Patents by Inventor Chia-Han Chiang

Chia-Han Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220370805
    Abstract: The present disclosure provides systems and methods related to electroencephalography (EEG) electrode arrays. In particular, the present disclosure provides systems and methods relating to the manufacture and use of high-resolution electrocorticography (ECOG) electrode arrays and stereoelectroencephalography (SEEG) electrode arrays having various combinations and arrangements of microelectrodes and macroelectrodes for recording and modulating nervous system activity.
    Type: Application
    Filed: September 18, 2020
    Publication date: November 24, 2022
    Inventors: Gregory Cogan, Jonathan Viventi, Nandan Lad, Bijan Pesaran, Virginia Woods, Chia-Han Chiang, Charles Wang, Katrina Barth, Werner Doyle, Patricia Dugan, Orrin Devinsky, Sasha Devore, Daniel Friedman, Amy Orsborn, Florian Solzbacher, Robert Franklin, Sandeep Negi, Saket Mulge
  • Publication number: 20220277967
    Abstract: A wafer cassette for receiving a wafer is provided. The wafer cassette includes a cassette housing, a first supporting rib and a second supporting rib. The first supporting rib is disposed in the cassette housing, wherein the first supporting rib includes a front supporting portion, a middle supporting portion and a rear supporting portion, the front supporting portion is connected to one end of the middle supporting portion, the rear supporting portion is connected to the other end of the middle supporting portion, and the front supporting portion has a front curved edge. The second supporting rib is disposed in the cassette housing. An edge portion of the wafer is supported by the first supporting rib and the second supporting rib, and the front supporting portion, the middle supporting portion and the rear supporting portion contact the wafer simultaneously.
    Type: Application
    Filed: February 26, 2021
    Publication date: September 1, 2022
    Inventors: Chao-Chih WANG, Ya-Nan WANG, Chia-He WU, Cheng-Han CHIANG