Abstract: One embodiment relates to a method of achieving an circuit dimension which is greater than a size of an exposure field of an illumination tool. A first area of a first reticle field and a second area of a second reticle field are defined. An extension zone is created as a region outside the first area, and includes a first layout shape formed on a first design level. A corresponding forbidden zone is created for the second reticle field as a region inside the second area where no layout shape on the first design level is permitted. A second layout shape is formed on a second design level within the forbidden zone. The first and second areas are then abutted. Upon abutment of the first and second areas, the second layout shape overlaps the first layout shape to form a connection between circuitry of the first and second reticle fields.

Abstract: One embodiment relates to a method of achieving an circuit dimension which is greater than a size of an exposure field of an illumination tool. A first area of a first reticle field and a second area of a second reticle field are defined. An extension zone is created as a region outside the first area, and includes a first layout shape formed on a first design level. A corresponding forbidden zone is created for the second reticle field as a region inside the second area where no layout shape on the first design level is permitted. A second layout shape is formed on a second design level within the forbidden zone. The first and second areas are then abutted. Upon abutment of the first and second areas, the second layout shape overlaps the first layout shape to form a connection between circuitry of the first and second reticle fields.

Abstract: The present disclosure relates to a method of performing an optical proximity correction (OPC) procedure that provides for a high degree of freedom by using an approximation design layer. In some embodiments, the method is performed by forming an integrated chip (IC) design having an original design layer with one or more original design shapes. An approximation design layer, which is different from the original design layer, is generated from the original design layer. The approximation design layer is a design layer that has been adjusted to remove features that may cause optical proximity correction (OPC) problems. An optical proximity correction (OPC) procedure is then performed on the approximation design layer. By performing the OPC procedure on the approximation design layer rather than on the original design layer, characteristics of the OPC procedure can be improved.

Abstract: A method for characterizing a three-dimensional surface profile of a semiconductor workpiece is provided. In this method, the three-dimensional surface profile is imaged from a normal angle to measure widths of various surfaces in a first image. The three-dimensional surface is also imaged from a first oblique angle to re-measure the widths of the various surfaces in a second image. Based on differences in widths of corresponding surfaces for first and second images, a feature height and sidewall angle are determined for the three-dimensional profile.

Abstract: Provided is an integrated circuit (IC) design method. The method includes receiving a design layout of the IC, the design layout having a first main feature, and adding a negative assist feature to the design layout, wherein the negative assist feature has a first width, the negative assist feature divides the first main feature into a second main feature and a third main feature by the first width, and the first width is sub-resolution in a photolithography process.

Abstract: Provided is an integrated circuit (IC) photo mask. The IC photo mask includes a main feature of the IC, the main feature having a plurality of sides, and a plurality of assist features, the assist features being spaced from each other and spaced from the main feature, wherein each one of the assist features is adjacent to one of the sides, each one of the assist features has an elongated shape along a direction, whereby extending the shape in the direction would intersect at least another one of the assist features and the assist features are sub-resolution correction features for correcting for optical proximity effect in a photolithography process.

Abstract: A method disclosed for making a side-chain dendrimer vesicle. The method includes the steps of: At first, there is provided a random copolymer with a narrow distribution of molecular weights by active polymerization and chemical modification. Then, chemical modification is executed to graft various generations of dendrimers to the random copolymer to provide a side-chain dendritic random copolymer with various generations. Two steps of emulsification are taken to induce macromolecular self-assembling of the side-chain dendritic random copolymer solution to form the macromolecular vesicle. The side-chain dendrimer includes C10˜C18 hydrophobic alkyl chains.

Abstract: A method disclosed for making a side-chain dendrimer vesicle. The method includes the steps of: At first, there is provided a random copolymer with a narrow distribution of molecular weights by active polymerization and chemical modification. Then, chemical modification is executed to graft various generations of dendrimers to the random copolymer to provide a side-chain dendritic random copolymer with various generations. Two steps of emulsification are taken to induce macromolecular self-assembling of the side-chain dendritic random copolymer solution to form the macromolecular vesicle. The side-chain dendrimer includes C10˜C18 hydrophobic alkyl chains.

Abstract: Provided is an integrated circuit (IC) design method. The method includes receiving an IC design layout having a feature with an outer boundary, performing a dissection on the feature to divide the outer boundary into a plurality of segments, and performing, using the segments, an optical proximity correction (OPC) on the feature to generate a modified outer boundary. The method also includes simulating a photolithography exposure of the feature with the modified outer boundary to create a contour and performing an OPC evaluation to determine if the contour is within a threshold. Additionally, the method includes repeating the performing a dissection, the performing an optical proximity correction, and the simulating if the contour does not meet the threshold, wherein each repeated dissection and each repeated optical proximity correction is performed on the modified outer boundary generated by the previously performed optical proximity correction.

Abstract: Provided is an integrated circuit (IC) design method. The method includes receiving an IC design layout having a feature with an outer boundary, performing a dissection on the feature to divide the outer boundary into a plurality of segments, and performing, using the segments, an optical proximity correction (OPC) on the feature to generate a modified outer boundary. The method also includes simulating a photolithography exposure of the feature with the modified outer boundary to create a contour and performing an OPC evaluation to determine if the contour is within a threshold. Additionally, the method includes repeating the performing a dissection, the performing an optical proximity correction, and the simulating if the contour does not meet the threshold, wherein each repeated dissection and each repeated optical proximity correction is performed on the modified outer boundary generated by the previously performed optical proximity correction.

