Patents by Inventor Chia-Chih Chen
Chia-Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967570Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.Type: GrantFiled: March 4, 2022Date of Patent: April 23, 2024Assignee: MediaTek Inc.Inventors: Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen, Chung-Fa Lee
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Publication number: 20240116707Abstract: A powered industrial truck includes a lateral movement assembly including four sliding members and four pivotal members both on a wheeled carriage, four links having a first end pivotably secured to the sliding member and a second end pivotably secured to either end of the pivotal member, a motor shaft having two ends pivotably secured to the pivotal members respectively, a first electric motor on one frame member, and four mounts attached to the sliding members respectively; two lift assemblies including a second electric motor, a shaft having two ends rotatably secured to the sliding members respectively, two gear trains at the ends of the shaft respectively, a first gear connected to the second electric motor, a second gear on the shaft, and a first roller chain on the first and second gears; two electric attachments on the platform and being laterally moveable, each attachment. The mount has rollers.Type: ApplicationFiled: September 21, 2023Publication date: April 11, 2024Inventors: Jung-Chieh Chang, Yi-Sheng Chen, Jen-Yung Hsiao, Chia-Fu Hsiao, Wei-Qi Lao, Chen-Chih Chan, Chung-Yu Liu
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Publication number: 20240108409Abstract: A laser device for photocoagulation surgery is disclosed, wherein the laser device includes a multi-wavelength laser source having a first direction and a second direction different from the first direction. The laser device includes a positioning light source, a first laser light source, a first lens, a second laser light source, a second lens, a third laser light source, a third lens, a fourth laser light source and a fourth lens. The positioning light source configured to project a positioning visible light along the first direction, wherein the positioning visible light has a specific wavelength being about 635 nm. The first laser light source configured to project a first laser light having a first wavelength along the second direction. The first lens disposed in a main optical path of the positioning visible light, and configured to receive the first laser light and reflect the first laser light along the first direction.Type: ApplicationFiled: February 9, 2023Publication date: April 4, 2024Inventors: Yung-Fu Chen, Hsing-Chih Liang, Chia-Han Tsou
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Patent number: 11948920Abstract: Provided are a semiconductor device and a method for manufacturing the same, and a semiconductor package. The semiconductor device includes a die stack and a cap substrate. The die stack includes a first die, second dies stacked on the first die, and a third die stacked on the second dies. The first die includes first through semiconductor vias. Each of the second dies include second through semiconductor vias. The third die includes third through semiconductor vias. The cap substrate is disposed on the third die of the die stack. A sum of a thickness of the third die and a thickness of the cap substrate ranges from about 50 ?m to about 80 ?m.Type: GrantFiled: August 30, 2021Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: I-Chun Hsu, Yan-Zuo Tsai, Chia-Yin Chen, Yang-Chih Hsueh, Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou
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Publication number: 20240104809Abstract: Embodiments described herein provide systems and methods for multimodal layout generations for digital publications. The system may receive as inputs, a background image, one or more foreground texts, and one or more foreground images. Feature representations of the background image may be generated. The foreground inputs may be input to a layout generator which has cross attention to the background image feature representations in order to generate a layout comprising of bounding box parameters for each input item. A composite layout may be generated based on the inputs and generated bounding boxes. The resulting composite layout may then be displayed on a user interface.Type: ApplicationFiled: January 30, 2023Publication date: March 28, 2024Inventors: Ning Yu, Chia-Chih Chen, Zeyuan Chen, Caiming Xiong, Juan Carlos Niebles Duque, Ran Xu, Rui Meng
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Patent number: 11937932Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.Type: GrantFiled: July 8, 2022Date of Patent: March 26, 2024Assignees: TAICHUNG VETERANS GENERAL HOSPITAL, TUNGHAI UNIVERSITYInventors: Chieh-Liang Wu, Chun-Te Huang, Cheng-Hsu Chen, Tsai-Jung Wang, Kai-Chih Pai, Chun-Ming Lai, Min-Shian Wang, Ruey-Kai Sheu, Lun-Chi Chen, Yan-Nan Lin, Chien-Lun Liao, Ta-Chun Hung, Chien-Chung Huang, Chia-Tien Hsu, Shang-Feng Tsai
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Patent number: 11941873Abstract: In various examples, sensor data may be received that represents a field of view of a sensor of a vehicle located in a physical environment. The sensor data may be applied to a machine learning model that computes both a set of boundary points that correspond to a boundary dividing drivable free-space from non-drivable space in the physical environment and class labels for boundary points of the set of boundary points that correspond to the boundary. Locations within the physical environment may be determined from the set of boundary points represented by the sensor data, and the vehicle may be controlled through the physical environment within the drivable free-space using the locations and the class labels.Type: GrantFiled: November 10, 2022Date of Patent: March 26, 2024Assignee: NVIDIA CorporationInventors: Mansi Rankawat, Jian Yao, Dong Zhang, Chia-Chih Chen
