Patents by Inventor Chia-Yi Huang

Chia-Yi Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240108681
    Abstract: Coronavirus Disease 2019 (COVID-19) remains a threat with the emergence of new variants, especially Delta and Omicron, without specific effective therapeutic drugs. The present invention provides a method and a composition for preventing and treating COVID-19 (SARS-CoV-2) coronavirus infection which includes administering to a subject in need thereof one or more therapeutically effective doses of Virofree which comprises a pharmaceutically acceptable combination of grape seed extract, acerola cherry extract, olive leaf extract, marigold extract, green tea extract, pomegranate extract, yeast beta-glucan and soya bean extract for a treatment period.
    Type: Application
    Filed: September 11, 2023
    Publication date: April 4, 2024
    Applicant: GLOBAL PREVENTIVE MEDICINE BIOTECH COMPANY LIMITED
    Inventors: MEI-NAN TUAN, HIEN LY DOAN, ZI-YI HUANG, CHIA-YIN LEE, THUC ANH NGUYEN
  • Publication number: 20240113429
    Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.
    Type: Application
    Filed: August 16, 2023
    Publication date: April 4, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chao-Hsu Wu, Sheng-Chin Hsu, Chia-Hung Chen, Chih-Wei Liao, Hau Yuen Tan, Hao-Hsiang Yang, Shih-Keng Huang
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Publication number: 20240088307
    Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 11929318
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Publication number: 20230152637
    Abstract: A U-shaped unit and a liquid crystal element with U-shaped coplanar electrode units provided by the invention are capable of increasing a horizontal electric field intensity in a power supply state, so that when the invention is applied to be used as a liquid crystal driving element, a required horizontal electric field intensity can be achieved with a lower driving voltage to reduce a required driving power when the liquid crystal element is used as a display screen, thereby achieving an effect of power saving.
    Type: Application
    Filed: January 16, 2023
    Publication date: May 18, 2023
    Inventors: Chia-Yi HUANG, Wei-Fan CHIANG, Yi-Hong SHIH
  • Publication number: 20210373391
    Abstract: A U-shaped unit and a liquid crystal element with U-shaped coplanar electrode units provided by the invention are capable of increasing a horizontal electric field intensity in a power supply state, so that when the invention is applied to be used as a liquid crystal driving element, a required horizontal electric field intensity can be achieved with a lower driving voltage to reduce a required driving power when the liquid crystal element is used as a display screen, thereby achieving an effect of power saving.
    Type: Application
    Filed: May 17, 2021
    Publication date: December 2, 2021
    Inventors: Chia-Yi Huang, Wei-Fan Chiang, Yi-Hong Shih, Yan-Shou Lin
  • Patent number: 9572174
    Abstract: A communication apparatus is provided. A processor is coupled to a first radio access technology (RAT) module, a second RAT module and a radio transceiver shared by the first and second RAT modules. The first RAT module camps on a first serving cell belonging to a first wireless network and is in a packet transfer mode to perform data transfer in the first wireless network via the radio transceiver. The second RAT module camps on a second serving cell belonging to a second wireless network. The processor schedules the second RAT module to receive at least one neighbor cell's information in a portion of a plurality of predetermined frames during the data transfer of the first RAT module via the radio transceiver.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: February 14, 2017
    Assignee: MEDIATEK INC.
    Inventors: Hung-Yueh Chen, Jui-Ping Lien, Chia-Yi Huang
  • Patent number: 8515489
    Abstract: A communications apparatus with a processor coupled to a first RAT module in a packet transfer mode for data transfer, a second RAT module in an idle mode and a radio transceiver are provided. The processor receives a reservation request requesting permission to use the radio transceiver for performing a first radio activity from the first RAT module, and determines whether to provide a gap interval during the data transfer of the second RAT module for the first RAT module to use the radio transceiver according to a type of a second radio activity to be preformed by the second RAT module which collides with the first radio activity. When the gap interval is determined to be provided, the second RAT module is unable to use the radio transceiver for performing the second radio activity and the data transfer of the second RAT module is suspended during the gap interval.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: August 20, 2013
    Assignee: MediaTek Inc.
