Patents by Inventor Chih-Feng Huang

Chih-Feng Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210327731
    Abstract: A mass transfer method, a mass transfer device and a buffer carrier are provided. The mass transfer method includes: (a) providing a plurality of electronic components disposed on a source carrier; (b) providing a buffer carrier including a plurality of adjusting cavities; and (c) transferring the electronic components from the source carrier to the buffer carrier, wherein the electronic components are placed in the adjusting cavities of the buffer carrier to adjust positions of the electronic components from shifted positions to correct positions.
    Type: Application
    Filed: April 15, 2020
    Publication date: October 21, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Wen CHANG, Yu-Ho HSU, Tai-Yuan HUANG, Ping-Feng YANG, Fu-Ting CHANG, Chin-Feng WANG
  • Publication number: 20210317483
    Abstract: Provided is an expression vector including a nucleotide sequence for encoding lysine decarboxylase CadA, and a sequence of a constitutive promoter for regulating the expression of the nucleotide sequence. Also provided is a recombinant microorganism including the expression vector and a method of producing 1,5-diaminopentane by using the recombinant microorganism.
    Type: Application
    Filed: October 5, 2020
    Publication date: October 14, 2021
    Inventors: Jo-Shu Chang, I-Son Ng, Shih-Fang Huang, Hong-Yi Lin, Sheng-Feng Li, Chia-Wei Tsai, Chih-Yu Huang, Wan-Wen Ting
  • Patent number: 11145751
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate structure, a source/drain structure, a dielectric layer, a contact plug. The gate structure is positioned over a fin structure. The source/drain structure is positioned in the fin structure and adjacent to the gate structure. The dielectric layer is positioned over the gate structure and the source/drain structure. The contact plug is positioned passing through the dielectric layer. The contact plug includes a first metal compound including one of group III elements, group IV elements, group V elements or a combination thereof.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: October 12, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kuo-Ju Chen, Su-Hao Liu, Chun-Hao Kung, Liang-Yin Chen, Huicheng Chang, Kei-Wei Chen, Hui-Chi Huang, Kao-Feng Liao, Chih-Hung Chen, Jie-Huang Huang, Lun-Kuang Tan, Wei-Ming You
  • Publication number: 20210313190
    Abstract: Methods of manufacturing a chemical-mechanical polishing (CMP) slurry and methods of performing CMP process on a substrate comprising metal features are described herein. The CMP slurry may be manufactured using a balanced concentration ratio of chelator additives to inhibitor additives, the ratio being determined based on an electro potential (Ev) value of a metal material of the substrate. The CMP process may be performed on the substrate based on the balanced concentration ratio of chelator additives to inhibitor additives of the CMP slurry.
    Type: Application
    Filed: June 21, 2021
    Publication date: October 7, 2021
    Inventors: Chun-Hao Kung, Tung-Kai Chen, Chih-Chieh Chang, Kao-Feng Liao, Hui-Chi Huang, Kei-Wei Chen
  • Publication number: 20210313794
    Abstract: A power supply is configured to limit its output power, converting an input voltage on a primary side into a bus voltage on a secondary side. A current-sense resistor detects a bus current output from the power supply to provide a current-sense signal. A bus switch is electrically connected to a secondary winding on the secondary side, configured to selectively supply power to the bus voltage. A power delivery controller controls the bus switch in response to the current-sense signal and a power detection signal on the secondary side. The power delivery controller provides a power threshold in response to the bus voltage, compares the power detection signal with the power threshold, and turns off the bus switch to stop supplying power to the bus voltage if the power detection signal exceeds the power threshold, thereby limiting the output power of the power supply.
