Abstract: The present disclosure relates to an integrated circuit. The integrated circuit includes a conductive interconnect disposed on a dielectric over a substrate. An interfacial layer is arranged along an upper surface of the conductive interconnect. A liner is arranged along a lower surface of the conductive interconnect. The liner and the interfacial layer surround the conductive interconnect. A middle layer is located over the interfacial layer and has a bottommost surface over the dielectric. A bottommost surface of the interfacial layer and the bottommost surface of the middle layer are both above a top of the conductive interconnect.

Abstract: A plasma generating device includes a plasma sprinkler head and an outer housing, wherein the plasma sprinkler head includes a case and a plasma generating assembly disposed on the case and having a plasma nozzle. The plasma nozzle is located on a side of the case. The outer housing is disposed on the case and is located around the plasma nozzle. In this way, when the plasma nozzle sprays the plasma, the plasma generating device of the present invention could effectively avoid introducing too much external air to affect a quality of the plasma.

Abstract: A method of adhering an ethyl vinyl acetate copolymer or a derivative thereof layer to a thermoplastic elastomer layer includes providing the ethyl vinyl acetate copolymer or the derivative thereof layer; performing a first atmospheric environmental plasma treatment on a surface of the ethyl vinyl acetate copolymer or the derivative thereof layer to form a first modified surface; providing the thermoplastic elastomer layer; performing a second atmospheric environmental plasma treatment on a surface of the thermoplastic elastomer layer to form a second modified surface; forming an adhesive layer over the first modified surface, the second modified surface, or the first modified surface and the second modified surface; and adhering the first modified surface to the second modified surface through the adhesive layer.

Abstract: A touch sensor is provided. The touch sensor includes a first buffer layer disposed on a substrate, a first electrode layer disposed on the first buffer layer, a second buffer layer disposed on the first electrode layer and a second electrode layer disposed on the second buffer layer and electrically connected with the first electrode layer, wherein the first and second buffer layers are formed of the same material including an insulated metal oxide, and the first and second electrode layers are formed of the same material including a doped metal oxide.

Abstract: A plasma deposition apparatus including a plasma generation unit and a droplet separation unit is provided. The plasma generation unit includes an inlet end and an outlet end. The droplet separation unit is located at the inlet end. Besides, the droplet separation unit includes a first chamber, an import port, and a connection port. The import port and the connection port are connected to the first chamber. The connection port is connected to the inlet end, and the import port serves to receive an atomized precursor. The atomized precursor is separated into a first portion and a second portion after entering the first chamber, and droplets of the first portion are smaller than droplets of the second portion. The first portion of the atomized precursor is suitable for entering the inlet end through the connection port.

Abstract: A touch sensor is provided. The touch sensor includes a first buffer layer disposed on a substrate, a first electrode layer disposed on the first buffer layer, a second buffer layer disposed on the first electrode layer and a second electrode layer disposed on the second buffer layer and electrically connected with the first electrode layer, wherein the first and second buffer layers are formed of the same material including an insulated metal oxide, and the first and second electrode layers are formed of the same material including a doped metal oxide.

Abstract: A fabricating method of a conductive substrate including the following steps is provided. A substrate is provided. A barrier layer having a first roughened surface is formed on the substrate by an atmospheric pressure plasma process, wherein the surface roughness (Ra) of the first roughened surface formed by the atmospheric pressure plasma process is between 10 nanometers (nm) and 100 nm. A first electrode layer is formed on the first roughened surface of the barrier layer by a vacuum sputter process, wherein a second roughened surface with the surface roughness (Ra) between 10 nm and 100 nm is formed on a surface of the first electrode layer. Furthermore, a photoelectric conversion layer is formed on the second roughened surface of the first electrode layer. A second electrode layer is formed on the photoelectric conversion layer. A solar cell and a conductive substrate are also provided.

Abstract: A plasma deposition apparatus is provided. The plasma deposition apparatus comprises a chamber. A pedestal is placed in the chamber. A plasma generator is placed in the chamber and over the pedestal. The plasma generator comprises a plasma jet for plasma thin film deposition having a discharge direction angle ?1 larger than 0° and less than 90° between a normal direction of the pedestal and the discharge direction of the plasma jet. A gas-extracting pipe extends into the chamber and over the pedestal. The gas-extracting pipe provides a pumping path for particles and side-products having a pumping direction angle ?2 larger than 0° and less than 90° between the normal direction of the pedestal and the pumping direction of the gas-extracting pipe. The chamber is kept at an ambient atmospheric pressure.

Abstract: A film removal method and apparatus for removing a film from a substrate are disclosed. The method comprises the steps of disposing a plasma generator and a sucking apparatus over the substrate, projecting a plasma beam from the plasma generator onto the film obliquely, disposing the sucking apparatus on a reflection path of plasma projected by the plasma generator, and sucking a by-product of an incomplete plasma reaction occurring to the film so as to keep a surface of the substrate clean, with a view to overcoming the drawbacks of deposition of the by-product which results from using the plasma as a surface cleansing means under atmospheric conditions.

Abstract: A solid-state light emitting display and a fabrication method thereof are proposed. The light emitting display includes a metallic board formed with conductive circuits, and a plurality of luminous microcrystals disposed on a surface of the metallic board and electrically connected to the conductive circuits. The metallic board provides the features of lightness and thinness, and flexibility, and the luminous microcrystals are in the form of light emitting components, so as to improve the luminous efficiency of display and attain the effect of environmental protection and energy saving, thereby providing display technology with performance satisfactory for various display requirements.

