Patents by Inventor Chia-jung Liu
Chia-jung Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230263813Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.Type: ApplicationFiled: September 16, 2022Publication date: August 24, 2023Inventors: Chia-Yu CHANG, Shinn-Zong LIN, Hsiao-Chien TING, Hui-I YANG, Horng-Jyh HARN, Hong-Lin SU, Ching-Ann LIU, Yu-Shuan CHEN, Tzyy-Wen CHIOU, Tsung-Jung HO
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Publication number: 20230070726Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.Type: ApplicationFiled: November 16, 2022Publication date: March 9, 2023Inventors: Sheng-Nan TSAI, Ying-Chung CHUANG, Chia-Jung LIU, Yi-Wei CHEN, Han-Yu TAI, Shao-Hsiang LO
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Patent number: 11557625Abstract: An image sensor with embedded wells for accommodating light emitters includes a semiconductor substrate including an array of doped sensing regions respectively corresponding to an array of photosensitive pixels of the image sensor. The semiconductor substrate forms an array of wells. Each well is aligned with a respective doped sensing region to facilitate detection, by the photosensitive pixel that includes said respective doped sensing region, of light emitted to the photosensitive pixel by a light emitter disposed in the well. The image sensor further includes, between adjacent doped sensing regions, a light-blocking barrier to reduce propagation of light to the doped sensing-region of each photosensitive pixel from wells not aligned therewith.Type: GrantFiled: April 20, 2020Date of Patent: January 17, 2023Assignee: OmniVision Technologies, Inc.Inventors: Chia-Ying Liu, Wu-Zang Yang, Chia-Jung Liu, Ming Zhang, Yin Qian, Alireza Bonakdar
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Patent number: 11543430Abstract: A probe assembly, adapted to test high-speed signal transmission lines of printed circuit boards, includes two pogo pins for providing high-frequency differential test signals, and both sides of the pogo pin include no metal layer (grounding layer). Experiments have found that when the two pogo pins test a to-be-tested object, the test signal will be coupled to the metal layers on both sides of the pogo pins to generate a radiation resonance, resulting in a loss of the test signal on a specific frequency band, and further reducing the effective bandwidth of the probe assembly. The metal layers on both sides of the pogo pins of the probe assembly are reduced, so that the foregoing radiation resonance phenomenon can be avoided.Type: GrantFiled: September 8, 2021Date of Patent: January 3, 2023Assignee: MPI CORPORATIONInventors: Ming-Hsiang Hsieh, Chia-Nan Chou, Hao Wei, Chia-Jung Liu, Chia-An Yu
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Patent number: 11547026Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.Type: GrantFiled: April 1, 2021Date of Patent: January 3, 2023Assignee: DELTA ELECTRONICS, INC.Inventors: Sheng-Nan Tsai, Ying-Chung Chuang, Chia-Jung Liu, Yi-Wei Chen, Han-Yu Tai, Shao-Hsiang Lo
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Publication number: 20220087077Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.Type: ApplicationFiled: April 1, 2021Publication date: March 17, 2022Inventors: Sheng-Nan TSAI, Ying-Chung CHUANG, Chia-Jung LIU, Yi-Wei CHEN, Han-Yu TAI, Shao-Hsiang LO
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Publication number: 20220074970Abstract: A probe assembly, adapted to test high-speed signal transmission lines of printed circuit boards, includes two pogo pins for providing high-frequency differential test signals, and both sides of the pogo pin include no metal layer (grounding layer). Experiments have found that when the two pogo pins test a to-be-tested object, the test signal will be coupled to the metal layers on both sides of the pogo pins to generate a radiation resonance, resulting in a loss of the test signal on a specific frequency band, and further reducing the effective bandwidth of the probe assembly. The metal layers on both sides of the pogo pins of the probe assembly are reduced, so that the foregoing radiation resonance phenomenon can be avoided.Type: ApplicationFiled: September 8, 2021Publication date: March 10, 2022Applicant: MPI CorporationInventors: Ming-Hsiang Hsieh, Chia-Nan Chou, Hao Wei, Chia-Jung Liu, Chia-An Yu