Abstract: A portable air treatment apparatus includes a housing formed with an air intake, a cool air vent, a warm air vent, and a compartment. The compartment is separated into a temperature modification chamber and a containment chamber for containing ionized water. The portable air treatment apparatus further includes a temperature modification device for heating and cooling that is disposed in the temperature modification chamber, and that includes a cool air duct in fluid communication with the cool air vent, and a warm air duct in fluid communication with the warm air vent. The portable air treatment apparatus also includes an anion generator that includes a fogger disposed in the containment chamber. The anion generator further includes a venting pipe in fluid communication with the cool air duct and the warm air duct.

Abstract: A full angle LED (light-emitting diode) illumination device comprises at least three copper base plates, a plurality of LED chips, and a flexible circuit layer. Each copper base plate is electroplated with a layer of silver thereon and the copper base plates are arranged in a crisscross pattern to form the backbone of a three-dimensional globe. Each LED chip is provided on the external surface of the three-dimensional globe at a site where any two copper base plates are crisscrossed. The flexible circuit layer is provided on the peripheries of the copper base plates and electrically connected with the LED chips for controlling the LED chips. Accordingly, it is able to provide full angle illumination range and to improve the thermal conductivity and heat dissipation capability in order to prolong effectively the lifetime of the LED chips in use.

Abstract: A method for making a side-chain dendrimer vesicle includes the following steps. At first, there is provided a random copolymer with a narrow distribution of molecular weights by active polymerization and chemical modification. Then, chemical modification is executed to graft various generations of dendrimers to the random copolymer to provide a side-chain dendritic random copolymer with various generations. Two steps of emulsification are taken to induce macromolecular self-assembling of the side-chain dendritic random copolymer solution to form the macromolecular vesicle. The side-chain dendrimer includes C10˜C18 hydrophobic alkyl chains.

Abstract: Methods for producing dendrons of different generations with hydrophobic functional end-groups, and for producing polyurethanes with the side-chain dendrons are disclosed step-by-step. The dendron with hydrophobic functional end-groups in the polyurethane systems, and the honeycomb-like structure thin films are obtained by a breath-figure process. The structures of dendrons and dendritic side-chain polyurethanes are respectively expressed in the following and the end-groups (R) of the dendron are long alkyl chains or perfluoroalkyl derivatives.

Abstract: A notebook computer housing structure is described. The notebook computer housing structure includes a body, which is made of one of plastic, aluminum, and an aluminum magnesium alloy. A circuit board installed with electronic elements such as a CPU and an interface card is placed inside the body. The improvement lies in that a plurality of holes is disposed on the body to form a convection effect inside the body after cold air enters the body through the holes.

Abstract: A dendron with hydrophobic functional of end group, a polyurethane with the dendron, and producing methods thereof are disclosed. The dendron with hydrophobic functional of end group in the polyurethane systems, and the honeycomb-like structure thin films were obtained by a breath-figure process. The structures of dendron and dendritic side-chain polyurethanes are respectively expressed in the following. Therein, the end-groups (R) of the dendron are long alkyl chains or perfluoroalkyl derivatives.

Abstract: A full angle LED (light-emitting diode) illumination device comprises at least three copper base plates, a plurality of LED chips, and a flexible circuit layer. Each copper base plate is electroplated with a layer of silver thereon and the copper base plates are arranged in a crisscross pattern to form the backbone of a three-dimensional globe. Each LED chip is provided on the external surface of the three-dimensional globe at a site where any two copper base plates are crisscrossed. The flexible circuit layer is provided on the peripheries of the copper base plates and electrically connected with the LED chips for controlling the LED chips. Accordingly, it is able to provide full angle illumination range and to improve the thermal conductivity and heat dissipation capability in order to prolong effectively the lifetime of the LED chips in use.

Abstract: A three-layered cold/hot controller comprises a semiconductor plate, a first metal plate, and a second metal plate. The semiconductor plate has a top and a bottom contact surface and connected with a power source. When the semiconductor plate is electrified, the top contact surface of the semiconductor plate forms a contact surface for decreasing temperature while the bottom contact surface of the semiconductor plate forms a contact surface for elevating temperature. The first metal plate is combined to the top contact surface of the semiconductor plate for conducting the heat between the first metal plate and the top contact surface. The second metal plate is combined to the bottom contact surface of the semiconductor plate for conducting the heat between the second metal plate and the bottom contact surface.

Abstract: A 360-degree angle LED (light-emitting diode) illumination device comprises a copper base plate, a plurality of LED chips, and a flexible PCB circuit layer. The copper base plate is electroplated with a layer of silver thereon. The plurality of LED chips is provided on the peripheries of the copper base plate. The flexible PCB circuit layer is provided on the peripheries of the copper base plate and electrically connected with the LED chips for controlling the LED chips. Accordingly, it is able to provide 360-degree angle illumination range and to improve the thermal conductivity and heat dissipation capability in order to prolong effectively the lifetime of the LED chips in use.

Abstract: An LED lamp-set includes a lamp, which is a round-shape cap and an interior of which contains an LED holding slot to emplace an LED. A bottom of the lamp is connected and fixed with a lamp holder which can be made by a metallic material to dissipate heat generated by the LED. The lamp holder is provided with locking holes to lock the lamp and the LED on the lamp holder through locking elements. An outer rim of the lamp holder can be provided with lamp holder fixing holes to fix the lamp-set in a usage condition. A top end or an outer rim of the lamp can be provided additionally with a lamp shade to further improve versatility of application.