Patents by Inventor Chia-Hung Lin

Chia-Hung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11122699
    Abstract: An input connection device for an electronic device is provided. The electronic device includes a mother circuit board and a cabinet having a first wall. The input connection device comprises an insulation housing, a conductive connection unit, a circuit board, a switch, a first power wire and a second power wire. The insulation housing is disposed on the first wall and comprises a main body comprising a hollow channel. The conductive connection unit is disposed in the hollow channel and is engaged with the insulation housing. The circuit board is connected with the conductive connection unit directly. The switch has an input part and an output part. The first power wire is connected with the circuit board and the input part of the switch. The second power wire is connected with the output part of the switch and the mother circuit board.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: September 14, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Sheng-Kuo Lin, Chia-Hao Yeh, Xin-Hung Lin
  • Publication number: 20210280511
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Application
    Filed: May 10, 2021
    Publication date: September 9, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Publication number: 20210281037
    Abstract: In an embodiment, a device includes: a first reflective structure including first doped layers of a semiconductive material, alternating ones of the first doped layers being doped with a p-type dopant; a second reflective structure including second doped layers of the semiconductive material, alternating ones of the second doped layers being doped with a n-type dopant; an emitting semiconductor region disposed between the first reflective structure and the second reflective structure; a contact pad on the second reflective structure, a work function of the contact pad being less than a work function of the second reflective structure; a bonding layer on the contact pad, a work function of the bonding layer being greater than the work function of the second reflective structure; and a conductive connector on the bonding layer.
    Type: Application
    Filed: April 26, 2021
    Publication date: September 9, 2021
    Inventors: Chen-Hua Yu, An-Jhih Su, Chia-Nan Yuan, Shih-Guo Shen, Der-Chyang Yeh, Yu-Hung Lin, Ming Shih Yeh
  • Publication number: 20210280693
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a first well region, a second well region, an isolation structure, and a gate structure. The first well region is disposed in the substrate. The second well region is disposed in the substrate. The second well region is adjoining the first well region. The isolation structure is disposed in the first well region. The gate structure is disposed on the substrate. The gate structure includes a first gate portion and a second gate portion. The first gate portion overlaps the first well region and the second well region. There is an opening between the first gate portion and the second gate portion exposing a portion of the isolation structure.
    Type: Application
    Filed: March 4, 2020
    Publication date: September 9, 2021
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Chih-Hung LIN, Chia-Hao LEE
  • Patent number: 11110129
    Abstract: A method for treating a multiple sclerosis is provided. The method includes administering a composition containing a plurality of mesenchymal stem cells to a subject in need for a treatment of the multiple sclerosis, in which each of the mesenchymal stem cells expresses insulin-like growth factor 1 receptors.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: September 7, 2021
    Assignee: China Medical University
    Inventors: Woei-Cherng Shyu, Chen-Huan Lin, Wei Lee, Chia-Hung Hsieh, Chung-Y Hsu, Chang-Hai Tsai
  • Patent number: 11099692
    Abstract: A sensor device has a plurality of electrode portions configured to provide one or more electrical signals and a non-conductive material provided on or over the plurality of electrode portions. The one or more electrical signals are provided in response to a change in capacitance between (i) at least one of the plurality of electrode portions and a conductive object being near to or in contact with the non-conductive material, and/or (ii) at least one of the plurality of electrode portions and at least one other of the plurality of electrode portions. A system comprising the sensor device and method of manufacturing the sensor device are also provided.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: August 24, 2021
    Assignee: Tangi0 Limited
    Inventors: Chia-hung Lin, Ilan Johan Eduardo Olivarez Correa, Liucheng Guo, Ming Kong
  • Patent number: 11012419
    Abstract: A system including a network communication device, a storage device, and a controller is provided. The storage device stores first mappings between IP addresses and devices, and second mappings between software and devices. The controller obtains a connection log from the proxy server or the firewall device via the network communication device, uses the first mappings and the second mappings to analyze the connection log to determine one or more different connections between connections of devices on which first software is installed and connections of devices on which the first software is not installed, determines whether the first software functions normally on a first device blocking the different connections, and adds destination addresses of the different connections into a blocking list in response to the first software functioning normally on the first device, such that the proxy server or the firewall device blocks all connections towards the destination addresses.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: May 18, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chen-Chung Lee, Chia-Hung Lin, Cheng-Yao Wang, Jen-Hung Chang, Ming-Jen Chen
  • Publication number: 20210135052
    Abstract: A semiconductor device is provided, which includes a first semiconductor structure, a second semiconductor structure, and an active region. The first semiconductor structure includes a first dopant. The second semiconductor structure is located on the first semiconductor structure and includes a second dopant different from the first dopant. The active region includes a plurality of semiconductor pairs and is located between the first semiconductor structure and the second semiconductor structure. One of the plurality of semiconductor pairs has a barrier layer and a well layer and includes the first dopant. The barrier layer has a first thickness and a first Al content, and the well layer has a second thickness and a second Al content, the second thickness is less than the first thickness, and the second Al content is less than the first Al content.
    Type: Application
    Filed: November 4, 2020
    Publication date: May 6, 2021
    Inventors: Yen-Chun Tseng, Kuo-Feng Huang, Shih-Chang Lee, Ming-Ta Chin, Shih-Nan Yen, Cheng-Hsing Chiang, Chia-Hung Lin, Cheng-Long Yeh, Yi-Ching Lee, Jui-Che Sung, Shih-Hao Cheng
  • Patent number: 10970244
    Abstract: A smart interface circuit includes: a first protocol processing circuit receiving several first protocol commands including a first command and a second command from a first device, storing the commands in an instruction register that is accessible to a second protocol processing circuit, and outputting first data and second data stored in a data buffer to the first device according to the first command and the second command respectively; and the second protocol processing circuit generating X second protocol command(s) according to the first command to request a second device to output the first data to the data buffer, and before the first protocol processing circuit finishes outputting the first data to the first device, the second protocol processing circuit generating Y second protocol command(s) according to the second command to request the second device to output the second data to the data buffer.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: April 6, 2021
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Chia-Hung Lin, Min-Yu Tseng
  • Publication number: 20210076779
    Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.
    Type: Application
    Filed: September 15, 2020
    Publication date: March 18, 2021
    Inventors: CHUN-CHIEH CHEN, YI-MIN CHEN, CHIA-HUNG LIN, HSIEN-KUANG WU, HUNG-YU WU
  • Publication number: 20210076780
    Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.
    Type: Application
    Filed: September 15, 2020
    Publication date: March 18, 2021
    Inventors: CHUN-CHIEH CHEN, YI-MIN CHEN, CHIA-HUNG LIN, HSIEN-KUANG WU, HUNG-YU WU
  • Publication number: 20210076781
    Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.
    Type: Application
    Filed: September 15, 2020
    Publication date: March 18, 2021
    Inventors: CHUN-CHIEH CHEN, YI-MIN CHEN, CHIA-HUNG LIN, HSIEN-KUANG WU, HUNG-YU WU
  • Publication number: 20210076812
    Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.
    Type: Application
    Filed: September 15, 2020
    Publication date: March 18, 2021
    Inventors: CHUN-CHIEH CHEN, YI-MIN CHEN, CHIA-HUNG LIN, HSIEN-KUANG WU, HUNG-YU WU
  • Patent number: 10936028
    Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: March 2, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chih-Chin Chien, I-Feng Hsu, Ching-Chung Chen, Tse-Yang Lin, Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh, Chin-Hsien Chang, Chin-Yuan Chuang, Chia-Hung Lin
  • Publication number: 20210053512
    Abstract: A control system for a vehicle interior comprising a control element for a user to interact with is provided. The control element may comprise a sensing electrode configured to provide one or more electrical signals and a non-conductive cover material provided on or over the sensing electrode. The sensing electrode may be formed of or comprise a conductive plastic. The non-conductive cover material may be formed of or comprise a non-conductive plastic. The non-conductive cover material may be or comprise an outer layer, over-layer or skin of the control element. The non-conductive cover material may provide one or more touch interactive surfaces of the control element.
