Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.

Abstract: The present invention provides a wireless communication method of an electronic device, wherein the electronic device includes a first radio and a second radio, a maximum bandwidth or a maximum. NSS supported by the first radio is different from a maximum bandwidth or a maximum NSS supported by the second radio. The wireless communication method includes the step of: using the first radio to communicate with another electronic device; determining if parameters of the electronic device satisfy a condition; and in response to the parameters of the electronic device satisfying the condition, enabling the second radio and using the second radio to communicate with the another electronic device, and disabling the first radio.

Abstract: A hybrid RF-acoustic relay is provided where some but not all of the incident RF power is rectified to power the relay and, optionally, to provide power for further link features. The remaining fraction of the incident RF power is used to directly drive an acoustic transceiver array in communication with one or more acoustically powered nodes. In this manner, power, control and communication can be efficiently provided to acoustically powered nodes even in situations where an RF link or an acoustic link would perform poorly.

Abstract: An overheat protection circuit able to detect and control the temperature of a electric heater includes a detecting unit, a controlling unit, and a electronic switch. The electronic switch is coupled between the electric heater and a first power supply and cuts off the power supply when overheating is electronically detected.

Abstract: A 3D printer system that uses the AM method to print a product using a plurality of materials, each of which is contained in a respective capsule. The capsules are removably inserted into respective capsule holders, each of which includes a heating device for adjusting the temperature of the material, and is releasably held in one of a plurality of stations. A tool fetches individual capsules from and deposits them to their stations, and holds individual capsules for printing the product using a telescopic extrusion apparatus. A memory stores capsule-identifying data, a processor provides position coordinates for positioning of the tool, and a controller moves the tool to the position coordinates. The capsule holders include heating systems for controlling the rheological behavior of the materials based on algorithms executed by the processor.