Chang, Chi-Wen Liu, Cheng-Chien Li, Hsin-Chieh Huang
  • Patent number: 9977426
    Abstract: A mobile device controlling system includes one mobile device of a plurality, a controlling terminal of a plurality, and a server. A method for the system is also described. The one mobile device of the plurality includes a connection establishment module, an information transmission module, and an operation module. The connection establishment module transmits on startup a connection request to a server to establish a connection and the information transmission module transmits mobile device ID and status to the server. The operation module receives feedback from the server as to one verified controlling terminal within the plurality and the mobile device can be exclusively controlled by that terminal according to the feedback.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: May 22, 2018
    Assignee: Cloud Network Technology Singapore Pte. Ltd.
    Inventors: Wei-Chun Chen, You-Yun Lee, Chin-Chieh Tseng, Kai-Fan Lee, Chi-Ming Huang
  • Publication number: 20180130756
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first device. The semiconductor device structure includes a conductive element over the first device. The semiconductor device structure includes a first conductive shielding layer between the first device and the conductive element. The first conductive shielding layer has openings, and a maximum width of the opening is less than a wavelength of an energy generated by the first device. The semiconductor device structure includes a second conductive shielding layer under the first device. The first device is between the first conductive shielding layer and the second conductive shielding layer, and the second conductive shielding layer has a plurality of second openings.
    Type: Application
    Filed: January 10, 2018
    Publication date: May 10, 2018
    Inventors: Shou-Zen CHANG, Chi-Ming HUANG, Kai-Chiang WU, Sen-Kuei HSU, Hsin-Yu PAN, Han-Ping PU, Albert WAN
  • Patent number: 9902317
    Abstract: A control system for a mobile warning triangle, to implement route planning by distance sensors and internet connection. Modules can control the mobile warning triangle to rotate to establish an environmental map and convert the environmental map into a linear vector map. A line forward can be established as a reference direction and the mobile warning triangle moved a second predetermined distance. A driving control module controls the mobile warning triangle to keep moving forward on the original line or to move on a reselected line. A control method of the mobile warning triangle is also provided.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: February 27, 2018
    Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
    Inventors: Ya-Kuan Chuang, Kai-Fan Lee, Po-Cheng Chen, Chi-Ming Huang
  • Patent number: 9875972
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first device. The semiconductor device structure includes a conductive element over the first device. The semiconductor device structure includes a first conductive shielding layer between the first device and the conductive element. The first conductive shielding layer has openings, and a maximum width of the opening is less than a wavelength of an energy generated by the first device.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: January 23, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Hsin-Yu Pan, Han-Ping Pu, Albert Wan
  • Publication number: 20180017963
    Abstract: A mobile device controlling system includes one mobile device of a plurality, a controlling terminal of a plurality, and a server. A method for the system is also described. The one mobile device of the plurality includes a connection establishment module, an information transmission module, and an operation module. The connection establishment module transmits on startup a connection request to a server to establish a connection and the information transmission module transmits mobile device ID and status to the server. The operation module receives feedback from the server as to one verified controlling terminal within the plurality and the mobile device can be exclusively controlled by that terminal according to the feedback.
    Type: Application
    Filed: August 31, 2016
    Publication date: January 18, 2018
    Inventors: WEI-CHUN CHEN, YOU-YUN LEE, CHIN-CHIEH TSENG, KAI-FAN LEE, CHI-MING HUANG
  • Publication number: 20180019209
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first device. The semiconductor device structure includes a conductive element over the first device. The semiconductor device structure includes a first conductive shielding layer between the first device and the conductive element. The first conductive shielding layer has openings, and a maximum width of the opening is less than a wavelength of an energy generated by the first device.
    Type: Application
    Filed: July 14, 2016
    Publication date: January 18, 2018
    Inventors: Shou-Zen CHANG, Chi-Ming HUANG, Kai-Chiang WU, Sen-Kuei HSU, Hsin-Yu PAN, Han-Ping PU, Albert WAN
  • Publication number: 20170357241
    Abstract: A system for reducing traumatic brain injuries in players on a sports field includes a number of transmitters worn by at least some of the players; a plurality of sensors configured for placement on or near the sports field for receiving signals transmitted from the transmitters as the players move about on the field; a head-stabilizing component worn by at least one of the players that inhibits relative motion of the player's head when activated; and a processing element coupled with the sensors and in communication with the head-stabilizing component.
    Type: Application
    Filed: June 14, 2016
    Publication date: December 14, 2017
    Inventor: CHI-MING HUANG
  • Publication number: 20170186525
    Abstract: An inductor, a magnetic material composition used for the inductor, and a manufacturing method of an electronic component. The magnetic material composition used for the inductor includes 100 weight parts of a magnetic metal powder and 0.05-1 weight part of an inorganic ceramic powder. The magnetic metal powder includes 94.5 wt % or higher of iron, and the inorganic ceramic powder includes aluminum oxide.
    Type: Application
    Filed: July 10, 2016
    Publication date: June 29, 2017
    Applicants: DARFON ELECTRONICS (SUZHOU) CO., LTD., Darfon Electronics Corp.