    Type: Application
    Filed: August 24, 2020
    Publication date: February 25, 2021
    Inventors: Francesca PERONA, Ming KONG, Jose RODRIGUEZ JAVALOYES, Chia-hung LIN, Ilan OLIVAREZ CORREA, Hamidreza NIKKHOU SARIGHIEH
  • Publication number: 20210029062
    Abstract: A network packet receiving device that includes packet queues, a credit allocation circuit and a credit management circuit is provided. Each of the packet queues corresponds to a packet transmission channel and receives packets. The credit allocation circuit calculates packet amount of each of the packet queues to control the descriptor credit of each of the packet queues within a credit range. The credit management circuit points each of public entries of a public link list to one of descriptors in a single descriptor buffer. The credit management circuit further receives a credit requesting command from the packet queues to assign the descriptors to the packet queues through the public entries under the condition that the descriptor credit is within a credit range such that a DMA circuit performs a DMA operation on the packets according to the descriptors.
    Type: Application
    Filed: July 23, 2020
    Publication date: January 28, 2021
    Inventors: Xi-Cheng SHAN, Jie WANG, Chang-Chun LI, Chia-Hung LIN, Guan-Yu LIU, Shan CHE, Jian-Jun WANG, Jun-Da SHI
  • Publication number: 20200372518
    Abstract: A method for determining a number of software licenses is provided. The method is used in an electronic device and includes: obtaining the number of software license and a full utilization rate of the software in a preset period; obtaining a number of employee who works overtime, a number of overtime hours, amount of time spent using the software, and the cost related to the overtime in the preset period; computing an opportunity cost based on the number of employee who works overtime, the number of overtime hours, the amount of time spent using the software and the cost related to the overtime; determining an expected increase in number of the software licenses according to the opportunity cost and the full utilization rate.
    Type: Application
    Filed: October 21, 2019
    Publication date: November 26, 2020
    Inventors: Chen-Chung LEE, Chia-Hung LIN, Hung-Yu YANG, Ming-Jen CHEN
  • Publication number: 20200336440
    Abstract: A data transmission method for a data transmission system including a host and a peripheral device is disclosed, including: setting at least one identification number to at least one packet stored in the host; transmitting the at least one packet from the host to the peripheral device; allocating the at least one packet to plural temporary blocks of a memory of the peripheral device corresponding to the at least one identification number according to the at least one identification number of the at least one packet. Each of the temporary blocks includes a threshold value, and the threshold value of each of at least two of the temporary blocks are different; and transmitting part of the at least one packet stored in one of the temporary blocks when the one of the temporary blocks reaches the threshold value of the one of the temporary blocks.
    Type: Application
    Filed: April 2, 2020
    Publication date: October 22, 2020
    Inventors: Shih-Chiang CHU, Chia-Hung LIN, Zhen-Ting HUANG, Er-Zih WONG
  • Patent number: 10812205
    Abstract: An antenna performance evaluation method is disclosed. The method includes the following steps: measuring plurality of throughput values of the to-be-tested antenna at the first angle under different average radiation signal-to-interference ratio (SIR). The average radiation SIR and throughput values are fitted to output the first fitted curve. The second throughput value is measured at a certain average radiation SIR of the second angle of the to-be-tested antenna. Calculating a difference value between the first throughput value and the second throughput value corresponding to the same average radiation SIR, and the difference value and the first fitting curve constitute the transition second fitting curve. Selecting different average radiation SIR is repeatedly, and measure the corresponding second throughput value, and the corresponding difference value is calculated to update the transition second fitting curve.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: October 20, 2020
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Ta-Sung Lee, Chia-Hung Lin, Yu-Chien Lin, Yi-Wei Chen
  • Patent number: 10762017
    Abstract: Disclosed is a USB transmission system capable of classifying transmission data with a device so as to allow a host to use the transmission data easily. The USB transmission system includes a USB device and a host. The USB device parses the header of an input packet to find out the type of the input packet, tags the input packet with one of identifications according to the type of the input packet, and then outputs the input packet to the host. The host allocates data storage spaces of a system memory that are associated with the identifications respectively, receives the input packet, and stores the input packet in a first data storage space according to a first identification carried by the input packet, in which the first identification is one of the identifications and the first data storage space is one of the data storage spaces.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: September 1, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Shih-Chiang Chu, Chia-Hung Lin, Zhen-Ting Huang, Er-Zih Wong