Patents by Inventor Chih-Fang Wang

Chih-Fang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package and method of manufacturing the same
    Patent number: 11887967
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: January 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220028836
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.
    Type: Application
    Filed: October 4, 2021
    Publication date: January 27, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shang-Ruei WU, Chien-Yuan TSENG, Meng-Jen WANG, Chen-Tsung CHANG, Chih-Fang WANG, Cheng-Han LI, Chien-Hao CHEN, An-Chi TSAO, Per-Ju CHAO
  • Semiconductor device package and method of manufacturing the same
    Patent number: 11139274
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: October 5, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200251449
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.
    Type: Application
    Filed: January 31, 2020
    Publication date: August 6, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao