Abstract: The present disclosure provides systems and methods related to electroencephalography (EEG) electrode arrays. In particular, the present disclosure provides systems and methods relating to the manufacture and use of high-resolution electrocorticography (ECOG) electrode arrays and stereoelectroencephalography (SEEG) electrode arrays having various combinations and arrangements of microelectrodes and macroelectrodes for recording and modulating nervous system activity.

Abstract: A wafer cassette for receiving a wafer is provided. The wafer cassette includes a cassette housing, a first supporting rib and a second supporting rib. The first supporting rib is disposed in the cassette housing, wherein the first supporting rib includes a front supporting portion, a middle supporting portion and a rear supporting portion, the front supporting portion is connected to one end of the middle supporting portion, the rear supporting portion is connected to the other end of the middle supporting portion, and the front supporting portion has a front curved edge. The second supporting rib is disposed in the cassette housing. An edge portion of the wafer is supported by the first supporting rib and the second supporting rib, and the front supporting portion, the middle supporting portion and the rear supporting portion contact the wafer simultaneously.