Patents by Inventor Chia-Hung Kuo

Chia-Hung Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210149337
    Abstract: An optical measurement system comprises a polarization beam splitter for dividing an incident beam into a reference beam and a measurement beam, a first beam splitter for reflecting the measurement beam to form a first reflected measurement beam, a spatial light modulator for modulating the first reflected measurement beam to form a modulated measurement beam, a condenser lens for focusing the modulated measurement beam to an object to form a penetrating measurement beam, an objective lens for converting the penetrating measurement beam into a parallel measurement beam, a mirror for reflecting the parallel measurement beam to form an object beam, a second beam splitter for reflecting the reference beam to a path coincident with that of the object beam, and a camera for receiving an interference signal generated by the reference beam and the object beam to generate an image of the object.
    Type: Application
    Filed: September 22, 2020
    Publication date: May 20, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsiang-Chun WEI, Chung-Lun KUO, Chia-Hung CHO, Chun-Wei LO, Chih-Hsiang LIU
  • Patent number: 11011501
    Abstract: A package structure including a first redistribution layer, a semiconductor die, through insulator vias, an insulating encapsulant and a second redistribution layer. The first redistribution layer includes a dielectric layer, a conductive layer, and connecting portions electrically connected to the conductive layer. The dielectric layer has first and second surfaces, the connecting portions has a first side, a second side, and sidewalls joining the first side to the second side. The first side of the connecting portions is exposed from and coplanar with the first surface of the dielectric layer. The semiconductor die is disposed on the second surface of the dielectric layer. The through insulator vias are connected to the conductive layer. The insulating encapsulant is disposed on the dielectric layer and encapsulating the semiconductor die and the through insulator vias. The second redistribution layer is disposed on the semiconductor die and over the insulating encapsulant.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: May 18, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ban-Li Wu, Ying-Cheng Tseng, Chi-Hui Lai
  • Patent number: 11000996
    Abstract: A secure extruder device includes a material delivery channel, a nozzle part, a parameter part, a thermal-control part, a material auto-destruction module and/or a parameter auto-destruction module. The material delivery channel is assembled with an extrusion part. The nozzle part is connected to the material delivery channel for ejecting material in the material delivery channel out. The parameter part provides parameters for a printing task to a microcontroller. The thermal-control part heats the nozzle part according to the parameters for the printing task. The material auto-destruction module destroys the material delivery channel after the printing task is completed. The parameter auto-destruction module destroys the parameters for the printing task after the printing task is completed. The microcontroller controls the extrusion part based on the parameters for the printing task so that the extrusion part delivers the material disposed inside the material delivery channel to the nozzle part.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: May 11, 2021
    Assignee: ADVANCED BIOMEDICAL TECHNOLOGY INC.
    Inventors: Ding-Yuan Chen, Chun-Hung Chen, Chia-Chi Ho, Sheng-Nan Kuo
  • Patent number: 10998774
    Abstract: In one example a docking mat for an electronic device comprises a first major surface on which the electronic device may be positioned, a wireless power transmitting device, and a controller comprising logic, at least partly including hardware logic, to determine a location of the electronic device on the first major surface of the docking mat, establish a communication connection with the electronic device, receive at least one charge parameter from the electronic device, and activate the wireless power transmitting device in response to a determination that the electronic device is positioned proximate the wireless power transmitting device and the at least one charge parameter indicates that the electronic device is in a condition to receive power from the wireless power transmitting device. Other examples may be described.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: May 4, 2021
    Assignee: INTEL CORPORATION
    Inventors: Hong W. Wong, Timothy Nguyen, Shaorong Zhou, Xiaoguo Liang, Chia-Hung Kuo
  • Publication number: 20210125662
    Abstract: A power management circuit suitable for a memory device and a memory device is provided. The power management circuit includes a first logic circuit, a second logic circuit, and a transmission gate. The first logic circuit is configured to receive an inverted first input signal and a second input signal and generates a first output signal. The second logic circuit is configured to receive a first input signal and the second input signal and generates a second output signal. The transmission gate is configured to receive the first output signal and generates a control signal to at least one power transistor coupled between the power management circuit and the memory device. During a standby mode, the power transistor is turned on to make a first voltage equal to a predetermined voltage and during a sleep mode, the control signal is coupled to a first voltage. The predetermined voltage is greater than the first voltage.
