Abstract: A thin film transistor includes an active layer located over a substrate, a first gate stack including a stack of a first gate dielectric and a first gate electrode and located on a first surface of the active layer, a pair of first contact electrodes contacting peripheral portions of the first surface of the active layer and laterally spaced from each other along a first horizontal direction by the first gate electrode, a second contact electrode contacting a second surface of the active layer that is vertically spaced from the first surface of the active layer, and a pair of second gate stacks including a respective stack of a second gate dielectric and a second gate electrode and located on a respective peripheral portion of a second surface of the active layer.

Abstract: A heat sealable polyester film and a method for manufacturing the same are provided. The heat sealable polyester film is made from a recycled polyester material. The heat sealable polyester film includes a base layer and a heat sealable layer formed on at least one surface of the base layer. The heat sealable layer is formed from a first polyester composition. A main component of the first polyester composition is regenerated polyethylene terephthalate and the first polyester composition further includes at least one of 1,4-butanediol, isophthalic acid, neopentyl glycol, and polybutylene terephthalate. A heat sealing temperature of the heat sealable polyester film ranges from 120° C. to 230° C.

Abstract: An electronic device includes a substrate, a plurality of flexible circuit boards, a plurality of ICs and an insulator. The flexible circuit boards are disposed on the substrate. In a top view of the electronic device, the flexible circuit boards are overlapped with an edge of the substrate. The ICs are disposed on the substrate. The insulator is disposed on the flexible circuit boards and contacted the ICs, wherein the insulator has a first side and a second side opposite to the first side and the first side is closer to the edge than the second side. Along a first direction perpendicular to an extension direction of the edge, a first minimum distance between the second side and one of the ICs is less than a second minimum distance between the second side and one of the flexible circuit boards.

Abstract: A method of correcting a misalignment of a wafer on a wafer holder and an apparatus for performing the same are disclosed. In an embodiment, a semiconductor alignment apparatus includes a wafer stage; a wafer holder over the wafer stage; a first position detector configured to detect an alignment of a wafer over the wafer holder in a first direction; a second position detector configured to detect an alignment of the wafer over the wafer holder in a second direction; and a rotational detector configured to detect a rotational alignment of the wafer over the wafer holder.

Abstract: A semiconductor structure includes semiconductor layers disposed over a substrate and oriented lengthwise in a first direction, a metal gate stack disposed over the semiconductor layers and oriented lengthwise in a second direction perpendicular to the first direction, where the metal gate stack includes a top portion and a bottom portion that is interleaved with the semiconductor layers, source/drain features disposed in the semiconductor layers and adjacent to the metal gate stack, and an isolation structure protruding from the substrate, where the isolation structure is oriented lengthwise along the second direction and spaced from the metal gate stack along the first direction, and where the isolation structure includes a dielectric layer and an air gap.

Abstract: Various embodiments of the present application are directed towards a control gate layout to improve an etch process window for word lines. In some embodiments, an integrated chip comprises a memory array, an erase gate, a word line, and a control gate. The memory array comprises a plurality of cells in a plurality of rows and a plurality of columns. The erase gate and the word line are elongated in parallel along a row of the memory array. The control gate is elongated along the row and is between and borders the erase gate and the word line. Further, the control gate has a pad region protruding towards the erase gate and the word line. Because the pad region protrudes towards the erase gate and the word line, a width of the pad region is spread between word-line and erase-gate sides of the control gate.

Abstract: The disclosure discloses a heat-sealable polyester film, including a base layer and a heat-seal layer formed on the base layer. The heat-seal layer includes a physically regenerated polyester resin, a chemically regenerated polyester resin, and a modifier. The heat-sealable temperature of the heat-sealable polyester film is between 100° C. and 230° C.

Abstract: A matte film for hot pressing and a manufacturing method thereof are provided. The manufacturing method includes steps of forming at least one polyester composition into an unstretched polyester thick film and stretching the unstretched polyester thick film in a machine direction (MD) and a transverse direction (TD). The polyester composition includes 81% to 97.9497% by weight of a polyester resin, 0.02% to 2% by weight of an antioxidative ingredient, 0.0003% to 1% by weight of a nucleating agent, 0.01% to 2% by weight of a flow aid, 0.01% to 2% by weight of a polyester modifier, 0.01% to 2% by weight of an inorganic filler, and 2% to 10% by weight of silica particles. The polyester resin has an intrinsic viscosity between 0.60 dl/g and 0.80 dl/g.

Abstract: An on-board charging device includes an AC connector, an AC to DC converter and a detection circuit. The AC connector is configured to be connected to an electric vehicle supply equipment (EVSE), so that a protective earth terminal of EVSE is electrically connected to a protective earth terminal of the on-board charging device. The AC to DC converter is electrically connected to the AC connector, and the AC to DC converter is configured to convert an AC voltage provided by the EVSE into a DC voltage. The AC to DC converter has a reference ground terminal. The detection circuit outputs a detection voltage based on the voltage difference between the protective earth terminal of the on-board charging device and the reference ground terminal of the AC to DC converter. The detection voltage reflects whether the protective earth terminal of the EVSE is abnormal or not.

Abstract: A power converter includes a power converting circuit, an output current control circuit, a high-voltage control circuit, a low-voltage control circuit, and a driving circuit. The power converting circuit receives and converts a HV dc voltage from a HV side to a LV dc voltage to a LV side. The output current control circuit is configured to detect an output current and output a first control signal. The high-voltage control circuit is configured to detect the HV dc voltage and output a second control signal. The low-voltage control circuit is configured to detect the LV dc voltage and output a third control signal selectively according to the LV dc voltage, or the LV dc voltage and the first control signal, or the LV dc voltage and the second control signal. The driving voltage outputs a driving signal to drive the power converting circuit according to the third control signal.

