Patents by Inventor Chih-Feng Huang

Chih-Feng Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190340405
    Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.
    Type: Application
    Filed: July 15, 2019
    Publication date: November 7, 2019
    Inventors: Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang
  • Patent number: 10461183
    Abstract: A device having a drain region with a drain rectangular portion having a first end and a second end, a first drain end portion contiguous with the drain rectangular portion and extending from the first end of the drain rectangular portion away from a center of the drain region, and a second drain end portion contiguous with the drain rectangular portion and extending from the second end of the drain rectangular portion away from the center of the drain region. The semiconductor device also comprises a source region spaced from and surrounding the drain region in the first layer.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: October 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsai-Feng Yang, Chih-Heng Shen, Chun-Yi Yang, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang
  • Publication number: 20190305107
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate structure, a source/drain structure, a dielectric layer, a contact plug. The gate structure is positioned over a fin structure. The source/drain structure is positioned in the fin structure and adjacent to the gate structure. The dielectric layer is positioned over the gate structure and the source/drain structure. The contact plug is positioned passing through the dielectric layer. The contact plug includes a first metal compound including one of group III elements, group IV elements, group V elements or a combination thereof.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 3, 2019
    Inventors: Kuo-Ju CHEN, Su-Hao LIU, Chun-Hao KUNG, Liang-Yin CHEN, Huicheng CHANG, Kei-Wei CHEN, Hui-Chi HUANG, Kao-Feng LIAO, Chih-Hung CHEN, Jie-Huang HUANG, Lun-Kuang TAN, Wei-Ming YOU
  • Publication number: 20190302072
    Abstract: A gas detecting module includes a carrying plate, a sensor, a compartment body and an actuator. The carrying plate has a substrate and a gas opening. The compartment body is divided into a first compartment and a second compartment by a partition plate. The first compartment has an opening. The second compartment has an outlet and accommodates the actuator. The bottom of the compartment body has an accommodation recess receiving the carrying plate, whereby the gas opening is aligned with the outlet, and the sensor packaged on the substrate is disposed within the first compartment through the opening. The partition plate has a notch. The gas detecting module is assembled in a slim-type portable device having a casing. The casing has an inlet aligned with the first compartment. As the actuator is actuated, ambient gas is inhaled into the first compartment, and the sensor detects the gas flowing therethrough.
    Type: Application
    Filed: February 1, 2019
    Publication date: October 3, 2019
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan Mou, Shih-Chang Chen, Chi-Chang Yang, Chiu-Lin Lee, Jia-Yu Liao, Ching-Sung Lin, Chih-Kai Chen, Chi-Feng Huang, Yung-Lung Han
  • Publication number: 20190247880
    Abstract: A miniature fluid control device is provided and includes a gas inlet plate, a resonance plate and a piezoelectric actuator. The resonance plate is assembled and combined with the gas inlet plate. The piezoelectric actuator is assembled and combined with the resonance plate. The piezoelectric actuator includes a suspension plate, an outer frame, at least one bracket and a piezoelectric plate. The suspension plate has a first surface and a second surface. The outer frame is arranged around the suspension plate and has an assembling surface. The piezoelectric plate is attached on the second surface. The at least one bracket is formed between the suspension plate and the outer frame as making the first surface of the suspension plate non-coplanar with the assembling surface of the outer frame, so that a specific chamber spacing is maintained between the first surface of the suspension plate and the resonance plate.
    Type: Application
    Filed: January 4, 2019
    Publication date: August 15, 2019
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan Mou, Ying-Lun Chang, Shih-Chang Chen, Chih-Feng Lin, Yung-Lung Han, Chi-Feng Huang, Chang-Yen Tsai
  • Publication number: 20190252261
    Abstract: A fin structure is on a substrate. The fin structure includes an epitaxial region having an upper surface and an under-surface. A contact structure on the epitaxial region includes an upper contact portion and a lower contact portion. The upper contact portion includes a metal layer over the upper surface and a barrier layer over the metal layer. The lower contact portion includes a metal-insulator-semiconductor (MIS) contact along the under-surface. The MIS contact includes a dielectric layer on the under-surface and the barrier layer on the dielectric layer.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Inventors: Sung-Li Wang, Neng-Kuo Chen, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin, Gin-Chen Huang, Chen-Feng Hsu, Hau-Yu Lin, Chih-Hsin Ko, Sey-Ping Sun, Clement Hsingjen Wann
  • Publication number: 20190244238
    Abstract: A method for distributing a reward value includes the following steps of: getting a consumption amount spent in a second store by a member of a first store; calculating a reward value by multiplicating a preset ratio with the consumption amount; randomly distributing the reward value into at least two parts of the reward value; and transmitting one of the parts of the reward value to an account of the member. A member computer device applied to the method is also disclosed.