Abstract: A hard water-repellent structure and a method for fabricating the same are provided. The method adopts an atmospheric pressure plasma deposition (APPD) technique to form a hard coating having a rough surface on a substrate, and form a water-repellent coating on the rough surface. Because the hard water-repellent structure includes the hard coating and the water-repellent coating, hardness, abrasion-resistance, transparency and hydrophobicity of the hard water-repellent structure are improved. The hard water-repellent structure protects the substrate from friction. Moreover, because the disclosure adopts the APPD technique to form the hard water-repellent structure, the cost of production is reduced dramatically. Thus, the disclosure can solve drawbacks of prior art.

Abstract: A plasma deposition apparatus is provided. The plasma deposition apparatus comprises a chamber. A pedestal is placed in the chamber. A plasma generator is placed in the chamber and over the pedestal. The plasma generator comprises a plasma jet for plasma thin film deposition having a discharge direction angle ?1 larger than 0° and less than 90° between a normal direction of the pedestal and the discharge direction of the plasma jet. A gas-extracting pipe extends into the chamber and over the pedestal. The gas-extracting pipe provides a pumping path for particles and side-products having a pumping direction angle ?2 larger than 0° and less than 90° between the normal direction of the pedestal and the pumping direction of the gas-extracting pipe. The chamber is kept at an ambient atmospheric pressure.

Abstract: A plasma deposition apparatus is provided. The plasma deposition apparatus comprises a chamber. A pedestal is placed in the chamber. A plasma generator is placed in the chamber and over the pedestal. The plasma generator comprises a plasma jet for plasma thin film deposition having a discharge direction angle ?1 of 0° to 90° between a normal direction of the pedestal and the discharge direction of the plasma jet. A gas-extracting apparatus is placed in the chamber and over the pedestal. The gas-extracting apparatus comprises a gas-extracting pipe providing a pumping path for particles and side-products having a pumping direction angle ?2 of 0° to 90° between the normal direction of the pedestal and the pumping direction of the gas-extracting pipe.

Abstract: A patterning method for a carbon-based substrate is provided. The patterning method for the carbon-based substrate includes the following steps. The carbon-based substrate is provided. An atmospheric pressure plasma is produced from a plasma gas under an open air environment. The plasma gas includes oxygen. The carbon-based substrate is etched by the atmospheric pressure plasma.

Abstract: A solid-state light emitting display and a fabrication method thereof are proposed. The light emitting display includes a metallic board formed with conductive circuits, and a plurality of luminous microcrystals disposed on a surface of the metallic board and electrically connected to the conductive circuits. The metallic board provides the features of lightness and thinness, and flexibility, and the luminous microcrystals are in the form of light emitting components, so as to improve the luminous efficiency of display and attain the effect of environmental protection and energy saving, thereby providing display technology with performance satisfactory for various display requirements.

Abstract: Atmospheric plasma inkjet printing apparatus and methods for fabricating color filters using the same. The atmosphere plasma inkjet printing apparatus includes a nozzle plate having a first column of nozzles and a second column of nozzles. An inkjet printhead module corresponds to the first column of nozzles. An atmospheric plasma module is corresponds to the second column of nozzles.

Abstract: An atmospheric-pressure plasma reactor comprising a first electrode, a second electrode and a power generation unit. The first electrode and the second electrode respectively have a first opening and a second opening corresponding to each other. Disposed inside the first electrode is a gas-in space, which communicates with the first opening. Moreover, the power generation unit is coupled to the first electrode to provide the first electrode with AC power. The second electrode is grounded. The plasma process by the atmospheric-pressure plasma reactor is capable of forming high-uniformity thin film on a substrate.

Abstract: A jet plasma gun and a plasma device using the same are provided. The jet plasma gun is for jetting plasma to process a surface of a substrate. The jet plasma gun includes a plasma producer, a plasma nozzle and a barrier. The plasma producer is for providing plasma. The plasma nozzle disposed between the substrate and plasma producer has a first opening and a second opening. The first opening faces plasma producer, and the second opening faces the substrate. The barrier being an insulator is disposed between the plasma nozzle and the substrate and has a through hole corresponding to the second opening. The plasma passes through the plasma nozzle and the through hole to reach the substrate.

Abstract: A plasma head and the plasma-discharging device using the same are disclosed. The plasma-discharging device comprises a power supply with two electrode terminals. The plasma head comprises: an outer electrode having a chamber formed therein; an inner electrode, disposed inside the chamber; and a flow guiding structure, disposed inside the inner electrode; wherein the outer electrode and the inner electrode are connected respectively to the two electrode terminals of the power supply; and the flow guiding structure further comprises at least an inlet for introducing a working fluid into the inner electrode and at least an outlet being communicated with the chamber of the outer electrode to guide the working fluid to flow into the chamber of the outer chamber.

Abstract: A film removal method and apparatus for removing a film from a substrate are disclosed. The method comprises the steps of disposing a plasma generator and a sucking apparatus over the substrate, projecting a plasma beam from the plasma generator onto the film obliquely, disposing the sucking apparatus on a reflection path of plasma projected by the plasma generator, and sucking a by-product of an incomplete plasma reaction occurring to the film so as to keep a surface of the substrate clean, with a view to overcoming the drawbacks of deposition of the by-product which results from using the plasma as a surface cleansing means under atmospheric conditions.