    Inventors: Yung-Ping Wu, Ran-Rong Lee, Chi-Ming Huang, Chao-Kuang Hsiao, Bai-Yang Wang
  • Patent number: 9455705
    Abstract: A touch inductive unit includes a receiving electrode pattern and a driving electrode pattern. The receiving electrode pattern includes a first main stem, a first branch portion and a second branch portion. The first branch portion and the second branch portion are extended from the first main stem. The driving electrode pattern includes a second main stem, a third branch portion and a fourth branch portion. The third branch portion and the fourth branch portion are extended from the second main stem. The receiving electrode pattern and the driving electrode pattern are interdigitated and physically spaced apart from each other.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: September 27, 2016
    Assignee: WINTEK CORPORATION
    Inventors: Chi-Ming Huang, Shyh-Jeng Chen, Pei-Fang Tsai, Ming-Chuan Lin, Hsueh-Chih Wu, Wen-Hung Wang, Wen-Yi Wang
  • Patent number: 9373505
    Abstract: In this disclosure, a mark segmentation method and a method for manufacturing a semiconductor structure applying the same are provided. The mark segmentation method comprises the following steps. First, a plurality of segments having a width WS and separated from each other by a space SS formed on a substrate are identified by a processor. Thereafter, a plurality of marks are set over the segments by the processor. This step comprises: (1) adjusting a width WM of each one of the marks being equal to m(WS+SS)+WS or m(WS+SS)+SS by the processor, wherein m is an integer; and (2) adjusting a space SM of adjacent two of the marks by the processor such that WM+SM=n(WS+SS), wherein n is an integer.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: June 21, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: En-Chiuan Liou, Yu-Ying Huang, Jen-Hsiu Li, Mei-Chen Chen, Ya-Ling Chen, Yi-Jing Wang, Chi-Ming Huang
  • Patent number: 9231158
    Abstract: A light-emitting diode (LED) structure and a method for manufacturing the LED structure are disclosed for promoting the recognition rate of LED chips, wherein a roughness degree of the surface under a first electrode pad of a first conductivity type is made similar to that of the surface under a second electrode pad of a second conductivity type, so that the luster shown from the first electrode pad can be similar to that from the second electrode pad, thus resolving the poor recognition problem of wire-bonding machines caused by different lusters from the first and second electrode pads.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: January 5, 2016
    Assignee: Epistar Corporation
    Inventors: Cheng-Ta Kuo, Kuo-Hui Yu, Chao-Hsing Chen, Tsun-Kai Ko, Chi-Ming Huang, Shih-Wei Yen, Chien-Kai Chung
  • Publication number: 20150294058
    Abstract: In this disclosure, a mark segmentation method and a method for manufacturing a semiconductor structure applying the same are provided. The mark segmentation method comprises the following steps. First, a plurality of segments having a width WS and separated from each other by a space SS formed on a substrate are identified by a processor. Thereafter, a plurality of marks are set over the segments by the processor. This step comprises: (1) adjusting a width WM of each one of the marks being equal to m(WS+SS)+WS or m(WS+SS)+SS by the processor, wherein m is an integer; and (2) adjusting a space SM of adjacent two of the marks by the processor such that WM+SM=n(WS+SS), wherein n is an integer.
    Type: Application
    Filed: May 15, 2014
    Publication date: October 15, 2015
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: En-Chiuan Liou, Yu-Ying Huang, Jen-Hsiu Li, Mei-Chen Chen, Ya-Ling Chen, Yi-Jing Wang, Chi-Ming Huang
  • Publication number: 20140332361
    Abstract: A touch inductive unit includes a receiving electrode pattern and a driving electrode pattern. The receiving electrode pattern includes a first main stem, a first branch portion and a second branch portion. The first branch portion and the second branch portion are extended from the first main stem. The driving electrode pattern includes a second main stem, a third branch portion and a fourth branch portion. The third branch portion and the fourth branch portion are extended from the second main stem. The receiving electrode pattern and the driving electrode pattern are interdigitated and physically spaced apart from each other.
    Type: Application
    Filed: May 12, 2014
    Publication date: November 13, 2014
    Applicant: WINTEK CORPORATION
    Inventors: Chi-Ming Huang, Shyh-Jeng Chen, Pei-Fang Tsai, Ming-Chuan Lin, Hsueh-Chih Wu, Wen-Hung Wang, Wen-Yi Wang
  • Publication number: 20140327635
    Abstract: A touch electronic device is provided. The touch electronic device includes a main touch region, a decoration region, an assistant touch region, and a sensing module. The decoration region is disposed at or on at least one side of the main touch region. The assistant touch region is in the decoration region, and has at least one hot key, and the at least one hot key is configured to execute a preset function. The sensing module is configured to activate or deactivate the preset function of the at least one hot key.
    Type: Application
    Filed: May 2, 2014
    Publication date: November 6, 2014
    Applicant: WINTEK CORPORATION
    Inventors: Chi-Ming Huang, Ming-Chuan Lin, Hsueh-Chih Wu
  • Patent number: 8691629
    Abstract: An embodiment is a method for semiconductor packaging. The method comprises attaching a chip to a carrier substrate through a first side of a jig, the chip being attached by bumps; applying balls to bond pads on the carrier substrate through a second side of the jig; and simultaneously reflowing the bumps and the balls. According to a further embodiment, a packaging jig comprises a cover, a base, and a connector. The cover has a first window through the cover. The base has a second window through the base. The first window exposes a first surface of a volume intermediate the cover and the base, and the second window exposes a second surface of the volume. The first surface is opposite the volume from the second surface. The connector aligns and couples the cover to the base.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: April 8, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Ming Huang, Tsung-Ding Wang
  • Publication number: 20120302008
    Abstract: An embodiment is a method for semiconductor packaging. The method comprises attaching a chip to a carrier substrate through a first side of a jig, the chip being attached by bumps; applying balls to bond pads on the carrier substrate through a second side of the jig; and simultaneously reflowing the bumps and the balls. According to a further embodiment, a packaging jig comprises a cover, a base, and a connector. The cover has a first window through the cover. The base has a second window through the base. The first window exposes a first surface of a volume intermediate the cover and the base, and the second window exposes a second surface of the volume. The first surface is opposite the volume from the second surface. The connector aligns and couples the cover to the base.
    Type: Application
    Filed: May 27, 2011
    Publication date: November 29, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Ming Huang, Tsung-Ding Wang