Patents by Inventor Chih-Hao Ho

Chih-Hao Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210311095
    Abstract: A probe card and a probe module thereof are provided. The probe card includes a first strengthening board, a fixed frame, a probe module, and a slidable frame. The first strengthening board includes a top surface, a bottom surface, and a mounting hole. An inner wall of the mounting hole is formed with an inner flange. The fixed frame is disposed on the top surface of the first strengthening board and surrounds the mounting hole. The probe module is disposed in the mounting hole and includes an outer flange including a physical region and multiple gap regions. The physical region abuts against the inner flange of the first strengthening board. The slidable frame is disposed on an inner wall of the fixed frame and is slidable between a released position and a fixed position. Multiple pressing portions are disposed on an inner wall of the slidable frame.
    Type: Application
    Filed: April 2, 2021
    Publication date: October 7, 2021
    Applicant: MPI Corporation
    Inventors: Chung-Yen Huang, Chih-Wei Wen, Sheng-Feng Xu, Fuh-Chyun Tang, Chih-Hao Ho
  • Patent number: 10295567
    Abstract: A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: May 21, 2019
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Jun-Liang Lai, Chih-Hao Ho
  • Patent number: 10101362
    Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: October 16, 2018
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Yu-Hao Chen, Chih-Hao Ho
  • Patent number: 10070512
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: September 4, 2018
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chih-Hao Ho
  • Patent number: 10054627
    Abstract: A testing jig includes a substrate and a plurality of conductive elastic pieces, wherein the substrate has a recess and a plurality of circuits; the recess is located on a top surface of the substrate, while the circuits are provided on the top surface of the substrate. The conductive elastic pieces are provided on the substrate, and are respectively electrically connected to the circuits. Each of the conductive elastic pieces has a contact portion located within an orthographic projection range of the recess, wherein each of the contact portions contacts a pad of a DUT. Whereby, attenuation happens while transmitting test signals with high frequency can be effectively reduces by using the conductive elastic pieces to transmit test signals.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: August 21, 2018
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Chia-Nan Chou, Chih-Hao Ho
  • Patent number: 9927487
    Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: March 27, 2018
    Assignee: MPI CORPORATION
    Inventors: Chao-Ching Huang, Chih-Hao Ho, Wei-Cheng Ku
  • Patent number: 9835651
    Abstract: A high-frequency cantilever type probe card includes a base board, a probe base provided on the base board, two probes, and a capacitor having opposite ends electrically connected to the probes respectively. The probe base is made of an insulating material, and the probes are made of a conductive material. Each of the probes has an arm and a tip, wherein the arm is connected to the probe base, and the tip is adapted to contact a pad of a DUT. When the DUT generates a testing signal with a high frequency, and the testing signal is transmitted to one of the probes, the capacitor, and the other one of the probes in sequence, and then transmitted back to the DUT.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: December 5, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Jun-Liang Lai, Chih-Hao Ho
  • Publication number: 20170150592
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
    Type: Application
    Filed: February 3, 2017
    Publication date: May 25, 2017
    Applicant: MPI corporation
    Inventors: WEI-CHENG KU, JUN-LIANG LAI, CHIH-HAO HO
  • Publication number: 20170115326
    Abstract: A probe module includes a base adapted to be fixed to a tester, an engaging seat engaged with the base, a signal connector, an electrical signal transmitting member, and two probes located below the engaging seat. The engaging seat has an engaging opening and a first end surface. The signal connector is provided in the engaging opening, and has a signal conductive portion and a conductive ground. A signal wire and a ground layer of the electrical signal transmitting member are electrically connected to the signal conductive portion and the conductive ground, respectively. The probes are electrically connected to the signal wire and the ground layer, respectively. The probes extend out of a first extending reference plane of the first end surface. Alternatively, a reflector is used to reflect an image of the probes upward. Whereby, a length of the electrical signal transmitting member can be further shortened.
    Type: Application
    Filed: October 25, 2016
    Publication date: April 27, 2017
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, CHIH-HAO HO, HAO WEI
  • Patent number: 9622348
    Abstract: A multilayer circuit board includes a plurality of stacked substrates, a plurality of first conductive lands, and a plurality of second conductive lands. A surface at a side of each of the substrates has an exposed portion which is not covered by the neighboring substrate, wherein each of the first conductive lands is respectively provided on each of the exposed portions. Each of the second conductive lands is provided on the exposed portion of the outermost substrate, wherein each of the substrates has a conductor pattern to be electrically connected to one of the first conductive lands and to one of the second conductive lands.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: April 11, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chun-Chung Huang, Jing-Zhi Hung, Yung Nan Wu, Chih-Hao Ho
  • Patent number: 9596769
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: March 14, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chih-Hao Ho
  • Patent number: 9545002
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate has a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: January 10, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chih-Hao Ho
  • Publication number: 20170003319
    Abstract: A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened.