    Type: Application
    Filed: April 6, 2021
    Publication date: October 7, 2021
    Inventors: Hsien-Te HUANG, Ming-Chang TSOU, Chih-Nan HSIA, Mao-Shih LI, Pai-Feng LIU, Chin-Ho WU
  • Publication number: 20210311095
    Abstract: A probe card and a probe module thereof are provided. The probe card includes a first strengthening board, a fixed frame, a probe module, and a slidable frame. The first strengthening board includes a top surface, a bottom surface, and a mounting hole. An inner wall of the mounting hole is formed with an inner flange. The fixed frame is disposed on the top surface of the first strengthening board and surrounds the mounting hole. The probe module is disposed in the mounting hole and includes an outer flange including a physical region and multiple gap regions. The physical region abuts against the inner flange of the first strengthening board. The slidable frame is disposed on an inner wall of the fixed frame and is slidable between a released position and a fixed position. Multiple pressing portions are disposed on an inner wall of the slidable frame.
    Type: Application
    Filed: April 2, 2021
    Publication date: October 7, 2021
    Applicant: MPI Corporation
    Inventors: Chung-Yen Huang, Chih-Wei Wen, Sheng-Feng Xu, Fuh-Chyun Tang, Chih-Hao Ho
  • Patent number: 11140375
    Abstract: In some aspects, the present disclosure provides a method for sharing a single optical sensor between multiple image processors. In some embodiments, the method includes receiving, at a control arbiter, a first desired configuration of a first one or more desired configurations for capturing an image frame by the optical sensor, the first one or more desired configurations communicated from a primary image processor. The method may also include receiving, at the control arbiter, a second desired configuration of a second one or more desired configurations for capturing the image frame by the optical sensor, the second one or more desired configurations communicated from a secondary image processor. The method may also include determining, by the control arbiter, an actual configuration for capturing the image frame by the optical sensor, the actual configuration based on the first desired configuration and the second desired configuration.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: October 5, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Wesley James Holland, Satish Goverdhan, Venkata Rajesh Kumar Sastrula, Ramesh Ramaswamy, Songhe Cai, Ling Feng Huang, Chih-Chi Cheng, Huang Huang, Rajakumar Govindaram
  • Publication number: 20210305414
    Abstract: A power device which is formed on a semiconductor substrate includes: a lateral insulated gate bipolar transistor (LIGBT), a PN diode and a clamp diode. The PN diode is connected in parallel to the LIGBT. The clamp diode has a clamp forward terminal and a clamp reverse terminal, which are electrically connected to a drain and a gate of the LIGBT, to clamp a gate voltage applied to the gate not to be higher than a predetermined voltage threshold.
    Type: Application
    Filed: February 26, 2021
    Publication date: September 30, 2021
    Inventors: Chih-Feng Huang, Lung-Sheng Lin
  • Publication number: 20210305242
    Abstract: A power device which is formed on a semiconductor substrate includes: plural lateral insulated gate bipolar transistors (LIGBTs) and a forward conductive unit. The plural LIGBTs are connected in parallel to each other. The forward conductive unit is connected in parallel to the plural LIGBTs. The forward conductive unit consists of a PN diode and a Schottky diode connected in parallel to each other. The PN diode and the Schottky diode share a same N-type region, a reverse terminal, an N-type extension region, an field oxide region, a gate, and a P-type well in an epitaxial layer. The N-type region and the P-type well form a PN junction, wherein the PN junction has a staggered comb-teeth interface from top view. A metal line extends on the staggered comb-teeth interface and alternatingly contacts the N-type region and the P-type well.
    Type: Application
    Filed: January 5, 2021
    Publication date: September 30, 2021
    Inventors: Chih-Feng Huang, Lung-Sheng Lin
  • Patent number: 11118591
    Abstract: An intelligent fan with interface compatibility is provided. The intelligent fan includes a fan body having a fan and a motor, a driving circuit, a tachometer, an output connector including a first pin, a second pin, a third pin and a fourth pin connected to a fan connector of a motherboard, and a microcontroller connected to the driving circuit and the tachometer, and connected to the motherboard via the first, second, third and fourth pins. When the intelligent fan is powered on, the microcontroller sets the third and fourth pins as input pins for receiving an output signal of the fan connector of the motherboard, and the microcontroller performs an I2C signal analysis on the output signal. When the I2C signal analysis succeeds, the intelligent fan is set in an I2C mode, and when the I2C signal analysis fails, the intelligent fan is set in a PWM mode.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: September 14, 2021
    Assignee: PROLIFIC TECHNOLOGY INC.