    Type: Application
    Filed: June 22, 2020
    Publication date: April 29, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Chen Kuo, Cheng-Hung Lee, Chi-Ting Cheng, Hua-Hsin Yu, Wei-Jer Hsieh, Yu-Hao Hsu, Yang-Syu Lin, Che-Ju Yeh
  • Patent number: 10986754
    Abstract: A heat-dissipating board structure and a circuit board module are provided. The heat-dissipating board structure includes a first board, a second board, a heat-transmitting layer and a buffering liquid. The first board has a first inner surface and the first inner surface has a plurality of first metal protrusions thereon. The second board is correspondingly engaged with the first board to form an accommodating chamber therebetween. The second board has a second inner surface and the second inner surface has a plurality of second metal protrusions thereon. The heat-transmitting layer is disposed in the accommodating chamber and arranged between the first metal protrusions and the second metal protrusions. The buffering liquid is filled in a residual space of the accommodating chamber. Therefore, the heat-dissipating board structure can meet the design requirements of a light-weight and thin electronic product and can effectively remove heat from a heat source.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: April 20, 2021
    Assignee: CAREER TECHNOLOGY MFG. CO., LTD.
    Inventors: Mou-Lin Lee, Chia-Hung Kuo
  • Patent number: 10979810
    Abstract: An audio device having a housing including a first loudspeaker disposed in the housing and oriented to emit sound towards a top of the housing, a second loudspeaker disposed in the housing and oriented to emit sound towards a bottom of the housing, and a third loudspeaker disposed in the housing and oriented to emit sound radially outward from the housing of the audio device. Embodiments may include a microphone array disposed proximate the top of the audio device and encircling the first loudspeaker.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: April 13, 2021
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventors: Giovanni Mata Magana, Alexander David Savello, Chia Hung Kuo, Thompson Quang-Tue Nguyen, Danny Chan, Albert John Yu Sam Chua
  • Patent number: 10958997
    Abstract: A portable audio input/output device may include one or more openings that extend through a cover of the device and allow acoustic signals outside a housing of the device to reach a microphone disposed within the housing. The opening(s) may be illuminated by a light guide disposed within the housing, which scatters light emitted from lights disposed within the housing. In some instances, a hole may pass through a printed circuit board to allow acoustic signals to be received by the microphone disposed below the printed circuit board. An input/output (I/O) interface module with multiple buttons and inputs may be installed in the hole. The multiple buttons and I/O ports of the I/O interface module may be aligned along an axis vertical relative to the housing and centered with respect to each other.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: March 23, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Christopher Mann Chamberlin, Chia Hung Kuo, Jacob William Beatty, Duane Everard Whyte, Adrian Roy Ramiscal Santos, Isabella Talley Lewis
  • Patent number: 10951967
    Abstract: Systems, methods, and computer-readable media are disclosed for voice-controlled multimedia devices and universal remotes. In one embodiment, an example device may include a housing, a first circuit board, a second circuit board, a first infrared light emitting diode (LED) positioned on the first circuit board and configured to emit infrared light in a first direction, a second infrared LED positioned on the first circuit board and configured to emit infrared light in a second direction opposite the first direction, a microphone disposed on the second circuit board, and an HDMI port.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: March 16, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Joshua Lemons, Giovanni Mata Magana, Miguel Virgen, Thompson Quang-Tue Nguyen, Chia Hung Kuo, Yao Xue
  • Patent number: 10877921
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to facilitate communication with electronic devices supported by an interface specification and electronic devices unsupported by the interface specification. An example apparatus includes a first firmware interface to facilitate communication between an operating system and a first electronic device, the first electronic device supported in an interface specification. The example apparatus includes a second firmware interface instantiated to facilitate communication with a second electronic device that is not supported in the interface specification, the second firmware interface configured to communicate with the first firmware interface to route communication between the operating system and the second electronic device via the first firmware interface and the second firmware interface.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: December 29, 2020