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Publication number: 20230197424Abstract: An ion collector includes a plurality of segments and a plurality of integrators. The plurality of segments are physically separated from one another and spaced around a substrate support. Each of the segments includes a conductive element that is designed to conduct a current based on ions received from a plasma. Each of the plurality of integrators is coupled to a corresponding conductive element. Each of the plurality of integrators is designed to determine an ion distribution for a corresponding conductive element based, at least in part, on the current conducted at the corresponding conductive element. An example benefit of this embodiment includes the ability to determine how uniform the ion distribution is across a wafer being processed by the plasma.Type: ApplicationFiled: February 13, 2023Publication date: June 22, 2023Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Otto CHEN, Chi-Ying WU, Chia-Chih CHEN
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Patent number: 11676364Abstract: In various examples, sensor data representative of an image of a field of view of a vehicle sensor may be received and the sensor data may be applied to a machine learning model. The machine learning model may compute a segmentation mask representative of portions of the image corresponding to lane markings of the driving surface of the vehicle. Analysis of the segmentation mask may be performed to determine lane marking types, and lane boundaries may be generated by performing curve fitting on the lane markings corresponding to each of the lane marking types. The data representative of the lane boundaries may then be sent to a component of the vehicle for use in navigating the vehicle through the driving surface.Type: GrantFiled: April 5, 2021Date of Patent: June 13, 2023Assignee: NVIDIA CorporationInventors: Yifang Xu, Xin Liu, Chia-Chih Chen, Carolina Parada, Davide Onofrio, Minwoo Park, Mehdi Sajjadi Mohammadabadi, Vijay Chintalapudi, Ozan Tonkal, John Zedlewski, Pekka Janis, Jan Nikolaus Fritsch, Gordon Grigor, Zuoguan Wang, I-Kuei Chen, Miguel Sainz
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Publication number: 20230139777Abstract: The present disclosure describes a wafer cooling/heating system that includes a load-lock and a thermo module. The load-lock uses a level stream design to improve temperature uniformity across one or more wafers during a cooling/heating process. The load-lock can include (i) a wafer holder configured to receive wafers at a front side of the load-lock; (ii) a gas diffuser with one or more nozzles along a back side of the load-lock, a side surface of the load-lock, or a combination thereof; and (iii) one or more exhaust lines. Further, the thermo module can be configured to control a temperature of a gas provided to the load-lock.Type: ApplicationFiled: December 30, 2022Publication date: May 4, 2023Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Otto CHEN, Chia-Chih Chen
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Publication number: 20230074368Abstract: In various examples, sensor data may be received that represents a field of view of a sensor of a vehicle located in a physical environment. The sensor data may be applied to a machine learning model that computes both a set of boundary points that correspond to a boundary dividing drivable free-space from non-drivable space in the physical environment and class labels for boundary points of the set of boundary points that correspond to the boundary. Locations within the physical environment may be determined from the set of boundary points represented by the sensor data, and the vehicle may be controlled through the physical environment within the drivable free-space using the locations and the class labels.Type: ApplicationFiled: November 10, 2022Publication date: March 9, 2023Inventors: Mansi Rankawat, Jian Yao, Dong Zhang, Chia-Chih Chen
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Patent number: 11581169Abstract: An ion collector includes a plurality of segments and a plurality of integrators. The plurality of segments are physically separated from one another and spaced around a substrate support. Each of the segments includes a conductive element that is designed to conduct a current based on ions received from a plasma. Each of the plurality of integrators is coupled to a corresponding conductive element. Each of the plurality of integrators is designed to determine an ion distribution for a corresponding conductive element based, at least in part, on the current conducted at the corresponding conductive element. An example benefit of this embodiment includes the ability to determine how uniform the ion distribution is across a wafer being processed by the plasma.Type: GrantFiled: December 5, 2019Date of Patent: February 14, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Otto Chen, Chi-Ying Wu, Chia-Chih Chen
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Patent number: 11569099Abstract: The present disclosure describes a wafer cooling/heating system that includes a load-lock and a thermo module. The load-lock uses a level stream design to improve temperature uniformity across one or more wafers during a cooling/heating process. The load-lock can include (i) a wafer holder configured to receive wafers at a front side of the load-lock; (ii) a gas diffuser with one or more nozzles along a back side of the load-lock, a side surface of the load-lock, or a combination thereof; and (iii) one or more exhaust lines. Further, the thermo module can be configured to control a temperature of a gas provided to the load-lock.Type: GrantFiled: December 17, 2020Date of Patent: January 31, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Otto Chen, Chia-Chih Chen
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Patent number: 11537139Abstract: In various examples, sensor data may be received that represents a field of view of a sensor of a vehicle located in a physical environment. The sensor data may be applied to a machine learning model that computes both a set of boundary points that correspond to a boundary dividing drivable free-space from non-drivable space in the physical environment and class labels for boundary points of the set of boundary points that correspond to the boundary. Locations within the physical environment may be determined from the set of boundary points represented by the sensor data, and the vehicle may be controlled through the physical environment within the drivable free-space using the locations and the class labels.Type: GrantFiled: March 15, 2019Date of Patent: December 27, 2022Assignee: NVIDIA CorporationInventors: Mansi Rankawat, Jian Yao, Dong Zhang, Chia-Chih Chen
