Patents by Inventor Chia-Yang Chang

Chia-Yang Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10915169
    Abstract: Correction method and device for an eye-tracker are provided. A non-predetermined scene frame is provided and analyzed to obtain a salient feature information, which is in-turn used to correct an eye-tracking operation. The correction can be done at the initial or during the wearing of an eye-tracker.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: February 9, 2021
    Assignee: National Taiwan University
    Inventors: Shao-Yi Chien, Chia-Yang Chang, Shih-Yi Wu
  • Patent number: 10889078
    Abstract: A method of manufacturing an optical spacer includes dispensing thermal glue within a mold; pressing the thermal glue using an optical spacer substrate to generate an optical spacer including an aperture; and, releasing the mold from the optical spacer. The thermal glue may be cured prior to releasing the mold from the optical spacer.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: January 12, 2021
    Assignee: OmniVision Technologies, Inc.
    Inventors: Tim Kao, Chia-Yang Chang, Livia Li
  • Patent number: 10868945
    Abstract: A camera module has light-field camera(s) and high resolution camera(s), the light-field camera(s) have multiple-lens arrays above an image sensor. The light-field camera(s) have a lens element at a same level as a lens element of the high resolution camera, the lens elements bearing apertures. The multiple-lens array of the light-field camera is above the image sensor at a same level as a flat transparent plate of the high resolution camera. The cameras lens cubes are made simultaneously by bonding molded lens plates and spacer plates, the lens plates and spacer plates including an upper lens plate having upper light-field camera lens elements and upper high resolution camera lens elements with applied apertures, multiple spacer plates, a microlens plate bearing an array of microlenses in the light-field cameras, the microlens plate being flat and transparent in areas of the high resolution camera.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: December 15, 2020
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Jau-Jan Deng, Chia-Yang Chang, Wei-Feng Lin
  • Publication number: 20200322507
    Abstract: A camera module has light-field camera(s) and high resolution camera(s), the light-field camera(s) have multiple-lens arrays above an image sensor. The light-field camera(s) have a lens element at a same level as a lens element of the high resolution camera, the lens elements bearing apertures. The multiple-lens array of the light-field camera is above the image sensor at a same level as a flat transparent plate of the high resolution camera. The cameras lens cubes are made simultaneously by bonding molded lens plates and spacer plates, the lens plates and spacer plates including an upper lens plate having upper light-field camera lens elements and upper high resolution camera lens elements with applied apertures, multiple spacer plates, a microlens plate bearing an array of microlenses in the light-field cameras, the microlens plate being flat and transparent in areas of the high resolution camera.
    Type: Application
    Filed: April 8, 2019
    Publication date: October 8, 2020
    Inventors: Teng-Sheng Chen, Jau-Jan DENG, Chia-Yang CHANG, Wei-Feng LIN
  • Patent number: 10734437
    Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: August 4, 2020
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Chia-Yang Chang, Yi Qin
  • Publication number: 20200167957
    Abstract: Correction method and device for an eye-tracker are provided. A non-predetermined scene frame is provided and analyzed to obtain a salient feature information, which is in-turn used to correct an eye-tracking operation. The correction can be done at the initial or during the wearing of an eye-tracker.
    Type: Application
    Filed: March 11, 2019
    Publication date: May 28, 2020
    Inventors: Shao-Yi Chien, Chia-Yang Chang, Shih-Yi Wu
  • Patent number: 10611108
    Abstract: A wafer-level method for manufacturing yardless lenses includes (a) depositing light-curable lens resin between a mold and a first side of a transparent substrate, wherein the first side of the transparent substrate has an opaque coating with a plurality of apertures respectively aligned with a plurality of lens-shaped recesses of the mold, and (b) exposing a second side of the transparent substrate, facing away from the first side, to light, thereby illuminating portions of the light-curable lens resin aligned with the plurality of apertures to form a respective plurality of yardless lenses.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: April 7, 2020
    Assignee: OmniVision Technologies, Inc.