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Patent number: 11201124Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor substrate and a first deep trench isolation (DTI) structure filled with a dielectric material formed on the semiconductor substrate. The first DTI structure is disposed in the first seal ring region and is extended into the semiconductor substrate. The semiconductor substrate has a pixel array region and a first seal ring region. The first seal ring region is proximate to an edge of the semiconductor substrate and surrounds the pixel array region. The first DTI structure is formed in the first seal ring region and surrounds the pixel array region.Type: GrantFiled: July 29, 2019Date of Patent: December 14, 2021Assignee: OMNIVISION TECHNOLOGIES, INC.Inventors: Chia-Ying Liu, Wu-Zang Yang, Chia-Jung Liu, Chi-Chih Huang
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Publication number: 20210327948Abstract: An image sensor with embedded wells for accommodating light emitters includes a semiconductor substrate including an array of doped sensing regions respectively corresponding to an array of photosensitive pixels of the image sensor. The semiconductor substrate forms an array of wells. Each well is aligned with a respective doped sensing region to facilitate detection, by the photosensitive pixel that includes said respective doped sensing region, of light emitted to the photosensitive pixel by a light emitter disposed in the well. The image sensor further includes, between adjacent doped sensing regions, a light-blocking barrier to reduce propagation of light to the doped sensing-region of each photosensitive pixel from wells not aligned therewith.Type: ApplicationFiled: April 20, 2020Publication date: October 21, 2021Inventors: Chia-Ying LIU, Wu-Zang YANG, Chia-Jung LIU, Ming ZHANG, Yin QIAN, Alireza BONAKDAR
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Publication number: 20210035926Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor substrate and a first deep trench isolation (DTI) structure filled with a dielectric material formed on the semiconductor substrate. The first DTI structure is disposed in the first seal ring region and is extended into the semiconductor substrate. The semiconductor substrate has a pixel array region and a first seal ring region. The first seal ring region is proximate to an edge of the semiconductor substrate and surrounds the pixel array region. The first DTI structure is formed in the first seal ring region and surrounds the pixel array region.Type: ApplicationFiled: July 29, 2019Publication date: February 4, 2021Inventors: CHIA-YING LIU, WU-ZANG YANG, CHIA-JUNG LIU, CHI-CHIH HUANG
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Patent number: 10739646Abstract: A reflective semiconductor device includes integrated circuitry disposed in a semiconductor layer. A first plurality of mirrors is formed in a mirror layer over the semiconductor layer, and each of the first plurality of mirrors is spaced apart from one another by at least a uniform width. A thin dielectric film layer covers sidewalls of the first plurality of mirrors and the semiconductor layer in the regions between the spaced apart first plurality of mirrors. A second plurality of mirrors are formed in the mirror layer between the thin dielectric film layer covered sidewalls of the first plurality of mirrors and over the thin dielectric film layer covering the semiconductor layer. Each one of the first and second plurality of mirrors has the uniform width, and is coupled to the integrated circuitry disposed in the semiconductor layer.Type: GrantFiled: April 30, 2019Date of Patent: August 11, 2020Assignee: OmniVision Technologies, Inc.Inventors: Ming Zhang, Yin Qian, Libo Weng, Dyson H. Tai, Chia-Ying Liu, Chia-Jung Liu
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Publication number: 20180207885Abstract: A three dimensional printing mechanism includes a plane receiving a first photocured material and a second photocured material which is different from the first photocured material. A first photocured material supplying mechanism is used for inputting the first photocured material into the plane, whereas a second photocured material supplying mechanism is used for inputting the second photocured material into the plane.Type: ApplicationFiled: April 27, 2017Publication date: July 26, 2018Inventors: Tsung-Yu Liu, Chao-Shun Chen, Chang-Chun Chen, Chia-jung Liu
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Publication number: 20160217636Abstract: Access control device includes a first electronic device and a second electronic device. The first electronic device includes a storing module and a processing module. The storing module stores an information about the visitor, and the processing module processes the information to generate an identification figure. The second electronic device includes an executing module, and the executing module determines an access permission about the visitor for entering into a restricted zone, according to the identification figure. The disclosure further provides an access control method.Type: ApplicationFiled: February 6, 2015Publication date: July 28, 2016Inventors: YI-RU LAI, SHU-MING LIU, CHIA-JUNG LIU