Abstract: A power converter includes a power converting circuit, an output current control circuit, a high-voltage control circuit, a low-voltage control circuit, and a driving circuit. The power converting circuit receives and converts a HCMV dc voltage from a HCMV side to a LA dc voltage to a LA side. The output current control circuit is configured to detect an output current and output a first control signal. The high-voltage control circuit is configured to detect the HCMV dc voltage and output a second control signal. The low-voltage control circuit is configured to detect the LA dc voltage and output a third control signal selectively according to the LA dc voltage, or the LA dc voltage and the first control signal, or the LA dc voltage and the second control signal. The driving voltage outputs a driving signal to drive the power converting circuit according to the third control signal.

Abstract: A power converter includes a power converting circuit, a high-voltage control circuit, a low-voltage control circuit, and a driving circuit. The power converting circuit is configured to receive and convert a HVDC voltage from a high-voltage side to a LVDC voltage to a low-voltage side. The high-voltage control circuit is coupled to the high-voltage side and configured to detect the HVDC voltage and output a first control signal according to the HVDC voltage. The low-voltage control circuit is coupled to the low-voltage side and configured to detect the LVDC voltage and output a second control signal according to the LVDC voltage. The driving voltage is configured to selectively output a driving signal to drive the power converting circuit according to the first or the second control signal.

Abstract: An on-board charging device includes an AC connector, an AC to DC converter and a detection circuit. The AC connector is configured to be connected to an electric vehicle supply equipment (EVSE), so that a protective earth terminal of EVSE is electrically connected to a protective earth terminal of the on-board charging device. The AC to DC converter is electrically connected to the AC connector, and the AC to DC converter is configured to convert an AC voltage provided by the EVSE into a DC voltage. The AC to DC converter has a reference ground terminal. The detection circuit outputs a detection voltage based on the voltage difference between the protective earth terminal of the on-board charging device and the reference ground terminal of the AC to DC converter. The detection voltage reflects whether the protective earth terminal of the EVSE is abnormal or not.

Abstract: A power converter includes a power converting circuit, a high-voltage control circuit, a low-voltage control circuit, and a driving circuit. The power converting circuit is configured to receive and convert a HVDC voltage from a high-voltage side to a LVDC voltage to a low-voltage side. The high-voltage control circuit is coupled to the high-voltage side and configured to detect the HVDC voltage and output a first control signal according to the HVDC voltage. The low-voltage control circuit is coupled to the low-voltage side and configured to detect the LVDC voltage and output a second control signal according to the LVDC voltage. The driving voltage is configured to selectively output a driving signal to drive the power converting circuit according to the first or the second control signal.

Abstract: A transformer includes a primary side module, a secondary winding structure, and a magnetic core assembly. The primary side module includes a primary winding structure, a first covering structure and a second covering structure. The primary winding structure has a first opening. The first covering structure includes a second opening corresponding to the first opening and a first receiving recess for accommodating the primary winding structure. The first receiving recess is covered and sealed by the second covering structure. The second covering structure includes a third opening corresponding to the first opening. The first opening, the second opening and the third opening are in communication with each other to be defined as a channel. The secondary winding structure includes a fourth opening, which is in communication with the channel. The magnetic core assembly is partially embedded within the channel and the fourth opening.

Abstract: A power supply is coupled to an input voltage source. The power supply includes a plurality of converters. Each converter has an input for receiving an input voltage and an output for providing an output voltage. The inputs are connected in series and the outputs are connected in parallel to provide an output voltage. The power supply further includes an output regulating controller coupled to one of the plurality of converters for regulating the output voltage. The power supply further includes one or more input regulating controllers correspondingly coupled to the remaining one or more converters of the plurality of converters for regulating one or more input voltages.

Abstract: A transformer includes a primary side module, a secondary winding structure, and a magnetic core assembly. The primary side module includes a primary winding structure, a first covering structure and a second covering structure. The primary winding structure has a first opening. The first covering structure includes a second opening corresponding to the first opening and a first receiving recess for accommodating the primary winding structure. The first receiving recess is covered and sealed by the second covering structure. The second covering structure includes a third opening corresponding to the first opening. The first opening, the second opening and the third opening are in communication with each other to be defined as a channel. The secondary winding structure includes a fourth opening, which is in communication with the channel. The magnetic core assembly is partially embedded within the channel and the fourth opening.

Abstract: A power supply is coupled to an input voltage source. The power supply includes a plurality of converters. Each converter has an input for receiving an input voltage and an output for providing an output voltage. The inputs are connected in series and the outputs are connected in parallel to provide an output voltage. The power supply further includes an output regulating controller coupled to one of the plurality of converters for regulating the output voltage. The power supply further includes one or more input regulating controllers correspondingly coupled to the remaining one or more converters of the plurality of converters for regulating one or more input voltages.

Abstract: The present invention provides a conductive module used for assembling a magnetic element and an electronic component. The conductive module includes a conductive base, an electronic component and a plurality of conductive units. The electronic component is electrically connected to the conductive base and disposed on one side of the conductive base. The conductive units have respective hollow portions. The conductive units are spaced from each other and fixed on the conductive base such that the hollow portions of the conductive units are aligned with each other to define a channel.

Abstract: The present invention provides a conductive module used for assembling a magnetic element and an electronic component. The conductive module includes a conductive base, an electronic component and a plurality of conductive units. The electronic component is electrically connected to the conductive base and disposed on one side of the conductive base. The conductive units have respective hollow portions. The conductive units are spaced from each other and fixed on the conductive base such that the hollow portions of the conductive units are aligned with each other to define a channel.