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Publication number: 20220384214Abstract: A semiconductor fabrication facility is provided. The semiconductor fabrication facility includes a processing tool and a transmission assembly. The transmission assembly is connected to the processing tool and comprises a number of transmission lines used to supply electric power or a fluid to the processing tool or remove the fluid or an exhaust gas from the processing tool. The transmission lines includes a first transmission line and a second transmission line. The first transmission line has a first temperature and the second transmission line has a second temperature. The second temperature is higher than the first temperature. The first transmission line and the second transmission line are arranged such that a thermal energy of the second transmission line is able to be transmitted to the first transmission line to change the first temperature of the first transmission line.Type: ApplicationFiled: May 28, 2021Publication date: December 1, 2022Inventors: OTTO CHEN, YING-YEN TSENG, WEN-YU KU, CHIA-CHIH CHEN
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Patent number: 11082638Abstract: A live streaming system communicatively connected to a first camera, where the first camera captures an original image. The live streaming system includes a controller and an electronic device. The controller can send a prompt signal via the image captured by the first camera. The electronic device communicates with the controller and the first camera, and includes a processor and a network interface device. The processor recognizes the prompt signal in the captured image, and in response thereto, processes the original image to generate a synthesized image; it further analyzes the prompt signal to determine the location of the synthesized image. The network interface device is electrically connected to the processor and live streams the synthesized image.Type: GrantFiled: May 29, 2019Date of Patent: August 3, 2021Assignee: ATEN International Co., Ltd.Inventors: Li-Ying Wang, Yu-Ting Wang, Chia-Chih Chen, Hsiang-Jui Yu
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Publication number: 20210224556Abstract: In various examples, sensor data representative of an image of a field of view of a vehicle sensor may be received and the sensor data may be applied to a machine learning model. The machine learning model may compute a segmentation mask representative of portions of the image corresponding to lane markings of the driving surface of the vehicle. Analysis of the segmentation mask may be performed to determine lane marking types, and lane boundaries may be generated by performing curve fitting on the lane markings corresponding to each of the lane marking types. The data representative of the lane boundaries may then be sent to a component of the vehicle for use in navigating the vehicle through the driving surface.Type: ApplicationFiled: April 5, 2021Publication date: July 22, 2021Inventors: Yifang Xu, Xin Liu, Chia-Chih Chen, Carolina Parada, Davide Onofrio, Minwoo Park, Mehdi Sajjadi Mohammadabadi, Vijay Chintalapudi, Ozan Tonkal, John Zedlewski, Pekka Janis, Jan Nikolaus Fritsch, Gordon Grigor, Zuoguan Wang, I-Kuei Chen, Miguel Sainz
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Patent number: 10997433Abstract: In various examples, sensor data representative of an image of a field of view of a vehicle sensor may be received and the sensor data may be applied to a machine learning model. The machine learning model may compute a segmentation mask representative of portions of the image corresponding to lane markings of the driving surface of the vehicle. Analysis of the segmentation mask may be performed to determine lane marking types, and lane boundaries may be generated by performing curve fitting on the lane markings corresponding to each of the lane marking types. The data representative of the lane boundaries may then be sent to a component of the vehicle for use in navigating the vehicle through the driving surface.Type: GrantFiled: February 26, 2019Date of Patent: May 4, 2021Assignee: NVIDIA CorporationInventors: Yifang Xu, Xin Liu, Chia-Chih Chen, Carolina Parada, Davide Onofrio, Minwoo Park, Mehdi Sajjadi Mohammadabadi, Vijay Chintalapudi, Ozan Tonkal, John Zedlewski, Pekka Janis, Jan Nikolaus Fritsch, Gordon Grigor, Zuoguan Wang, I-Kuei Chen, Miguel Sainz
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Publication number: 20210104419Abstract: The present disclosure describes a wafer cooling/heating system that includes a load-lock and a thermo module. The load-lock uses a level stream design to improve temperature uniformity across one or more wafers during a cooling/heating process. The load-lock can include (i) a wafer holder configured to receive wafers at a front side of the load-lock; (ii) a gas diffuser with one or more nozzles along a back side of the load-lock, a side surface of the load-lock, or a combination thereof; and (iii) one or more exhaust lines. Further, the thermo module can be configured to control a temperature of a gas provided to the load-lock.Type: ApplicationFiled: December 17, 2020Publication date: April 8, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Otto CHEN, Chia-Chih Chen
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Patent number: 10872789Abstract: The present disclosure describes a wafer cooling/heating system that includes a load-lock and a thermo module. The load-lock uses a level stream design to improve temperature uniformity across one or more wafers during a cooling/heating process. The load-lock can include (i) a wafer holder configured to receive wafers at a front side of the load-lock; (ii) a gas diffuser with one or more nozzles along a back side of the load-lock, a side surface of the load-lock, or a combination thereof; and (iii) one or more exhaust lines. Further, the thermo module can be configured to control a temperature of a gas provided to the load-lock.Type: GrantFiled: September 28, 2017Date of Patent: December 22, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Otto Chen, Chia-Chih Chen