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Publication number: 20150205395Abstract: An electronic device includes a base member and a display member rotatably coupled to the base member. A keyboard and a touchpad are located on a working surface of the base member. The touchpad includes a middle touch area, a left touch area, and a right touch area. When the touchpad works in a full touch mode, the middle touch area, the left touch area, and the right touch area are all enabled to sense and recognize touch gestures input by a user of the electronic device. When the touchpad works in a partial touch mode, at least one of the middle touch area, the left touch area, and the right touch area is disabled from sensing and recognizing touch gestures.Type: ApplicationFiled: January 21, 2014Publication date: July 23, 2015Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: TAY-YANG LIN, CHIN-FENG CHEN, CHIA-JUNG LIU, SHU-MING LIU
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Publication number: 20140218292Abstract: An electronic device includes a touch-sensitive screen, a cursor locating module, a touch detecting module, and a user interface (UI) generating module. The cursor locating module locates a cursor in a graphical user interface (GUI) displayed on the touch-sensitive screen. The touch detecting module detects whether a point of the touch-sensitive screen corresponding to the cursor is continuously pressed for a preset time duration. When the point is continuously pressed for the preset time duration, the UI generating module generates a search UI and displays the search UI adjacent to the cursor in the GUI. A method for searching data in a touch-sensitive device is also provided.Type: ApplicationFiled: January 22, 2014Publication date: August 7, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: TAY-YANG LIN, CHIN-FENG CHEN, CHIA-JUNG LIU, SHU-MING LIU
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Publication number: 20140223551Abstract: An electronic device includes a base and a cover rotatably attached to the base. An identification unit is located on the cover. The identification unit is used to sense a gesture to rotate the cover relative to the base. The disclosure further offers a control method for the electronic device.Type: ApplicationFiled: January 22, 2014Publication date: August 7, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: TAY-YANG LIN, CHIN-FENG CHEN, SHU-MING LIU, CHIA-JUNG LIU, YI-RU LAI, PO-SUNG CHUANG
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Publication number: 20140218604Abstract: An electronic device includes a front panel, a display located on the front panel, a rear panel opposite to the front panel, a camera lens located on at least one of the front panel and the rear panel, a side flange connected between the front panel and the rear panel, and a touch strip is located on the side flange. The touch panel is configured to receive a control operation to adjust an image capturing function.Type: ApplicationFiled: January 22, 2014Publication date: August 7, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHU-MING LIU, CHIA-JUNG LIU, YI-RU LAI
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Publication number: 20140217874Abstract: An electronic device includes a cover member rotatably connected to a base member. A magnetic lock is located on a working surface of the base member. A touch-sensitive bar is located on a side surface of the base member. When the cover member and the base member are closed, the magnetic lock provides a magnetic attraction between the cover member and the base member. When the touch-sensitive bar detects a touch gesture input by a user and the touch gesture matches a predefined touch gesture, the magnetic lock releases the magnetic attraction between the cover member and the base member.Type: ApplicationFiled: January 22, 2014Publication date: August 7, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: TAY-YANG LIN, CHIN-FENG CHEN, SHU-MING LIU, CHIA-JUNG LIU, YI-RU LAI, PO-SUNG CHUANG
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Patent number: D714283Type: GrantFiled: March 26, 2013Date of Patent: September 30, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Tay-Yang Lin, Chin-Feng Chen, Chia-Jung Liu, Shu-Ming Liu, Hsin-Chih Hsu
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Patent number: D714284Type: GrantFiled: March 26, 2013Date of Patent: September 30, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Tay-Yang Lin, Chin-Feng Chen, Chia-Jung Liu, Shu-Ming Liu, Yi-Ru Lai