Abstract: The present disclosure relates generally to ion implantation, and more particularly, to systems and processes for measuring the temperature of a wafer within an ion implantation system. An exemplary ion implantation system may include a robotic arm, one or more load lock chambers, a pre-implantation station, an ion implanter, a post-implantation station, and a controller. The pre-implantation station is configured to heat or cool a wafer prior to the wafer being implanted with ions by the ion implanter. The post-implantation station is configured to heat or cool a wafer after the wafer is implanted with ions by the ion implanter. The pre-implantation station and/or post-implantation station are further configured to measure a current temperature of a wafer. The controller is configured to control the various components and processes described above, and to determine a current temperature of a wafer based on information received from the pre-implantation station and/or post-implantation station.

Abstract: In an embodiment, a device includes: a passivation layer on a semiconductor substrate; a first redistribution line on and extending along the passivation layer; a second redistribution line on and extending along the passivation layer; a first dielectric layer on the first redistribution line, the second redistribution line, and the passivation layer; and an under bump metallization having a bump portion and a first via portion, the bump portion disposed on and extending along the first dielectric layer, the bump portion overlapping the first redistribution line and the second redistribution line, the first via portion extending through the first dielectric layer to be physically and electrically coupled to the first redistribution line.

Abstract: A liquid cooling head includes a bottom plate, a heat dissipation plate, a partition plate and an upper cover plate. The bottom plate includes an opening, and the heat dissipation plate, the partition plate and the upper cover plate are fixed to the bottom plate. The partition plate divides the opening into a plurality of cooling chambers, and each cooling chamber is equipped with a cooling liquid inlet, a cooling liquid outlet, a pump and an electric control device. The cooling liquid inlet and the cooling liquid outlet are formed in the upper cover plate, the pump is fluid-connected to the cooling liquid outlet, and the electric control device drives the pump to rotate, so that the cooling liquid flows through the cooling chamber to cool one heat source below the heat dissipation plate. In addition, a liquid cooling device with the liquid cooling head is also disclosed therein.

Abstract: The present disclosure relates generally to ion implantation, and more particularly, to systems and processes for measuring the temperature of a wafer within an ion implantation system. An exemplary ion implantation system may include a robotic arm, one or more load lock chambers, a pre-implantation station, an ion implanter, a post-implantation station, and a controller. The pre-implantation station is configured to heat or cool a wafer prior to the wafer being implanted with ions by the ion implanter. The post-implantation station is configured to heat or cool a wafer after the wafer is implanted with ions by the ion implanter. The pre-implantation station and/or post-implantation station are further configured to measure a current temperature of a wafer. The controller is configured to control the various components and processes described above, and to determine a current temperature of a wafer based on information received from the pre-implantation station and/or post-implantation station.

Abstract: The present disclosure relates generally to ion implantation, and more particularly, to systems and processes for measuring the temperature of a wafer within an ion implantation system. An exemplary ion implantation system may include a robotic arm, one or more load lock chambers, a pre-implantation station, an ion implanter, a post-implantation station, and a controller. The pre-implantation station is configured to heat or cool a wafer prior to the wafer being implanted with ions by the ion implanter. The post-implantation station is configured to heat or cool a wafer after the wafer is implanted with ions by the ion implanter. The pre-implantation station and/or post-implantation station are further configured to measure a current temperature of a wafer. The controller is configured to control the various components and processes described above, and to determine a current temperature of a wafer based on information received from the pre-implantation station and/or post-implantation station.

Abstract: A method for calibrating element in a semiconductor processing device with a camera is provided. The method for calibrating element in a semiconductor processing device with a camera includes taking a first picture of a first element by a camera; providing a first actuator to move the first element an increment along a first direction; taking a second picture of the first element by the camera; and comparing the first picture and the second picture to calibrate the first element. A system for calibrating element in a semiconductor processing device with a camera is also provided.

Abstract: A method for calibrating element in a semiconductor processing device with a camera is provided. The method for calibrating element in a semiconductor processing device with a camera includes taking a first picture of a first element by a camera; providing a first actuator to move the first element an increment along a first direction; taking a second picture of the first element by the camera; and comparing the first picture and the second picture to calibrate the first element. A system for calibrating element in a semiconductor processing device with a camera is also provided.

Abstract: An exposure apparatus includes at least one radiation source, a plurality of projection lenses, and a lens switch. The radiation source is operable for providing a radiation beam. The lens switch is operable for selecting one of the projection lenses to focus the radiation beam to a target plane.

Abstract: An exposure apparatus includes at least one radiation source, a plurality of projection lenses, and a lens switch. The radiation source is operable for providing a radiation beam. The lens switch is operable for selecting one of the projection lenses to focus the radiation beam to a target plane.