    Inventors: Chia Chang Hsu, Chih Feng Huang, Ching Te Chen, Ren Yuan Yu
  • Publication number: 20210272276
    Abstract: A benign tumor development trend assessment system includes an image outputting device and a server computing device. The image outputting device outputs first/second images captured from the same position in a benign tumor. The server computing device includes an image receiving module, an image pre-processing module, a target extracting module, a feature extracting module and a trend analyzing module. The image receiving module receives the first/second images. The image pre-processing module pre-processes the first/second images to obtain first/second local images. The target extracting module automatically detects and delineates tumor regions from the first/second local images to obtain first/second region of interest (ROI) images. The feature extracting module automatically identifies the first/second ROI images to obtain at least one first/second features. The trend analyzing module analyzes the first/second features to obtain a tumor development trend result.
    Type: Application
    Filed: July 27, 2020
    Publication date: September 2, 2021
    Inventors: Cheng-Chia Lee, Huai-Che Yang, Wen-Yuh Chung, Chih-Chun Wu, Wan-Yuo Guo, Wei-Kai Lee, Tzu-Hsuan Huang, Chun-Yi Lin, Chia-Feng Lu, Yu-Te Wu
  • Publication number: 20210272849
    Abstract: A fin structure is on a substrate. The fin structure includes an epitaxial region having an upper surface and an under-surface. A contact structure on the epitaxial region includes an upper contact portion and a lower contact portion. The upper contact portion includes a metal layer over the upper surface and a barrier layer over the metal layer. The lower contact portion includes a metal-insulator-semiconductor (MIS) contact along the under-surface. The MIS contact includes a dielectric layer on the under-surface and the barrier layer on the dielectric layer.
    Type: Application
    Filed: May 17, 2021
    Publication date: September 2, 2021
    Inventors: Sung-Li Wang, Neng-Kuo Chen, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin, Gin-Chen Huang, Chen-Feng Hsu, Hau-Yu Lin, Chih-Hsin Ko, Sey-Ping Sun, Clement Hsingjen Wann
  • Publication number: 20210271842
    Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.
    Type: Application
    Filed: May 14, 2021
    Publication date: September 2, 2021
    Inventors: Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang
  • Publication number: 20200263696
    Abstract: An intelligent fan with interface compatibility is provided. The intelligent fan includes a fan body having a fan and a motor, a driving circuit, a tachometer, an output connector including a first pin, a second pin, a third pin and a fourth pin connected to a fan connector of a motherboard, and a microcontroller connected to the driving circuit and the tachometer, and connected to the motherboard via the first, second, third and fourth pins. When the intelligent fan is powered on, the microcontroller sets the third and fourth pins as input pins for receiving an output signal of the fan connector of the motherboard, and the microcontroller performs an I2C signal analysis on the output signal. When the I2C signal analysis succeeds, the intelligent fan is set in an I2C mode, and when the I2C signal analysis fails, the intelligent fan is set in a PWM mode.
    Type: Application
    Filed: February 20, 2020
    Publication date: August 20, 2020
    Inventors: Chia Chang HSU, Chih Feng HUANG, Ching-Te CHEN, Ren-Yuan YU
  • Publication number: 20200264575
    Abstract: An intelligent fan control system with interface compatibility is provided. The intelligent fan control system can identify and control fans one-to-one connected to fan slots, and each fan slot includes four pins. The intelligent fan control system includes a bus; an I2C signal switching unit including SDA outputs one-to-one connected to third pin of the fan slots via the bus; an I2C signal switching unit including SCL outputs one-to-one connected to fourth pins of the fan slots via the bus; voltage control units one-to-one corresponding to the fan slots, and having output terminals one-to-one connected to second pins of the fan slots; connection line sets, and each connection line set including four connection lines and connected to the corresponding fan slot; a control board comprising port sets, and can control and switch the I2C signal switching unit to the fan slots in sequence, to transmit the corresponding I2C signal.
    Type: Application
    Filed: February 20, 2020
    Publication date: August 20, 2020
    Inventors: Chia Chang HSU, Chih Feng HUANG, Ching-Te CHEN, Ren-Yuan YU
  • Publication number: 20200232471
    Abstract: A device for real-time self-diagnosis of a fan and a method are disclosed for detecting whether a fan body encounters an environment abnormal situation. The fan body includes a motor, a fan and a tachometer. The fan body further includes a microcontroller for receiving a speed signal of the tachometer and calculating a speed value of the fan, and detecting a current value of the motor during operation. The microcontroller can control the motor to drive the fan according to a monitoring period and a control signal transmitted from the control board, and can calculate a speed change amount according to the monitoring period, and can calculate a current change amount. When the speed change amount exceeds a speed change threshold and the current change amount exceeds a current change threshold for a period of time, the microcontroller generates an environmental anomaly signal.
    Type: Application
    Filed: January 23, 2020
    Publication date: July 23, 2020
    Inventors: CHIA CHANG HSU, CHIH FENG HUANG, WEI SHU HSU
  • Publication number: 20190362373
    Abstract: A method for behavior rewarding is applied in a rewarding system, which comprises a computer device and a server. The computer device is configured for a user to execute a designated action and communicates with the server. The method comprises the following steps: receiving an execution request of a plurality of designated actions by the computer device, wherein the designated actions at least comprises a special action or a random action; transmitting an execution result of the designated actions from the computer device to the server; and, when determining that the execution result of the designated actions matches the execution request of the designated actions, transmitting a rewarding value corresponding to the designated actions from the server to the computer device. A server and a computer device for executing the method for behavior rewarding are also disclosed.
    Type: Application
    Filed: December 27, 2018
    Publication date: November 28, 2019
    Inventors: Yi-Chung LIN, Chih-Feng HUANG, Yung-Hsiang CHANG
  • Publication number: 20190244232
    Abstract: A trade reward method includes the following steps of: getting a consumption amount spent in a second store by a member of a first store; calculating a reward value by multiplicating a preset ratio with the consumption amount; and transferring a first part of the reward value to an account of the first store. A server and a store computer device applied with the trade reward method are also provided.
    Type: Application
    Filed: September 14, 2018
    Publication date: August 8, 2019
    Inventors: Yi-Chung LIN, Chih-Feng HUANG, Yung-Hsiang CHANG
  • Publication number: 20190244238
    Abstract: A method for distributing a reward value includes the following steps of: getting a consumption amount spent in a second store by a member of a first store; calculating a reward value by multiplicating a preset ratio with the consumption amount; randomly distributing the reward value into at least two parts of the reward value; and transmitting one of the parts of the reward value to an account of the member. A member computer device applied to the method is also disclosed.
    Type: Application
    Filed: September 12, 2018
    Publication date: August 8, 2019
    Inventors: Yi-Chung LIN, Chih-Feng HUANG, Yung-Hsiang CHANG
  • Publication number: 20190031792
    Abstract: A compound, a composition employing the same and a polymer prepared therefrom are provided. The compound has a structure represented by Formula (I): wherein A is B is R1 is C1-10 alkyl, C5-12 cycloalkyl, C6-14 aryl, C3-12 heteroaryl, alkoxy, C6-12 aryloxy, silyl, amino, thiol, or phosphonate group; R2 is H, or C1-10 alkyl; and, R3 is C1-10 alkoxy, C1-10 alkanol, amine, or hydroxy.
    Type: Application
    Filed: October 4, 2018
    Publication date: January 31, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Lin CHU, Hsuan-Wei LEE, Chih-Hsiang LIN, Chih-Feng HUANG, Yu-Min HAN, Wen-Hua CHEN