Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: A backside metallized compound semiconductor device includes a compound semiconductor wafer and a metal layered structure. The compound semiconductor wafer includes a substrate having opposite front and back surfaces, and a ground pad structure formed on the front surface. The substrate is formed with a via extending from the back surface to the front surface to expose a side wall of the substrate and a portion of the ground pad structure. The metal layered structure is disposed on the back surface, and covers the side wall and the portion of the ground pad structure. The metal layered structure includes an adhesion layer, a seed layer, a gold layer, and an electroplated copper layer that are formed on the back surface in such order. The method for manufacturing the backside metallized compound semiconductor device is also disclosed.

Abstract: A time-of-flight sensor for capturing a three-dimensional (3D) image of an object, includes: a light source for emitting projection light pulses at the object according to a projection signal; an array of pixel circuits for sensing reflection light pulses and storing image charges according to the reflection light pulses; and a processing circuit for calculating a first sum of first portions of the image charges and a second sum of second portions of the image charges to generate a distance information signal of the 3D image of the object simultaneously, wherein in one accumulation period, the first portion of the image charges is generated during a first time period, and the second portion of the image charges is generated during a second time period, wherein the second time period is directly following the first time period in the accumulation period.

Abstract: There is provided a circuit to improve the sensing efficiency of pixels that uses the induction effect of a capacitor to duplicate a voltage deviation caused by additional electrons and uses a circuit to cancel out the voltage deviation during reading pixel data thereby improving the sensing efficiency.

Abstract: There is provided a circuit to improve the sensing efficiency of pixels that uses the induction effect of a capacitor to duplicate a voltage deviation caused by additional electrons and uses a circuit to cancel out the voltage deviation during reading pixel data thereby improving the sensing efficiency.

Abstract: There is provided a circuit to improve the sensing efficiency of pixels that uses the induction effect of a capacitor to duplicate a voltage deviation caused by additional electrons and uses a circuit to cancel out the voltage deviation during reading pixel data thereby improving the sensing efficiency.

Abstract: There is provided a circuit to improve the sensing efficiency of pixels that uses the induction effect of a capacitor to duplicate a voltage deviation caused by additional electrons and uses a circuit to cancel out the voltage deviation during reading pixel data thereby improving the sensing efficiency.

Abstract: There is provided a circuit to improve the sensing efficiency of pixels that uses the induction effect of a capacitor to duplicate a voltage deviation caused by additional electrons and uses a circuit to cancel out the voltage deviation during reading pixel data thereby improving the sensing efficiency.

Abstract: There is provided a circuit to improve the sensing efficiency of pixels that uses the induction effect of a capacitor to duplicate a voltage deviation caused by additional electrons and uses a circuit to cancel out the voltage deviation during reading pixel data thereby improving the sensing efficiency.

Abstract: There is provided a circuit to improve the sensing efficiency of pixels that uses the induction effect of a capacitor to duplicate a voltage deviation caused by additional electrons and uses a circuit to cancel out the voltage deviation during reading pixel data thereby improving the sensing efficiency.

Abstract: An image sensor includes a pair of pixel sharing circuits, a second reset transistor, an amplifier transistor, a readout transistor and a control circuit. The pair of pixel sharing circuits connected to a floating diffusion node, each including a photon device, a first reset transistor, a capture transistor, a holding transistor, a capacitor and a sharing transistor. The control circuit is configured to control the first reset transistor, the first capture transistor, the first holding transistor and the sharing transistor of each of the pair of sharing pixel circuits to be turned on or off.

Abstract: A method of image sensor apparatus includes: providing pixel array having pixel units arranged in M rows and N columns; providing N parallel column readout circuits each being arranged for reading out pixel data of one corresponding column; disposing a horizontal shift register in row direction coupled to the N parallel column readout circuits, to receive a pulse signal and a clock signal, sequentially shift a phase of the pulse signal according to the clock signal, and scan a corresponding column according to the shifted phase of the pulse signal; and using a column select circuit having N latches to receive a power down digital control signal transmitted from a microcontroller wherein the power down digital control signal is used to disable at least one column readout circuit to enable and select a portion of the set of N parallel column readout circuits.