    Inventors: Mao-Chin Wang, Chia-Yang Chang, Shao-Fan Kao
  • Patent number: 10459189
    Abstract: A method for forming a lens barrel includes aligning each of a plurality of upper apertures of an upper wafer to (i) a respective one of a plurality of middle apertures of a middle wafer and (ii) a respective one of a plurality of lower apertures of a lower wafer. The middle wafer is between the upper wafer and the lower wafer. The method also includes bonding the middle wafer to the upper wafer to form a lens barrel wafer. Each triad of co-aligned upper, middle, and lower apertures forms a wafer aperture spanning between a top surface of the upper wafer and a bottom surface of the lower wafer. Each upper aperture has a respective upper width and each middle aperture has a respective middle width less than the respective upper width to form, in each triad, a ledge for supporting a lens in the upper aperture.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: October 29, 2019
    Assignee: OmniVision Technologies, Inc.
    Inventors: Chia-Yang Chang, Teng-Sheng Chen
  • Publication number: 20190181179
    Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.
    Type: Application
    Filed: February 4, 2019
    Publication date: June 13, 2019
    Inventors: Teng-Sheng Chen, Chia-Yang Chang, Yi Qin
  • Patent number: 10217789
    Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: February 26, 2019
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Chia-Yang Chang, Yi Qin
  • Patent number: 10204947
    Abstract: A cover-glass-free array camera with individually light-shielded cameras includes an image sensor array having a plurality of photosensitive pixel arrays formed in a silicon substrate, and a lens array bonded to the silicon substrate, wherein the lens array includes (a) a plurality of imaging objectives respectively registered to the photosensitive pixel arrays to form respective individual cameras therewith, and (b) a first opaque material between each of the imaging objectives to prevent crosstalk between individual cameras.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: February 12, 2019
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Jau-Jan Deng, Chia-Yang Chang, Wei-Feng Lin
  • Patent number: 10187560
    Abstract: A notched-spacer camera module includes a chip-scale package, a lens plate, a spacer ring, and a glue ring. The chip-scale package has an image sensor and a top surface. The spacer ring includes a glue gate having a gate height and a spacer base, having a base height, between the glue gate and the lens plate. The glue ring is between the spacer ring and the top surface and has (i) an outer region between the top surface and a bottom surface of the spacer base, and (ii) an inner region, having an inner thickness, between the top surface and a bottom surface of the glue gate. The lens plate, the spacer ring, the glue ring, and the top surface form a sealed cavity having a cavity height equal to at least a sum of the inner thickness, the gate height, and the base height.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: January 22, 2019
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Chia-Yang Chang, Yi Qin
  • Patent number: 10157943
    Abstract: Trenched-bonding-dam devices and corresponding methods of manufacture are provided. A trenched-bonding-dam device includes a bonding dam structure positioned upon a top surface of a substrate. The bonding dam structure has a bottom surface attached to a top surface of the substrate, an inner dam surrounded by an outer dam, and a trench between the inner and outer dams. The device may further include an optics system including a lens and an adhesive positioned within a bonding region between a bottom surface of the optics system and a top surface of at least one of the inner and outer dams. The trench may be dimensioned to receive a portion of the excess adhesive flowing laterally out of the bonding region during bonding of the substrate to the optics system, laterally confining the excess adhesive and reducing lateral bleeding of the adhesive.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: December 18, 2018
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Chih-Hung Tu, Kuei-Cheng Liang, Chia-Yang Chang
  • Patent number: 10121820
    Abstract: A method of processing an image sensor system, comprising steps of placing a first cover member on top of an image sensor; coating the image sensor and the first cover member with a dark coating agent; removing the first cover member from the image sensor; placing a second cover member on top of the image sensor; affixing the image sensor on to a permanent mount to form an electrical coupling between the image sensor and the permanent mount; removing the second cover member from the image sensor; wherein the first cover member completely covers a top portion of the image sensor; and wherein the second cover member includes an internal rib configured to form a contact seal with the image sensor.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: November 6, 2018
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Yuan-Wen Cheng, Chia-Yang Chang, Yi Qin, Wen-Jian Xia
  • Patent number: 9952415
    Abstract: A trenched-substrate based lens manufacturing method includes depositing lens material on a first side of a substrate, wherein the first side of the substrate has a plurality of trenches. The method further includes shaping a plurality of lens elements from the lens material. The method includes shaping the plurality of lens elements, on a respective plurality of surface portions of the first side, by contacting a mold to the first side. Each of the surface portions are adjacent a respective one of the trenches. Additionally, the method includes accommodating an excess portion of the lens material in the trenches. A lens system, manufactured using this method, includes a substrate with a planar surface and a trench embedded in the planar surface. The lens system further includes a lens element molded on the planar surface adjacent to the trench.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: April 24, 2018
    Assignee: OmniVision Technologies, Inc.
