Abstract: An atmospheric water generator for extracting water droplets from ambient air includes an insulating substrate, a plurality of electrode film units, and a liquid crystal/polymer composite film. Each of surface regions of the liquid crystal/polymer composite film has a plurality of liquid crystal molecules each having a hydrophilic functional group and a hydrophobic moiety. Each of the surface regions normally has one of hydrophilic and hydrophobic properties. When a voltage is applied to one of the electrode film units, the respective surface region is switched to have the other one of hydrophilic and hydrophobic properties, to thereby allow the water droplets condensed from the ambient air to move on the surface regions.

Abstract: A method for uplink transmission performed by a UE is provided. The method includes: receiving a first configured grant configuration that allocates a first PUSCH duration; receiving a second configured grant configuration that allocates a second PUSCH duration, wherein the second PUSCH duration overlaps with the first PUSCH duration; obtaining a first HARQ process ID for the first PUSCH duration, then determining whether a first configured grant timer associated with the first HARQ process ID is running; obtaining a second HARQ process ID for the second PUSCH duration, then determining whether a second configured grant timer associated with the second HARQ process ID is running; and selecting one of the first PUSCH duration and the second PUSCH duration for an uplink transmission based on whether the first configured grant timer is running and whether the second configured grant timer is running.

Abstract: A polarizer substrate includes a substrate, an organic planarization layer, an inorganic buffer layer, and a plurality of strip-shaped polarizer structures. The organic planarization layer is located on the substrate. The inorganic buffer layer is located on the organic planarization layer. The inorganic buffer layer has a plurality of trenches located on a first surface. The trenches do not penetrate through the inorganic buffer layer. The strip-shaped polarizer structures are located on the first surface of the inorganic buffer layer. Each of the trenches is located between two adjacent polarizer structures. A display panel is also provided.

Abstract: A touch device has multiple charging traces distributed under the touch operation area. When the object hovers over or contacts the touch operation area, the control unit of the touch device obtains the corresponding position of the object through the sensing signal of the electrode units. The control unit in turn connect the charging traces adjacent to the corresponding position of the object to form at least one charging loop. In the process of the touch operation on the touch device, the object can be charged at the same time, and the convenience of use can be improved.

Abstract: A touch system has a touch device and an input device. The touch system executes a first mode and a second mode at different times. In the first mode, the touch device transmits a modulation signal to drive the touch electrodes and to be used as an uplink signal. The input device receives the modulation signal. In the second mode, the touch device receives the downlink signal from the input device. Thus, the touch device does not have to transmit the driving signal and the uplink signal at different times. Then the time is saved for the rest work periods so that every work periods get longer length of time.

Abstract: A touch system includes a touch device and an input device. The uplink signal transmitted by the touch device includes a timestamp. The input device transmits a downlink signal through the electrode unit and transmits a side information through a wireless communication unit. The inclusion of the corresponding timestamp in the side information ensures that the side information is combined with the corresponding downlink signal to correctly present the user's operation.

Abstract: A method of forming a semiconductor structure includes: providing a substrate; forming a first pair of source/drain regions in the substrate; disposing an interlayer dielectric layer over the substrate, the interlayer dielectric layer having a first trench between the first pair of source/drain regions; depositing a dielectric layer in the first trench; depositing a barrier layer over the dielectric layer; removing the barrier layer from the first trench to expose the dielectric layer; depositing a work function layer over the dielectric layer in the first trench; and depositing a conductive layer over the work function layer in the first trench.

Abstract: An ultrasonic probe positioning method includes acquiring a first positioning location inside the ultrasonic probe, acquiring a first foot of perpendicular location corresponding to the first positioning location on an image marginal line with a detecting depth of the ultrasonic probe, setting a first center location within a detecting coverage of the ultrasonic probe, acquiring a second foot of perpendicular location, a normal plane vector, and a plane equation corresponding to the normal plane vector of the ultrasonic probe after the ultrasonic probe is shifted with an offset and rotated with a rotating angle, generating a second center location satisfying the plane equation according to the plane equation and the first center location, and optionally displaying a spherical space corresponding to the second center location on an ultrasonic slice image according to a distance between the first center location and the second center location.

Abstract: A semiconductor device includes a dielectric interposer, a first interconnection layer, an electronic component, a plurality of electrical conductors and a plurality of conductive structures. The dielectric interposer has a first surface and a second surface opposite to the first surface. The first interconnection layer is over the first surface of the dielectric interposer. The electronic component is over and electrically connected to the first interconnection layer. The electrical conductors are over the second surface of the dielectric interposer. The conductive structures are through the dielectric interposer, wherein the conductive structures are electrically connected to the first interconnection layer and the electrical conductors.

Abstract: An airbag inflator is provided, including an inflator module, an exhaust hood, a filter element, exhaust holes, and a flow-guiding loop. The exhaust hood corresponds to one end of the inflator module to form an accommodating space in a concave shape, and the exhaust hood is set on the inflator module by the accommodating space. The filter element is disposed on the sidewall of the exhaust hood and covers the exhaust holes. The exhaust holes are disposed on the sidewall of the exhaust hood and are adjacent to the exhaust hood opposite to one end of the inflator module. One side of the flow-guiding loop is attached to the exhaust hood corresponding to one side of the inflator module, and the other side of the flow-guiding loop extending to the inflator module to form an annular convex rib.