    Type: Application
    Filed: June 3, 2016
    Publication date: January 5, 2017
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, JUN-LIANG LAI, CHIH-HAO HO
  • Patent number: 9486292
    Abstract: Embodiments of systems, methods, and computer-readable media for real-time winding analysis for knot detection are disclosed. For example, one embodiment of the present invention includes a method having the steps of receiving a first wrapping signal indicating a first wrapping of the simulated thread around a second tool to create a first loop. The method further includes determining a first wrapping direction based at least in part on the first wrapping signal; receiving a first tightening signal indicating a pulling of a first end of the simulated thread through the first loop; determining a first half-hitch based at least in part on the first winding direction and the first tightening signal; and outputting the first half-hitch. In another embodiment, a computer-readable media includes code for a carrying out such a method.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: November 8, 2016
    Assignee: Immersion Corporation
    Inventors: Donald Douglas Nelson, Milan Ikits, Chih-Hao Ho, Kevin Kunkler
  • Publication number: 20160305981
    Abstract: A probe card for transmitting power signals from a tester to two devices under test (DUTs) is provided, which includes two signal pins, two power conducting circuits, and at least a matching part. The signal pins are made of conductive materials, wherein one end of the signal pin contacts one of the DUTs. The two power conducting circuits are electrically connected to the two signal pins respectively to transmit the power signals to the DUTs. One of two ends of the power conducting circuits is connected to the signal pins; the other end of the power conducting circuits is electrically connected to the tester. The matching part is electrically connected to the power conducting circuit in parallel to lower a resistance of the power conducting circuit below a predetermined value, or to lower a percentage error of resistance of the power conducting circuit below a predetermined percentage error.
    Type: Application
    Filed: April 13, 2016
    Publication date: October 20, 2016
    Applicant: MPI Corporation
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chih-Hao Ho, Hao Wei
  • Patent number: 9410986
    Abstract: A testing jig includes a substrate, a carrier provided on the substrate, two conductive members made of a conductive material, and a compensation member made of a conductive material. The substrate has a signal circuit and a grounding circuit thereon. The carrier has a base board made of an insulating material and a conductive circuit made of a conductive material provided thereon. The base board has a signal perforation aligning with the signal circuit, a grounding perforation aligning with the grounding circuit, and multiple compensation holes. The conductive members both have an end exposed out of the carrier, and are respectively fitted in the signal perforation and the grounding perforation to make another end thereof contact the signal circuit or the grounding circuit. The compensation member is fitted in one of the compensation holes to be electrically connected to the conductive member in the grounding perforation through the conductive circuit.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: August 9, 2016
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Chia-Nan Chou, Chih-Hao Ho
  • Publication number: 20160143141
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate first substrate a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections.
    Type: Application
    Filed: February 11, 2015
    Publication date: May 19, 2016
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, JUN-LIANG LAI, CHIH-HAO HO
  • Publication number: 20160139179
    Abstract: A high-frequency cantilever type probe card includes a base board, a probe base provided on the base board, two probes, and a capacitor having opposite ends electrically connected to the probes respectively. The probe base is made of an insulating material, and the probes are made of a conductive material. Each of the probes has an arm and a tip, wherein the arm is connected to the probe base, and the tip is adapted to contact a pad of a DUT. When the DUT generates a testing signal with a high frequency, and the testing signal is transmitted to one of the probes, the capacitor, and the other one of the probes in sequence, and then transmitted back to the DUT.
    Type: Application
    Filed: February 11, 2015
    Publication date: May 19, 2016
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, JUN-LIANG LAI, CHIH-HAO HO
  • Publication number: 20160128176
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
    Type: Application
    Filed: February 11, 2015
    Publication date: May 5, 2016
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, JUN-LIANG LAI, CHIH-HAO HO
  • Publication number: 20160018441
    Abstract: A probe card includes a connecting circuit board, a connector, and a probe. The connecting circuit board includes a substrate having a signal via and a plurality of ground vias, a signal feeding structure disposed on the substrate, and a connecting layer having the connector disposed thereon. The signal feeding structure includes a signal feeding pad and a ground pad, which is connected to the ground via, and has a matching compensation opening having a first side and a second side wider than the first side. The signal feeding pad does not contact the ground pad, and has a first end and a second end wider than the first end. The second end is connected to the signal via. The connecting layer has a signal connecting portion connected to the signal via, and a ground connecting portion connected to the ground vias. The probe is connected to the first end.
    Type: Application
    Filed: July 13, 2015
    Publication date: January 21, 2016
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, JUN-LIANG LAI, CHIH-HAO HO