Abstract: A lead line structure and a display panel having the same are provided. The display panel includes a pixel array, at least one driving device, first and second lead lines, and first and second insulating layers. The first lead lines are electrically connected to the pixel array and the driving device. The first insulating layer covers the first lead lines and has trenches. The second lead lines are electrically connected to the pixel array and the driving device, and located in the trenches of the first insulating layer. The first and second lead lines are alternately arranged. The second insulating layer covers the first insulating layer and the second lead lines. The height of the second insulating layer above the second lead lines is smaller than the height of the second insulating layer above the first lead lines.

Abstract: An exemplary driving method of a display panel with half-source-driving structure is provided. The display panel includes at least one pixel each using a capacitor to store a voltage. A terminal of the capacitor is adapted to receive a display data inputted from a data line, and another terminal of the capacitor is electrically coupled to a common electrode. The driving method includes: obtaining a direct current power signal; coupling an alternating current signal with the direct current power signal to generate a common electrode driving signal; and applying the common electrode driving signal to the common electrode. A rising time of a rising edge and a falling time of a falling edge of the common electrode driving signal are modified to improve a V-line mura phenomenon of the display panel.

Abstract: A lead line structure and a display panel having the same are provided. The lead line structure includes first and second lead lines. Each of the first lead lines has a first straight portion and a first oblique portion connected with the first straight portion. The second lead lines and the first lead lines are alternatively arranged, and each of the second lead lines has a second straight portion, a second oblique portion and a contact window. The contact window contacts with the second straight portion so as to electrically connect the second straight portion and the second oblique portion. The first straight portions of the first lead lines and the second straight portions of the second lead lines extend towards the driving device and are electrically connected to the driving device.

Abstract: A lead line structure and a display panel having the same are provided. The display panel includes a pixel array, at least one driving device, first and second lead lines, and first and second insulating layers. The first lead lines are electrically connected to the pixel array and the driving device. The first insulating layer covers the first lead lines and has trenches. The second lead lines are electrically connected to the pixel array and the driving device, and located in the trenches of the first insulating layer. The first and second lead lines are alternately arranged. The second insulating layer covers the first insulating layer and the second lead lines. The height of the second insulating layer above the second lead lines is smaller than the height of the second insulating layer above the first lead lines.

Abstract: A lead line structure and a display panel having the same are provided. The lead line structure includes first and second lead lines. Each of the first lead lines has a first straight portion and a first oblique portion connected with the first straight portion. The second lead lines and the first lead lines are alternatively arranged, and each of the second lead lines has a second straight portion, a second oblique portion and a contact window. The contact window contacts with the second straight portion so as to electrically connect the second straight portion and the second oblique portion. The first straight portions of the first lead lines and the second straight portions of the second lead lines extend towards the driving device and are electrically connected to the driving device.

Abstract: A simultaneously-inflated plastic blow mold includes a left mold and a right mold. The left mold or the right mold fixedly disposed with a control device includes a mold trough formed with a guide hole therein. When the left and right molds are closed, a gas nozzle is moved in the plastic blow mold to blow a product. The gas nozzle is stopped blowing the gas and withdrew from the plastic blow mold when the mold closing is completed. The control device is utilized to adjust a gas needle to enter the inside of the plastic blow mold via an inflating seat and to penetrate through the valve nozzle on a plastic blow product. The control device can adjust the gas blowing or exhausting step inside the hollow portion of the plastic blow product to remain a stable gas flow in the product blowing step.

Abstract: An exemplary driving method of a display panel with half-source-driving structure is provided. The display panel includes at least one pixel each using a capacitor to store a voltage. A terminal of the capacitor is adapted to receive a display data inputted from a data line, and another terminal of the capacitor is electrically coupled to a common electrode. The driving method includes: obtaining a direct current power signal; coupling an alternating current signal with the direct current power signal to generate a common electrode driving signal; and applying the common electrode driving signal to the common electrode. A rising time of a rising edge and a falling time of a falling edge of the common electrode driving signal are modified to improve a V-line mura phenomenon of the display panel.

Abstract: A conducting layer jump connection structure used in a circuit device includes a substrate, a first conducting layer, a first insulating layer, a second conducting layer, a second insulating layer, a jump connection layer, a first via, and plural second vias. The first conducting layer covers the substrate. The first insulating layer covers the first conducting layer. The second conducting layer partially covers the first insulating layer. The second insulating layer covers the second conducting layer and the first insulating layer exposed by the second conducting layer. The jump connection layer covers the second insulating layer. The first via is formed on the first conducting layer and between two opposite second conducting portions of the second conducting layer. The first via penetrates through both the second insulating layer and the first insulating layer. The second vias are formed on the second conducting layer and penetrate through the second insulating layer.

Abstract: A nasal cleaner includes a housing mounted with a suction tip, a suction unit operated to suck air into the suction tip, and a lighting unit mounted in the housing and controlled to emit light in direction parallel to the suction tip to illuminate the nasal chamber when removing nasal mucus from the nasal chamber.