Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.

Abstract: A package structure includes a redistribution layer having a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface, at least one bonding electrode disposed on the first surface of the redistribution layer, and a mounting layer disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads that are spaced apart from each other. At least one of the conductive pads is exposed by the sidewall of the redistribution layer.

Abstract: A display device including a liquid crystal display, light-emitting diode boards, a system board, and a flexible circuit board is provided. The plurality of light-emitting diode boards are disposed adjacent to the liquid crystal display and overlaps a peripheral region of the liquid crystal display in a normal direction of the display device. At least one of the light-emitting diode boards includes a carrier, light-emitting diodes, and connecting pads. The carrier has a first surface and a second surface opposite to the first surface and located between the first surface and the liquid crystal display. The light-emitting diodes are disposed on the first surface. The connecting pads are disposed on the second surface and are electrically connected to the light-emitting diodes. The system board is located below and electrically connected to the liquid crystal display. The system board is electrically connected to the connecting pads through the flexible circuit board.

Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.

Abstract: The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.

Abstract: A package structure includes a redistribution layer having a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface, at least one bonding electrode disposed on the first surface of the redistribution layer, and a mounting layer disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads that are spaced apart from each other. At least one of the conductive pads is exposed by the sidewall of the redistribution layer.

Abstract: A display device is provided and includes: a display panel; and a circuit board electrically connected to the display panel and including: a substrate; a first conductive layer disposed on the substrate and including a first connecting pad and a second connecting pad; a second conductive layer disposed on and electrically connected to the second connecting pad; a first electronic component disposed on and electrically connected to the first connecting pad; and a second electronic component disposed on the second conductive layer and electrically connected to the second connecting pad through the second conductive layer. The first connecting pad has a first thickness. A total thickness of the second connecting pad and the second conductive layer is a second thickness. The second thickness is greater than the first thickness. A ratio of the second thickness to the first thickness ranges from 1.2 to 5000.

Abstract: A package structure includes a redistribution layer, at least one bonding electrode, and a mounting layer. The redistribution layer has a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface. The bonding electrode is disposed on the first surface of the redistribution layer. The mounting layer is disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads spaced apart from each other, wherein at least one of the conductive pads is exposed by the sidewall of the redistribution layer.

Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, disposing first chips on the sacrificial layer, forming a first dielectric layer surrounding the first chips, forming trenches in the first dielectric layer, and forming a second dielectric layer in the trenches, wherein an upper surface of the first dielectric layer and an upper surface of the second dielectric layer are at a same plane.

Abstract: A display device is provided and includes: a display panel; and a circuit board electrically connected to the display panel and including: a substrate; a first conductive layer disposed on the substrate and including a first connecting pad and a second connecting pad; a second conductive layer disposed on and electrically connected to the second connecting pad; a first electronic component disposed on and electrically connected to the first connecting pad; and a second electronic component disposed on the second conductive layer and electrically connected to the second connecting pad through the second conductive layer. The first connecting pad has a first thickness. A total thickness of the second connecting pad and the second conductive layer is a second thickness. The second thickness is greater than the first thickness. A ratio of the second thickness to the first thickness ranges from 1.2 to 5000.

Abstract: A display device includes a display panel, a driving circuit board, and an electronic connector. The electronic connector connects the display panel and the driving circuit board. The driving circuit board is configured with a first wire, a second wire, a third wire, a fourth wire and a fifth wire arranged in order. The first wire, the second wire, the third wire and the fifth wire extend to the electronic connector and connect to the display panel. A first convergence point of the second wire and the third wire is located on the electronic connector, and a second convergence point of the fourth wire and the third wire is located on the driving circuit board. A detection method of the display device is also disclosed.

Abstract: The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.

Abstract: A display device includes a first substrate, a second substrate, a first polarizer, a second polarizer and a frame. The frame contacts with a first surface and a first side of the first substrate, a second surface and a second side of the second substrate, and a third side of the first polarizer. The frame has a fourth surface and a fourth side connecting to the fourth surface, and the fourth side is disposed corresponding to the second side. In a first direction perpendicular to the first surface, a shortest distance between the fourth and first surfaces is a first distance, a shortest distance between the fourth and first surfaces is a second distance, and a shortest distance between the third and first surfaces is a third distance. The third distance is substantially equal to the first distance, and the first distance and the second distance are different.

Abstract: A package structure includes a redistribution layer, at least one bonding electrode, and a mounting layer. The redistribution layer has a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface. The bonding electrode is disposed on the first surface of the redistribution layer. The mounting layer is disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads spaced apart from each other, wherein at least one of the conductive pads is exposed by the sidewall of the redistribution layer.

Abstract: A display device includes a display panel, a driving circuit board, and an electronic connector. The electronic connector connects the display panel and the driving circuit board. The driving circuit board is configured with a first wire, a second wire, a third wire, a fourth wire and a fifth wire arranged in order. The first wire, the second wire, the third wire and the fifth wire extend to the electronic connector and connect to the display panel. A first convergence point of the second wire and the third wire is located on the electronic connector, and a second convergence point of the fourth wire and the third wire is located on the driving circuit board. A detection method of the display device is also disclosed.

Abstract: A display device includes a first substrate, a second substrate, a first polarizer, a second polarizer and a frame. The frame contacts with a first surface and a first side of the first substrate, a second surface and a second side of the second substrate, and a third side of the first polarizer. The frame has a fourth surface and a fourth side connecting to the fourth surface, and the fourth side is disposed corresponding to the second side. In a first direction perpendicular to the first surface, a shortest distance between the fourth and first surfaces is a first distance, a shortest distance between the fourth and first surfaces is a second distance, and a shortest distance between the third and first surfaces is a third distance. The third distance is substantially equal to the first distance, and the first distance and the second distance are different.