Patents by Inventor Chih-Feng Chen
Chih-Feng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240087951Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first metal layer over a substrate, forming a dielectric layer over the first metal layer. The method includes forming a trench in the dielectric layer, and performing a surface treatment process on a sidewall surface of the trench to form a hydrophobic layer. The hydrophobic layer is formed on a sidewall surface of the dielectric layer. The method further includes depositing a metal material in the trench and over the hydrophobic layer to form a via structure.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Chun-Hao Kung, Chih-Chieh Chang, Kao-Feng Liao, Hui-Chi Huang, Kei-Wei Chen
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Patent number: 11923252Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.Type: GrantFiled: January 27, 2021Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Sai-Hooi Yeong, Bo-Feng Young, Chi-On Chui, Chih-Chieh Yeh, Cheng-Hsien Wu, Chih-Sheng Chang, Tzu-Chiang Chen, I-Sheng Chen
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Publication number: 20240071954Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240071953Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Patent number: 11916031Abstract: A semiconductor device including a first die and a second die bonded to one another. The first die includes a first passivation layer over a substrate, and first bond pads in the first passivation layer. The second die includes a second passivation layer, which may be bonded to the first passivation layer, and second bond pads in the second passivation layer, which may be bonded to the first bond pads. The second bond pads include inner bond pads and outer bond pads. The outer bond pads may have a greater diameter than the inner bond pads as well as the first bond pads.Type: GrantFiled: May 16, 2022Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Chia Hu, Ching-Pin Yuan, Sung-Feng Yeh, Sen-Bor Jan, Ming-Fa Chen
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Patent number: 11644908Abstract: A stylus including a pen body and a magnetic attraction assembly is provided. The magnetic attraction assembly includes a magnet and a magnetic conductive structure. The magnet is disposed at a first position in the pen body. The magnetic conductive structure is disposed in the pen body and connected to the magnet to be magnetized by the magnet, and two end portions of the magnetic conductive structure are respectively located at a second position and a third position in the pen body. The magnetic attraction assembly is adapted to magnetically attract an electronic device at two of the first position, the second position and the third position.Type: GrantFiled: September 12, 2021Date of Patent: May 9, 2023Assignee: Chicony Electronics Co., Ltd.Inventors: Chih-Feng Chen, Chien-Shuo Chen
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Patent number: 11640883Abstract: A key module includes a bracket, a circuit film assembly, a keycap, and a connecting structure. The bracket includes a bottom plate and a bracket pivotal portion protruding from the bottom plate. The circuit film assembly is disposed on the bracket and includes a plurality of film layers and a supporting portion formed by at least one of the film layers. The supporting portion is located beside the bracket pivotal portion. The keycap is disposed above the bracket and the circuit film assembly and includes a keycap pivotal portion. The connecting structure is disposed between the bracket and the keycap and includes a first pivot pivotally disposed at the bracket pivotal portion and a second pivot pivotally disposed at the keycap pivotal portion. The supporting portion beside the bracket pivotal portion supports the first pivot, such that the first pivot continuously contacts the bracket pivotal portion.Type: GrantFiled: February 10, 2022Date of Patent: May 2, 2023Assignee: Chicony Electronics Co., Ltd.Inventors: Shin-Chin Weng, Chin-Ping Lin, Shih-Yu Hsu, Chih-Feng Chen
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Publication number: 20220326790Abstract: A stylus including a pen body and a magnetic attraction assembly is provided. The magnetic attraction assembly includes a magnet and a magnetic conductive structure. The magnet is disposed at a first position in the pen body. The magnetic conductive structure is disposed in the pen body and connected to the magnet to be magnetized by the magnet, and two end portions of the magnetic conductive structure are respectively located at a second position and a third position in the pen body. The magnetic attraction assembly is adapted to magnetically attract an electronic device at two of the first position, the second position and the third position.Type: ApplicationFiled: September 12, 2021Publication date: October 13, 2022Applicant: Chicony Electronics Co., Ltd.Inventors: Chih-Feng Chen, Chien-Shuo Chen
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Publication number: 20220293359Abstract: A key module includes a bracket, a circuit film assembly, a keycap, and a connecting structure. The bracket includes a bottom plate and a bracket pivotal portion protruding from the bottom plate. The circuit film assembly is disposed on the bracket and includes a plurality of film layers and a supporting portion formed by at least one of the film layers. The supporting portion is located beside the bracket pivotal portion. The keycap is disposed above the bracket and the circuit film assembly and includes a keycap pivotal portion. The connecting structure is disposed between the bracket and the keycap and includes a first pivot pivotally disposed at the bracket pivotal portion and a second pivot pivotally disposed at the keycap pivotal portion. The supporting portion beside the bracket pivotal portion supports the first pivot, such that the first pivot continuously contacts the bracket pivotal portion.Type: ApplicationFiled: February 10, 2022Publication date: September 15, 2022Applicant: Chicony Electronics Co., Ltd.Inventors: Shin-Chin Weng, Chin-Ping Lin, Shih-Yu Hsu, Chih-Feng Chen