    Inventors: Shao Fan Kao, Chia-Yang Chang
  • Publication number: 20180095235
    Abstract: A method for forming a lens barrel includes aligning each of a plurality of upper apertures of an upper wafer to (i) a respective one of a plurality of middle apertures of a middle wafer and (ii) a respective one of a plurality of lower apertures of a lower wafer. The middle wafer is between the upper wafer and the lower wafer. The method also includes bonding the middle wafer to the upper wafer to form a lens barrel wafer. Each triad of co-aligned upper, middle, and lower apertures forms a wafer aperture spanning between a top surface of the upper wafer and a bottom surface of the lower wafer. Each upper aperture has a respective upper width and each middle aperture has a respective middle width less than the respective upper width to form, in each triad, a ledge for supporting a lens in the upper aperture.
    Type: Application
    Filed: October 5, 2016
    Publication date: April 5, 2018
    Inventors: Chia-Yang CHANG, Teng-Sheng CHEN
  • Publication number: 20180095193
    Abstract: A wafer-level method for manufacturing yardless lenses includes (a) depositing light-curable lens resin between a mold and a first side of a transparent substrate, wherein the first side of the transparent substrate has an opaque coating with a plurality of apertures respectively aligned with a plurality of lens-shaped recesses of the mold, and (b) exposing a second side of the transparent substrate, facing away from the first side, to light, thereby illuminating portions of the light-curable lens resin aligned with the plurality of apertures to form a respective plurality of yardless lenses.
    Type: Application
    Filed: September 30, 2016
    Publication date: April 5, 2018
    Inventors: Mao-Chin Wang, Chia-Yang Chang, Shao-Fan Kao
  • Patent number: 9921393
    Abstract: A wafer-level lens forming method for forming an aperture wafer wherein the aperture wafer is stacked with one or more lens wafers to form apertured lens systems. The aperture wafer is formed by lithographically depositing an opaque layer on a transparent film, which is supported by a substrate. The aperture wafer is stacked with one or more lens wafers, and appropriate spacing between the wafers is set with spacer wafers. The substrate is removed, and the lens and aperture wafers are adhered together in a stack to form an optical system. The method avoids accumulation of residual material on the lens during the opaque-layer deposition process. The resulting optical system benefits from added flexibility of the lens system design due to the ability to locate the aperture with respect to one or more lenses independently of the lens wafers.
    Type: Grant
    Filed: September 4, 2014
    Date of Patent: March 20, 2018
    Assignee: OmniVision Technologies, Inc.
    Inventors: Min Ching Kao, Chia-Yang Chang
  • Publication number: 20180076246
    Abstract: A cover-glass-free array camera with individually light-shielded cameras includes an image sensor array having a plurality of photosensitive pixel arrays formed in a silicon substrate, and a lens array bonded to the silicon substrate, wherein the lens array includes (a) a plurality of imaging objectives respectively registered to the photosensitive pixel arrays to form respective individual cameras therewith, and (b) a first opaque material between each of the imaging objectives to prevent crosstalk between individual cameras.
    Type: Application
    Filed: September 9, 2016
    Publication date: March 15, 2018
    Inventors: Teng-Sheng Chen, Jau-Jan Deng, Chia-Yang Chang, Wei-Feng Lin
  • Publication number: 20170294477
    Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.
    Type: Application
    Filed: April 6, 2016
    Publication date: October 12, 2017
    Inventors: Teng-Sheng Chen, Chia-Yang Chang, Yi Qin