    Assignee: Intel Corporation
    Inventors: Nivedita Aggarwal, Reuven Rozic, Amir Levy, Chia-Hung Kuo
  • Patent number: 10860083
    Abstract: In one embodiment, a system on chip includes: at least one core; a plurality of intellectual property (IP) agents coupled to the at least one core; a shared power rail to provide an operating voltage to the plurality of IP agents; and a power controller, in response to an indication that the plurality of IP agents are in an idle state and the at least one core is in an active state, to power down the shared power rail while the at least one core remains in the active state. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: December 8, 2020
    Assignee: Intel Corporation
    Inventors: Vijay S. R. Degalahal, Pronay Dutta, Robert Gough, Panner Kumar, Chia-Hung Kuo, Karthi Vadivelu
  • Patent number: 10831658
    Abstract: Provided are an apparatus and method to cache data in a first memory that is stored in a second memory. At least one read-with-invalidate command is received to read and invalidate at least one portion of a cache line having modified data. The cache line having modified data is invalidated in response to receipt of read-with-invalidate commands for less than all of the portions of the cache line.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: November 10, 2020
    Assignee: INTEL CORPORATION
    Inventors: Yanru Li, Chia-Hung Kuo, Ali Taha
  • Publication number: 20200304914
    Abstract: An audio device having a housing including a first loudspeaker disposed in the housing and oriented to emit sound towards a top of the housing, a second loudspeaker disposed in the housing and oriented to emit sound towards a bottom of the housing, and a third loudspeaker disposed in the housing and oriented to emit sound radially outward from the housing of the audio device. Embodiments may include a microphone array disposed proximate the top of the audio device and encircling the first loudspeaker.
    Type: Application
    Filed: March 19, 2019
    Publication date: September 24, 2020
    Inventors: Giovanni Mata Magana, Alexander David Savello, Chia Hung Kuo, Thompson Quang-Tue Nguyen, Danny Chan, Albert John Yu Sam Chua
  • Publication number: 20200303967
    Abstract: In one example a docking mat for an electronic device comprises a first major surface on which the electronic device may be positioned, a wireless power transmitting device, and a controller comprising logic, at least partly including hardware logic, to determine a location of the electronic device on the first major surface of the docking mat, establish a communication connection with the electronic device, receive at least one charge parameter from the electronic device, and activate the wireless power transmitting device in response to a determination that the electronic device is positioned proximate the wireless power transmitting device and the at least one charge parameter indicates that the electronic device is in a condition to receive power from the wireless power transmitting device. Other examples may be described.
    Type: Application
    Filed: July 21, 2016
    Publication date: September 24, 2020
    Applicant: INTEL CORPORATION
    Inventors: Hong W. WONG, Timothy NGUYEN, Shaorong ZHOU, Xiaoguo LIANG, Chia-Hung KUO
  • Publication number: 20200275583
    Abstract: A heat-dissipating board structure and a circuit board module are provided. The heat-dissipating board structure includes a first board, a second board, a heat-transmitting layer and a buffering liquid. The first board has a first inner surface and the first inner surface has a plurality of first metal protrusions thereon. The second board is correspondingly engaged with the first board to form an accommodating chamber therebetween. The second board has a second inner surface and the second inner surface has a plurality of second metal protrusions thereon. The heat-transmitting layer is disposed in the accommodating chamber and arranged between the first metal protrusions and the second metal protrusions. The buffering liquid is filled in a residual space of the accommodating chamber. Therefore, the heat-dissipating board structure can meet the design requirements of a light-weight and thin electronic product and can effectively remove heat from a heat source.
    Type: Application
    Filed: June 3, 2019
    Publication date: August 27, 2020
    Inventors: MOU-LIN LEE, CHIA-HUNG KUO
  • Publication number: 20200225722
    Abstract: Apparatus and methods for managing power consumption of a data-path in a computer system are provided, the data-path comprising a first port and a second port, the first port comprising a high-speed and the second port comprising a low-speed port. The disclosed method including connecting a device to the data-path, determining that the connected device is to communicate using the second port and turning off an active circuit associated with the first port of the data-path.