    Inventors: Yi-Ting Chang, Chih-Yung Shih, Chen-Wei Hsu, Chia-Yi Huang, Chung-Cheng Yu
  • Publication number: 20130079025
    Abstract: A communication apparatus is provided. A processor is coupled to a first radio access technology (RAT) module, a second RAT module and a radio transceiver shared by the first and second RAT modules. The first RAT module camps on a first serving cell belonging to a first wireless network and is in a packet transfer mode to perform data transfer in the first wireless network via the radio transceiver. The second RAT module camps on a second serving cell belonging to a second wireless network. The processor schedules the second RAT module to receive at least one neighbor cell's information in a portion of a plurality of predetermined frames during the data transfer of the first RAT module via the radio transceiver.
    Type: Application
    Filed: September 22, 2011
    Publication date: March 28, 2013
    Applicant: MEDIATEK INC.
    Inventors: Hung-Yueh Chen, Jui-Ping Lien, Chia-Yi Huang
  • Publication number: 20130053076
    Abstract: A communications apparatus with a processor coupled to a first RAT module in a packet transfer mode for data transfer, a second RAT module in an idle mode and a radio transceiver are provided. The processor receives a reservation request requesting permission to use the radio transceiver for performing a first radio activity from the first RAT module, and determines whether to provide a gap interval during the data transfer of the second RAT module for the first RAT module to use the radio transceiver according to a type of a second radio activity to be preformed by the second RAT module which collides with the first radio activity. When the gap interval is determined to be provided, the second RAT module is unable to use the radio transceiver for performing the second radio activity and the data transfer of the second RAT module is suspended during the gap interval.
    Type: Application
    Filed: August 29, 2011
    Publication date: February 28, 2013
    Applicant: MEDIATEK INC.
    Inventors: Yi-Ting Chang, Chih-Yung Shih, Chen-Wei Hsu, Chia-Yi Huang, Chung-Cheng Yu
  • Patent number: 8369437
    Abstract: A multiple input multiple output (MIMO) antenna system, a signal transmission method, a signal transmission apparatus and a computer program product for the MIMO antenna system are provided. The signal transmission method comprises the following steps of transmitting a signal with a first signal transmission mode and a first transmission power via a signal transmission channel; receiving a signal to noise ratio (SNR) of the signal; receiving an interference value of the signal transmission channel; obtaining a power weight value according to the interference value; determining a system threshold of the signal transmission channel to the SNR of the signal; determining a second signal transmission mode of the signal transmission channel based on the system threshold; and determining a second transmission power of the signal transmission channel according to the power weight value.
    Type: Grant
    Filed: January 6, 2009
    Date of Patent: February 5, 2013
    Assignee: Institute for Information Industry
    Inventors: Hsuan-Jung Su, Wei-Shun Liao, Chia-Yi Huang, Chun-Chi Chen, Kun-Hung Lee
  • Publication number: 20120327790
    Abstract: A wireless communications device is provided with a baseband chip capable of coordinating operations between circuit-switched (CS) and packet-switched (PS) services with different subscriber identity cards. The baseband chip is configured to perform a packet switched (PS) data service associated with a second service network, sacrifice a portion of data transceiving from/to the second service network to monitor a channel associated with a first service network during the PS data service, so as to receive message from the first service network or maintain mobility in the first service network.
    Type: Application
    Filed: June 24, 2011
    Publication date: December 27, 2012
    Applicant: MEDIATEK INC.
    Inventors: Chen-Hsuan Lee, Chin-Han Wang, Chu-Ching Yang, Chang-Kuan Lin, Chih-Yung Shih, Chun-Sheng Lee, Chia-Yi Huang, Yi-Ting Chang, Sian-Jheng Wong, Shih-Hsin Chien
  • Publication number: 20100034309
    Abstract: A multiple input multiple output (MIMO) antenna system, a signal transmission method, a signal transmission apparatus and a computer program product for the MIMO antenna system are provided. The signal transmission method comprises the following steps of transmitting a signal with a first signal transmission mode and a first transmission power via a signal transmission channel; receiving a signal to noise ratio (SNR) of the signal; receiving an interference value of the signal transmission channel; obtaining a power weight value according to the interference value; determining a system threshold of the signal transmission channel to the SNR of the signal; determining a second signal transmission mode of the signal transmission channel based on the system threshold; and determining a second transmission power of the signal transmission channel according to the power weight value.
    Type: Application
    Filed: January 6, 2009
    Publication date: February 11, 2010
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Hsuan-Jung Su, Wei-Shun Liao, Chia-Yi Huang, Chun-Chi Chen, Kun-Hung Lee