Abstract: A spliced display including a transparent substrate, a plurality of light emitting diode modules, at least one control element and a signal transmission structure is provided. The transparent substrate has a display surface and a back surface opposite to each other. The light emitting diode modules are disposed on the back surface of the transparent substrate to be spliced with each other. Each of the light emitting diode modules includes a driving backplane and a plurality of micro light emitting diodes, and the micro LEDs are disposed in an array between the driving backplane and the transparent substrate. The control element is disposed on the transparent substrate. The control element is connected to the light emitting diode modules via the signal transmission structure, and the light emitting diode modules are connected to each other via the signal transmission structure.

Abstract: An image forming agent storage member comprises a housing, an image forming agent supply port and a fluid discharge mechanism. The housing carries the image forming agent. The image forming agent supply port is disposed on one side surface of a short side of the housing. The fluid discharge mechanism is disposed on a long side of the housing. When the image forming agent supply port receives the image forming agent filled into the housing, a fluid inside the housing is discharged through the fluid discharge mechanism. The fluid discharge mechanism comprises a shielding member, and positions of the shielding member and the image forming agent supply port on the housing do not correspond to each other. A laser printer using the image forming agent storage member is also provided.

Abstract: A polarizer substrate and manufacturing method thereof are provided. The polarizer substrate includes a substrate, a plurality of polarizer structures, a plurality of barrier structures, and a passivation layer. The polarizer structures are disposed on the substrate. Each of the polarizer structures includes a wire-grid and a capping structure disposed on the wire-grid. The barrier structures are disposed on the capping structures and not contacting with the side walls of the wire-grids. A gap between two adjacent barrier structures is smaller than a gap between two adjacent wire-grids. The passivation layer is disposed on the barrier structures.

Abstract: A circuit includes: a first swing reduction circuit coupled between an input/output pad and a buffer circuit, and a second swing reduction circuit coupled between the input/output pad and the buffer circuit. The first swing reduction circuit comprises a first transistor gated by a first bias voltage and comprises a second transistor drained by the first bias voltage. The first swing reduction circuit is configured to increase a voltage at a first node in the buffer circuit when a voltage applied on the input/output pad is equal to a first supply voltage. The second swing reduction circuit is configured to reduce a voltage at a second node in the buffer circuit when the voltage applied on the input/output pad is equal to a second supply voltage.

Abstract: A display device including a circuit substrate, a plurality of pixels, and a light-shielding layer is provided. The pixels include a plurality of light-emitting elements. The light-emitting elements are disposed on the circuit substrate and are electrically connected to the circuit substrate. The light-emitting elements in the pixels are arranged along an arrangement direction. The light-shielding layer is disposed on the circuit substrate and has a plurality of pixel apertures. The pixels are disposed in a corresponding pixel aperture. The light-shielding layer includes a plurality of first light-shielding patterns extending in the arrangement direction and a plurality of second light-shielding patterns connected to the first light-shielding patterns. The extending direction of the second light-shielding patterns is different from the extending direction of the first light-shielding patterns.

Abstract: A chassis includes a housing, a partition, a movable member and a tray. The housing includes a top plate and a bottom plate, and the top plate is opposite to the bottom plate. An accommodating space is located between the top plate and the bottom plate. The bottom plate has a through hole. The partition is disposed in the accommodating space. The movable member is connected to the partition. The movable member is configured to move between a first position and a second position. The tray includes a latch member. When the movable member is located at the first position and the tray is placed into the accommodating space, the movable member is embedded into the through hole and the latch member engages with the movable member. When the movable member is located at the second position, the movable member disengages from the through hole.

Abstract: A semiconductor device includes a dielectric interposer, a first interconnection layer, an electronic component, a plurality of electrical conductors and a plurality of conductive structures. The dielectric interposer has a first surface and a second surface opposite to the first surface. The first interconnection layer is over the first surface of the dielectric interposer. The electronic component is over and electrically connected to the first interconnection layer. The electrical conductors are over the second surface of the dielectric interposer. The conductive structures are through the dielectric interposer, wherein the conductive structures are electrically connected to the first interconnection layer and the electrical conductors.

Abstract: The application provides a temperature increasing device and a temperature increasing method. The temperature increasing device is arranged on a motherboard including at least one system element. The temperature increasing device includes a power supply module and a controller After the power supply module is triggered, the power supply module outputs an enable signal to the system element and the controller, the controller detects whether the system element operates according to a preset power-on action, if the controller determines that the system element does not operate according to the preset power-on action, the controller outputs an electric signal to enable the temperature of the system element to increase, and when the temperature of the system element is increased to an extent that the controller determines that the system element is capable of operating according to the preset power-on action, the controller stops outputting the electric signal.

Abstract: A driving mechanism includes a frame, a carrying base, and a drive module. The carrying base is disposed in the frame, and includes a carrying body, a first stop element and a second stop element. The carrying body is configured to carry an optical element. The first stop element is disposed on the carrying body, and configured to limit the range of motion of the carrying body in a first direction. The second stop element is disposed on the carrying body, and configured to limit the range of motion of the carrying body in the first direction. The driving module is disposed in the frame, and configured to move the carrying body relative to the frame. The first direction is parallel to the axis of the optical element, and the first stop element is closer to the top portion of the frame than the second stop element.