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Patent number: 11328880Abstract: A key includes a substrate, a keycap, a connection component, and protruding structures. The connection component includes a first connection member and a second connection member, and the first connection member and the second connection member are between the substrate and the keycap. The protruding structures are disposed on the upper surface of the first connection member and disposed on the upper surface of the second connection member. When the keycap is pressed to a pressed position, the protruding structures on the first connection member and on the second connection member abut against the bottom surface of the keycap, so that a gap is formed between the keycap and the connection component. Therefore, the bottom surface of the keycap does not contact the upper surface of the first connection member and the upper surface of the second connection member so as to prevent from generating keystroke noises.Type: GrantFiled: March 23, 2021Date of Patent: May 10, 2022Assignee: CHICONY ELECTRONICS CO., LTD.Inventors: Chih-Ping Lin, Shin-Chin Weng, Shih-Yu Hsu, Chih-Feng Chen
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Publication number: 20220020543Abstract: A key includes a substrate, a keycap, a connection component, and protruding structures. The connection component includes a first connection member and a second connection member, and the first connection member and the second connection member are between the substrate and the keycap. The protruding structures are disposed on the upper surface of the first connection member and disposed on the upper surface of the second connection member. When the keycap is pressed to a pressed position, the protruding structures on the first connection member and on the second connection member abut against the bottom surface of the keycap, so that a gap is formed between the keycap and the connection component. Therefore, the bottom surface of the keycap does not contact the upper surface of the first connection member and the upper surface of the second connection member so as to prevent from generating keystroke noises.Type: ApplicationFiled: March 23, 2021Publication date: January 20, 2022Inventors: Chih-Ping LIN, Shin-Chin WENG, Shih-Yu HSU, Chih-Feng CHEN
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Patent number: 10991523Abstract: A keyboard device includes a base plate and a plurality of keyswitches disposed on the base plate. At least one of the keyswitches includes a keycap, two linkages, and two magnetic attraction members. The linkages are connected between the base plate and the keycap and configured to guide the movements of the keycap toward and away from the base plate. The magnetic attraction members are rotatably connected to the linkages, respectively, and are configured to attract each other. When the magnetic attraction members abut against each other, the keycap is at a highest position relative to the base plate. When the keycap moves toward the base plate from the highest position, the magnetic attraction members are separated from each other.Type: GrantFiled: December 25, 2018Date of Patent: April 27, 2021Assignee: Chicony Electronics Co, , Ltd.Inventors: Shin-Chin Weng, Chun-Chieh Chan, Chao-Chin Hsieh, Chih-Feng Chen
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Patent number: 10935107Abstract: A driving device includes: a transmission mechanism; a driving mechanism, moved with the transmission mechanism; a linkage mechanism, moved with the driving mechanism and including a locking unit; and a housing, including an accommodation seat and sealing cover, the accommodation seat accepting the transmission, driving and linkage mechanisms, the sealing cover in combination with the accommodation seat to seal the transmission, driving and linkage mechanisms, one end of the linkage mechanism partly extended out of the sealing seat, and the locking unit partly pressed against an inner side wall of the accommodation seat. Whereby, the transmission mechanism is actuated to drive the driving mechanism to rotate, allowing the driving mechanism to drive the linkage mechanism to rotate; the action of the transmission mechanism is stopped, the locking unit locks the linkage mechanism, thereby capable of preventing power waste and the damage of the transmission mechanism and driving mechanism.Type: GrantFiled: January 21, 2019Date of Patent: March 2, 2021Assignee: MARK STAR SERVO-TECH CO., LTD.Inventor: Chih-Feng Chen
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Publication number: 20200348339Abstract: Disclosed are a supplementary bushing, a test probe, and a supplementary testing device. The supplementary bushing has a closed end, an open end, a receiving groove, and at least one first fixing portion. The closed end has a first contact, and the receiving groove is concavely formed from an open end towards the closed end. The first fixing portion is disposed on an inner surface of the receiving groove. The test probe is installed in the receiving hole of a base of the supplementary testing device and has a testing end and a connecting end. The testing end has a second contact, a second fixing portion and a stop portion.Type: ApplicationFiled: April 30, 2019Publication date: November 5, 2020Inventors: MING-DAO WU, SHIH-HUNG LO, HAO-WEN CHIEN, FU-CHENG CHUANG, WEI-CHU CHEN, KUO-WEI CHANG, BOR-CHEN TSAI, CHIH-FENG CHEN