Abstract: A time-of-flight sensor for capturing a three-dimensional (3D) image of an object, includes: a light source for emitting projection light pulses at the object according to a projection signal; an array of pixel circuits for sensing reflection light pulses and storing image charges according to the reflection light pulses; and a processing circuit for calculating a first sum of first portions of the image charges and a second sum of second portions of the image charges to generate a distance information signal of the 3D image of the object simultaneously, wherein in one accumulation period, the first portion of the image charges is generated during a first time period, and the second portion of the image charges is generated during a second time period, wherein the second time period is directly following the first time period in the accumulation period.

Abstract: A column parallel ADC circuit includes: plural column ADCs and a digital processing circuit. The plural column ADCs generate respective plural digital counts. The plural column ADCs include a first column ADC and a second column ADC. The first column ADC generates a first digital count according to a first analog signal, and the second column ADC generates a second digital count according to a second analog signal. The first digital count is a difference between a first digital signal and a second digital signal. The first and the second digital signals correspond to the first and the second analog signals respectively. The digital processing circuit generates the plural digital signals, wherein the digital processing circuit generates the first digital signal according to the first digital count and the second digital signal.

Abstract: A method of image sensor apparatus includes: providing pixel array having pixel units arranged in M rows and N columns; providing N parallel column readout circuits each being arranged for reading out pixel data of one corresponding column; disposing a horizontal shift register in row direction coupled to the N parallel column readout circuits, to receive a pulse signal and a clock signal, sequentially shift a phase of the pulse signal according to the clock signal, and scan a corresponding column according to the shifted phase of the pulse signal; and using a column select circuit having N latches to receive a power down digital control signal transmitted from a microcontroller wherein the power down digital control signal is used to disable at least one column readout circuit to enable and select a portion of the set of N parallel column readout circuits.

Abstract: An image sensor includes a pair of pixel sharing circuits, a second reset transistor, an amplifier transistor, a readout transistor and a control circuit. The pair of pixel sharing circuits connected to a floating diffusion node, each including a photon device, a first reset transistor, a capture transistor, a holding transistor, a capacitor and a sharing transistor. The control circuit is configured to control the first reset transistor, the first capture transistor, the first holding transistor and the sharing transistor of each of the pair of sharing pixel circuits to be turned on or off.

Abstract: A column parallel ADC circuit includes: plural column ADCs and a digital processing circuit. The plural column ADCs generate respective plural digital counts. The plural column ADCs include a first column ADC and a second column ADC. The first column ADC generates a first digital count according to a first analog signal, and the second column ADC generates a second digital count according to a second analog signal. The first digital count is a difference between a first digital signal and a second digital signal. The first and the second digital signals correspond to the first and the second analog signals respectively. The digital processing circuit generates the plural digital signals, wherein the digital processing circuit generates the first digital signal according to the first digital count and the second digital signal.

Abstract: An image sensor including a first pixel circuit, a second pixel circuit, a first readout line, a second readout line, a first readout circuit, a second readout circuit and an average switch is provided. The first and second pixel circuits are in two columns of a pixel array. The first readout line transmits pixel data of the first pixel circuit to the first readout circuit. The second readout line transmits pixel data of the second pixel circuit to the second readout circuit. The average switch is arranged between the first and second readout lines and used to electrically connect the first and second readout lines in an average mode to average the pixel data on the first and second readout lines.

Abstract: There is provided a circuit to improve the sensing efficiency of pixels that uses the induction effect of a capacitor to duplicate a voltage deviation caused by additional electrons and uses a circuit to cancel out the voltage deviation during reading pixel data thereby improving the sensing efficiency.

Abstract: An image sensor including a first pixel circuit, a second pixel circuit, a first readout line, a second readout line, a first readout circuit, a second readout circuit and an average switch is provided. The first and second pixel circuits are in two columns of a pixel array. The first readout line transmits pixel data of the first pixel circuit to the first readout circuit. The second readout line transmits pixel data of the second pixel circuit to the second readout circuit. The average switch is arranged between the first and second readout lines and used to electrically connect the first and second readout lines in an average mode to average the pixel data on the first and second readout lines.