    Type: Application
    Filed: January 25, 2018
    Publication date: July 16, 2020
    Inventors: CHEE LIM NGE, CHIA-HUNG KUO, NIVEDITA AGGARWAL, VENKATARAMANI GOPALAKRISHNAN, ROBERT GOUGH, BASAVARAJ ASTEKAR, VIJAYKUMAR KADGI
  • Patent number: 10715894
    Abstract: A portable audio input/output device may include an assembly enclosure that contains electrical and mechanical components of the device. A substantially cylindrical frame may encircle the assembly enclosure and may be surrounded by a tube of seamless material. A top end of the tube of seamless material may fold over a top end of the substantially cylindrical frame, and a bottom end of the tube of seamless material may fold over a bottom end of the substantially cylindrical frame. A cover assembly may couple to a top end of the assembly enclosure and secure the top end of the seamless fabric. A charging foot may be coupled to a bottom end of the assembly enclosure and secure the bottom end of the seamless fabric.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: July 14, 2020
    Assignee: Amazon Technologies, Inc.
    Inventors: Christopher Mann Chamberlin, Chia Hung Kuo, Jacob William Beatty, Duane Everard Whyte, Adrian Roy Ramiscal Santos, Tony David, Albert John Yu Sam Chua
  • Patent number: 10521386
    Abstract: Various techniques for enabling the control and monitoring of a USB device mode controller to a USB-C connector, for the performance of a USB device mode data connection, are disclosed herein. In an example, a computing system that includes multiple USB-C connectors but a single USB device mode controller may manage the availability of the controller to a particular connector. The computing system may determine availability of a USB device mode controller to control the first USB-C connector, wherein the attempted data connection occurs with the first USB-C connector configured as an upstream facing port. The computing system may further perform, in response, a data role swap of the first USB-C connector to configure the first USB-C connector as a downstream facing port. The computing system may, further continue the attempted data connection with the remote computing system via the first USB-C connector configured as a downstream facing port.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: December 31, 2019
    Assignee: Intel Corporation
    Inventors: Vijaykumar B. Kadgi, Tin-Cheung Kung, Nivedita Aggarwal, Chia-Hung Kuo, Prashant Sethi
  • Publication number: 20190364349
    Abstract: A portable audio input/output device may include one or more openings that extend through a cover of the device and allow acoustic signals outside a housing of the device to reach a microphone disposed within the housing. The opening(s) may be illuminated by a light guide disposed within the housing, which scatters light emitted from lights disposed within the housing. In some instances, a hole may pass through a printed circuit board to allow acoustic signals to be received by the microphone disposed below the printed circuit board. An input/output (I/O) interface module with multiple buttons and inputs may be installed in the hole. The multiple buttons and I/O ports of the I/O interface module may be aligned along an axis vertical relative to the housing and centered with respect to each other.
    Type: Application
    Filed: August 8, 2019
    Publication date: November 28, 2019
    Inventors: Christopher Mann Chamberlin, Chia Hung Kuo, Jacob William Beatty, Duane Everard Whyte, Adrian Roy Ramiscal Santos, Isabella Talley Lewis
  • Patent number: 10425712
    Abstract: A portable audio input/output device may include one or more openings that extend through a cover of the device and allow acoustic signals outside a housing of the device to reach a microphone disposed within the housing. The opening(s) may be illuminated by a light guide disposed within the housing, which scatters light emitted from lights disposed within the housing. In some instances, a hole may pass through a printed circuit board to allow acoustic signals to be received by the microphone disposed below the printed circuit board. An input/output (I/O) interface module with multiple buttons and inputs may be installed in the hole. The multiple buttons and I/O ports of the I/O interface module may be aligned along an axis vertical relative to the housing and centered with respect to each other.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: September 24, 2019
    Assignee: Amazon Technologies, Inc.
    Inventors: Christopher Mann Chamberlin, Chia Hung Kuo, Jacob William Beatty, Duane Everard Whyte, Adrian Roy Ramiscal Santos, Isabella Talley Lewis