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Publication number: 20200348338Abstract: A test pin contact buffer, fixed to a test pin base, is a sheet-like structure made of a composite material including a conductive material and an insulating material, and defines at least one contact area corresponding to at least one test pin of the test pin base. The contact area has at least one cutout hole, an insulating deformation structure and a conductive head structure. The insulating deformation structure is extendable and made of the insulating material and extends outward from the conductive head structure. The cutout hole enables the contact area to be in a partial hollow state, which is beneficial for deformation of the insulating deformation structure. The test pin can be used for performing measurement in an indirect manner, reducing the wear of the test pin, prolonging the service life, and improving the measurement speed and efficiency.Type: ApplicationFiled: April 30, 2019Publication date: November 5, 2020Inventors: MING-DAO WU, SHIH-HUNG LO, FU-CHENG CHUANG, ZHAO-YUAN TSAI, HAO-WEN CHIEN, BOR-CHEN TSAI, CHIH-FENG CHEN
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Patent number: 10778137Abstract: A drive device capable of recording a working status includes: a drive mechanism, including a housing, an actuating unit configured inside the housing and a transmission unit configured inside the housing and in connection with the actuating unit; a sensing unit, configured inside the housing and in electric connection with the actuating unit; and a storage unit, configured inside the housing and in electric connection with the sensing unit. Whereby, the drive device can be installed inside a unmanned control or automatic machine, utilizes the sensing unit to sense a working status of the drive mechanism, and records working status data in the storage unit; the working status stored in the storage unit can be read after the machine fails or is damaged, the working status of the drive mechanism of the damaged machine, and the cause of the failure occurrence is clarified, as a basis for subsequent performance improvement.Type: GrantFiled: June 13, 2019Date of Patent: September 15, 2020Assignee: MARK STAR SERVO-TECH CO., LTD.Inventor: Chih-Feng Chen
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Publication number: 20200233448Abstract: A driving device includes: a transmission mechanism; a driving mechanism, moved with the transmission mechanism; a linkage mechanism, moved with the driving mechanism and including a locking unit; and a housing, including an accommodation seat and sealing cover, the accommodation seat accepting the transmission, driving and linkage mechanisms, the sealing cover in combination with the accommodation seat to seal the transmission, driving and linkage mechanisms, one end of the linkage mechanism partly extended out of the sealing seat, and the locking unit partly pressed against an inner side wall of the accommodation seat. Whereby, the transmission mechanism is actuated to drive the driving mechanism to rotate, allowing the driving mechanism to drive the linkage mechanism to rotate; the action of the transmission mechanism is stopped, the locking unit locks the linkage mechanism, thereby capable of preventing power waste and the damage of the transmission mechanism and driving mechanism.Type: ApplicationFiled: January 21, 2019Publication date: July 23, 2020Inventor: Chih-Feng Chen
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Publication number: 20200035426Abstract: A keyboard device includes a base plate and a plurality of keyswitches disposed on the base plate. At least one of the keyswitches includes a keycap, two linkages, and two magnetic attraction members. The linkages are connected between the base plate and the keycap and configured to guide the movements of the keycap toward and away from the base plate. The magnetic attraction members are rotatably connected to the linkages, respectively, and are configured to attract each other. When the magnetic attraction members abut against each other, the keycap is at a highest position relative to the base plate. When the keycap moves toward the base plate from the highest position, the magnetic attraction members are separated from each other.Type: ApplicationFiled: December 25, 2018Publication date: January 30, 2020Inventors: Shin-Chin WENG, Chun-Chieh CHAN, Chao-Chin HSIEH, Chih-Feng CHEN
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Publication number: 20190020151Abstract: A high frequency electronic connector is formed by a first connector and a second connector. The first connector has a first body and at least one first terminal, and the first terminal is built in the first body. The second connector has a second body and at least one second terminal, and the second terminal is built in the second body and provided for inserting and connecting the first body. The first terminal has a front end surface in form of a slope or a curved surface, and the second terminal has a front end surface in form of at least one slope or at least one curved surface, so as to increase the contact area between the first and second terminals, and improve the stability of a high frequency signal transmission.Type: ApplicationFiled: July 17, 2017Publication date: January 17, 2019Inventors: HAO-WEN CHIEN, LI-CHUN LAN, MIN-AN CHING, PING-HUAN TSOU, WEN-YING CHENG, BOR-CHEN TSAI, TSUNG-MING TSAI, CHIH-FENG CHEN
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Patent number: 9991629Abstract: Disclosed are a magnetic automobile vehicle device and its multifunctional module. The magnetic automobile vehicle device obtains electric power from a cigarette lighter slot of an automobile vehicle and includes a first magnet and an impact detector. The impact detector generates a distress signal when the automobile vehicle is collided. The multifunctional module includes a second magnet and an output element coupled to the magnetic automobile vehicle device by magnetic attraction and provided for charging or supplying power to the output element, and the output element has an ultrasonic transmitter, a USB slot or an O3 air purifier. Therefore, the device comes with a multifunctional configuration and meets market and consumer requirements.Type: GrantFiled: May 7, 2017Date of Patent: June 5, 2018Assignee: C.C.P. CONTACT PROBES CO., LTD.Inventors: Hao-Wen Chien, Li-Chun Lan, Min-An Ching, Ping-Huan Tsou, Wen-Ying Cheng, Bor-Chen Tsai, Tsung-Ming Tsai, Chih-Feng Chen