    Type: Application
    Filed: September 12, 2018
    Publication date: August 8, 2019
    Inventors: Yi-Chung LIN, Chih-Feng HUANG, Yung-Hsiang CHANG
  • Publication number: 20190244232
    Abstract: A trade reward method includes the following steps of: getting a consumption amount spent in a second store by a member of a first store; calculating a reward value by multiplicating a preset ratio with the consumption amount; and transferring a first part of the reward value to an account of the first store. A server and a store computer device applied with the trade reward method are also provided.
    Type: Application
    Filed: September 14, 2018
    Publication date: August 8, 2019
    Inventors: Yi-Chung LIN, Chih-Feng HUANG, Yung-Hsiang CHANG
  • Patent number: 10354114
    Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: July 16, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang
  • Publication number: 20190157103
    Abstract: A planarization method and a CMP method are provided. The planarization method includes providing a substrate with a first region and a second region having different degrees of hydrophobicity or hydrophilicity and performing a surface treatment to the first region to render the degrees of hydrophobicity or hydrophilicity in proximity to that of the second region. The CMP method includes providing a substrate with a first region and a second region; providing a polishing slurry on the substrate, wherein the polishing slurry and the surface of the first region have a first contact angle, and the polishing slurry and the surface of the first region have a second contact angle; modifying the surface of the first region to make a contact angle difference between the first contact angle and the second contact angle equal to or less than 30 degrees.
    Type: Application
    Filed: June 8, 2018
    Publication date: May 23, 2019
    Inventors: TUNG-KAI CHEN, CHING-HSIANG TSAI, KAO-FENG LIAO, CHIH-CHIEH CHANG, CHUN-HAO KUNG, FANG-I CHIH, HSIN-YING HO, CHIA-JUNG HSU, HUI-CHI HUANG, KEI-WEI CHEN
  • Publication number: 20190031792
    Abstract: A compound, a composition employing the same and a polymer prepared therefrom are provided. The compound has a structure represented by Formula (I): wherein A is B is R1 is C1-10 alkyl, C5-12 cycloalkyl, C6-14 aryl, C3-12 heteroaryl, alkoxy, C6-12 aryloxy, silyl, amino, thiol, or phosphonate group; R2 is H, or C1-10 alkyl; and, R3 is C1-10 alkoxy, C1-10 alkanol, amine, or hydroxy.
    Type: Application
    Filed: October 4, 2018
    Publication date: January 31, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Lin CHU, Hsuan-Wei LEE, Chih-Hsiang LIN, Chih-Feng HUANG, Yu-Min HAN, Wen-Hua CHEN
  • Publication number: 20160185882
    Abstract: A compound, and a polymer prepared therefrom, are provided. The compound has a structure represented by Formula (I) or Formula (II): wherein A is R1 is C1-10 alkyl, C5-12 cycloalkyl, C6-14 aryl, C3-12 heteroaryl, C1-10 alkoxy, C6-12 aryloxy, C1-10 silyl, amino, thiol, or phosphonate group; R2 is H, or C1-10 alkyl; and, R3 is C1-10 alkoxy, C1-10 alkanol, amine, or hydroxy.
    Type: Application
    Filed: September 10, 2015
    Publication date: June 30, 2016
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Lin CHU, Hsuan-Wei LEE, Chih-Hsiang LIN, Chih-Feng HUANG, Yu-Min HAN, Wen-Hua CHEN
  • Publication number: 20150270780
    Abstract: A constant current regulator includes a first transistor having a first terminal coupled with an input voltage; a second transistor having a first terminal coupled with a control terminal of the first transistor; a third transistor having a first terminal coupled with the first terminal of the first transistor and having a control terminal coupled with the first terminal of the second transistor; a first resistor having a first terminal coupled with a second terminal of the third transistor and having a second terminal coupled with a control terminal of the second transistor; a second resistor having a first terminal coupled with the control terminal of the second transistor and having a second terminal coupled with a second terminal of the second transistor; and a third resistor having a first terminal coupled with the second terminal of the third transistor and having a second terminal coupled with a fixed-voltage terminal.
    Type: Application
    Filed: June 3, 2015
    Publication date: September 24, 2015
    Inventors: Kuo-Chin CHIU, Chih-Feng HUANG
  • Patent number: 9084327
    Abstract: A driver circuit for driving an LED array is disclosed. The LED array includes a first, a second, a third, a fourth LED device and a diode device. The second LED device is connected to the first LED device. The fourth LED device is connected to the third LED device. The diode device is connected between the second LED device and the third LED device. The driver circuit includes a first constant current regulator for coupling between the first and the second LED device; a second constant current regulator for coupling between the second and the third LED device; a third constant current regulator for coupling between the third and the fourth LED device; a fourth constant current regulator for coupling between the fourth LED device and a fixed-voltage terminal; and a control circuit coupled with the first, the second, the third, and the fourth constant current regulators.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: July 14, 2015
    Assignee: Richtek Technology Corporation
    Inventors: Kuo-Chin Chiu, Chih-Feng Huang
  • Patent number: 9048732
    Abstract: A control circuit for an AC-DC power converter includes a junction field effect transistor (JFET), a first resistor, a second resistor, and a third resistor. The JFET includes a substrate, a drain, a source, a gate, a first oxide layer, and a second oxide layer. The first oxide layer is attached to a region located between the drain and the gate of the JFET, and the second oxide layer is not attached to a region located between the drain and the gate of the JFET. The first resistor is positioned on the first oxide layer, and the second resistor and the third resistor are positioned on the second oxide layer. When the JFET and the first resistor receive an input power signal, the first, the second, and the third resistors divide the input power signal, and prevent from the breakdown of the first oxide layer and the second oxide layer.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: June 2, 2015
    Assignee: Richtek Technology Corporation
    Inventors: Yi-Wei Lee, Chih-Feng Huang, Kuo-Chin Chiu
  • Patent number: 8907583
    Abstract: An LED driving device includes: a rectifying circuit for outputting a DC voltage to a string of M LED units; (M?1) first switching circuits each coupled between a corresponding one of first to (M?1)th LED units and ground; and a second switching circuit coupled between an Mth LED unit and ground. When the DC voltage is sufficient to turn on first to kth LED units, where 1?k?M, the kth LED unit is coupled to ground through first and second conductive paths provided by a resistor unit, and a corresponding first switching circuit or the second switching circuit, and each of the first to (k?1)th LED units is coupled to ground through a third conductive path provided by a corresponding first switching circuit and the resistor unit.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: December 9, 2014
    Assignee: Richtek Technology Corp.
    Inventors: Chih-Feng Huang, Kuo-Chin Chiu
  • Publication number: 20140354163
    Abstract: An LED driving device includes: a rectifying circuit for outputting a DC voltage to a string of M LED units; (M?1) first switching circuits each coupled between a corresponding one of first to (M?1)th LED units and ground; and a second switching circuit coupled between an Mth LED unit and ground. When the DC voltage is sufficient to turn on first to kth LED units, where 1?k?M, the kth LED unit is coupled to ground through first and second conductive paths provided by a resistor unit, and a corresponding first switching circuit or the second switching circuit, and each of the first to (k?1)th LED units is coupled to ground through a third conductive path provided by a corresponding first switching circuit and the resistor unit.
    Type: Application
    Filed: October 29, 2013
    Publication date: December 4, 2014
    Applicant: RICHTEK TECHNOLOGY CORP.
    Inventors: Chih-Feng Huang, Kuo-Chin Chiu
  • Publication number: 20140355320
    Abstract: A control circuit for an AC-DC power converter includes a junction field effect transistor (JFET), a first resistor, a second resistor, and a third resistor. The JFET includes a substrate, a drain, a source, a gate, a first oxide layer, and a second oxide layer. The first oxide layer is attached to a region located between the drain and the gate of the JFET, and the second oxide layer is not attached to a region located between the drain and the gate of the JFET. The first resistor is positioned on the first oxide layer, and the second resistor and the third resistor are positioned on the second oxide layer. When the JFET and the first resistor receive an input power signal, the first, the second, and the third resistors divide the input power signal, and prevent from the breakdown of the first oxide layer and the second oxide layer.
    Type: Application
    Filed: June 3, 2014
    Publication date: December 4, 2014
    Applicant: Richtek Technology Corporation
    Inventors: Yi-Wei LEE, Chih-Feng HUANG, Kuo-Chin CHIU
  • Patent number: D852151
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: June 25, 2019
    Assignee: ZIPPY TECHNOLOGY CORP.
    Inventors: Chin-Wen Chou, Yung-Hsin Huang, Yu-Yuan Chang, Yung-Feng Chiu, Chun-Lung Su, Chih-Hao Chen
  • Patent number: RE47548
    Abstract: A waterproofing backing adhesive structure is disclosed. The waterproofing backing adhesive structure is applied to an electronic device having a front cover and a display panel. The waterproofing backing adhesive structure includes an adhesive main body, an adhesive material, and a plurality of air chambers. The plurality of air chambers are formed on at least one of the surfaces of an upper surface or a bottom surface of the adhesive main body which is attached with the adhesive material for accommodating the air of a bubble generated when the adhesive main body is attached to the front cover or the display panel. The plurality of air chambers are for releasing the pressure of the bubble.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: July 30, 2019
    Assignee: WISTRON CORPORATION
    Inventors: Hou-Chun Huang, Chih-Feng Yeh