Patents by Inventor Chia-Te Chou

Chia-Te Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11573387
    Abstract: An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: February 7, 2023
    Inventors: Brett Sawyer, Seungjae Lee, Chia-Te Chou, Vivek Raghunathan, Vivek Raghuraman, Karlheinz Muth, David Arlo Nelson
  • Patent number: 11520112
    Abstract: An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: December 6, 2022
    Assignee: Rockley Photonics Limited
    Inventors: Yi Zhang, Chia-Te Chou, William Vis, Amit Singh Nagra, Hooman Abediasl
  • Publication number: 20220367235
    Abstract: A bonding fixture. In some embodiments, the fixture includes: a plate for supporting a central region of the wafer, the central region including 80% of the area of the wafer; and a frame for supporting: the edge of the wafer, and the edge of the plate, the frame having: a first vacuum passage, for pulling the wafer against an upper surface of the frame, and a second vacuum passage, for pulling the plate against the frame.
    Type: Application
    Filed: May 11, 2022
    Publication date: November 17, 2022
    Inventors: Moshe AMIT, Chia-Te CHOU, Arvind JAIKUMAR
  • Publication number: 20220336433
    Abstract: A siliconized heterogeneous optical engine. In some embodiments, the siliconized heterogeneous optical engine includes a photonic integrated circuit; an electro-optical chip, on a top surface of the photonic integrated circuit; an electronic integrated circuit, on the top surface of the photonic integrated circuit; an interposer, on the top surface of the photonic integrated circuit; a redistribution layer, on a top surface of the interposer, the redistribution layer including a plurality of conductive traces; and a plurality of protruding conductors, on the conductive traces of the redistribution layer. The electronic integrated circuit may be electrically connected to the electro-optical chip and to a conductive trace of the plurality of conductive traces of the redistribution layer.
    Type: Application
    Filed: September 11, 2020
    Publication date: October 20, 2022
    Inventors: SEUNGJAE LEE, Chia-Te CHOU, Vivek RAGUNATHAN, Brett SAWYER
  • Publication number: 20220262962
    Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes a substrate; a digital integrated circuit, on an upper surface of the substrate; a photonic integrated circuit, secured in a pocket of the substrate, the pocket being in the upper surface of the substrate; and an analog integrated circuit, on the photonic integrated circuit.
    Type: Application
    Filed: April 28, 2022
    Publication date: August 18, 2022
    Inventors: Gerald Cois BYRD, Thomas Pierre SCHRANS, Chia-Te CHOU, Arin ABED, Omar James BCHIR, Erman TIMURDOGAN, Aaron John ZILKIE
  • Patent number: 11387186
    Abstract: A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: July 12, 2022
    Assignee: Rockley Photonics Limited
    Inventors: Seungjae Lee, Brett Sawyer, Chia-Te Chou
  • Patent number: 11342270
    Abstract: A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: May 24, 2022
    Assignee: Rockley Photonics Limited
    Inventors: Seungjae Lee, Brett Sawyer, Chia-Te Chou
  • Publication number: 20220122924
    Abstract: An assembly. In some embodiments, the assembly includes a first semiconductor chip, a substrate, and a first alignment element. The alignment of the first semiconductor chip and the substrate may be determined at least in part by engagement of the first alignment element with a first recessed alignment feature, in a surface of the first semiconductor chip.
    Type: Application
    Filed: October 18, 2021
    Publication date: April 21, 2022
    Inventors: Chia-Te CHOU, Brett SAWYER, David MCCANN
  • Publication number: 20220109075
    Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.
    Type: Application
    Filed: December 14, 2021
    Publication date: April 7, 2022
    Inventors: Gerald Cois BYRD, Thomas Pierre SCHRANS, Chia-Te CHOU, Arin ABED, Omar James BCHIR
  • Patent number: 11262603
    Abstract: A silicon photonic integrated circuit with a heater. In some embodiments, the silicon photonic integrated circuit includes a first waveguide, on a top surface of the silicon integrated circuit, and a heater element, on the first waveguide. The heater element may include a first metal layer, on the first waveguide, and a second metal layer, on the first metal layer, the second metal layer having a different composition than the first metal layer, the second layer having a thickness of less than 300 nm.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: March 1, 2022
    Assignee: Rockley Photonics Limited
    Inventors: Yi Zhang, Chia-Te Chou, Sanna Leena Mäkelä
  • Patent number: 11262498
    Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: March 1, 2022
    Assignee: Rockley Photonics Limited
    Inventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth
  • Patent number: 11239377
    Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: February 1, 2022
    Assignee: Rockley Photonics Limited
    Inventors: Gerald Cois Byrd, Thomas Pierre Schrans, Chia-Te Chou, Arin Abed, Omar James Bchir
  • Publication number: 20220021179
    Abstract: Embodiments are directed to a photonic device that includes a first substrate defining a surface and a trench forming a depression along a portion of the surface, and a second substrate coupled with the surface and extending from the surface to form a raised portion around the trench. The photonic device can also include a laser die positioned within the trench, such that the laser die is surrounded by the second substrate, and an optical material positioned within a region between the laser die and the second substrate. The photonic device can further include a third substrate coupled with the second substrate such that the second substrate is positioned between the first substrate and the third substrate such that the second substrate is configured to at least partially isolate the laser die from mechanical stress exerted on the optical device.
    Type: Application
    Filed: July 19, 2021
    Publication date: January 20, 2022
    Inventors: SeungJae Lee, Brett Sawyer, Chia-Te Chou, Jerry Byrd, Hooman Abediasl
  • Patent number: 11054597
    Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: July 6, 2021
    Assignee: Rockley Photonics Limited
    Inventors: Vivek Raghunathan, Vivek Raghuraman, Karlheinz Muth, David Arlo Nelson, Chia-Te Chou, Brett Sawyer, SeungJae Lee
  • Publication number: 20210141172
    Abstract: An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 13, 2021
    Inventors: Yi Zhang, Chia-Te Chou, William Vis, Amit Singh Nagra, Hooman Abediasl
  • Patent number: 10921538
    Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: February 16, 2021
    Assignee: Rockley Photonics Limited
    Inventors: Vivek Raghunathan, Vivek Raghuraman, Karlheinz Muth, David Arlo Nelson, Chia-Te Chou, Brett Sawyer, SeungJae Lee
  • Patent number: 10877217
    Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: December 29, 2020
    Assignee: Rockley Photonics Limited
    Inventors: Gerald Cois Byrd, David Arlo Nelson, Javid Messian, Thomas Pierre Schrans, Chia-Te Chou, Karlheinz Muth
  • Publication number: 20200393707
    Abstract: A silicon photonic integrated circuit with a heater. In some embodiments, the silicon photonic integrated circuit includes a first waveguide, on a top surface of the silicon integrated circuit, and a heater element, on the first waveguide. The heater element may include a first metal layer, on the first waveguide, and a second metal layer, on the first metal layer, the second metal layer having a different composition than the first metal layer, the second layer having a thickness of less than 300 nm.
    Type: Application
    Filed: June 12, 2020
    Publication date: December 17, 2020
    Inventors: Yi Zhang, Chia-Te Chou, Sanna Leena Mäkelä
  • Publication number: 20200363585
    Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.
    Type: Application
    Filed: July 31, 2020
    Publication date: November 19, 2020
    Inventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth
  • Patent number: 10761262
    Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: September 1, 2020
    Assignee: ROCKLEY PHOTONICS LIMITED
    Inventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth