Abstract: A conductive bump structure of a circuit board includes at least one composite conductive bump formed in at least one bump preservation region on a conductive layer of the circuit board. The composite conductive bump includes a raised portion and a conductive pillar. The raised portion is raised from a top surface of the conductive layer by a height. A bottom of the conductive pillar is in contact with and is combined with a curved top surface of the raised portion, and a top of the conductive pillar is raised upwards to protrude beyond the top planar surface of the conductive layer by a protrusion height.

Abstract: A circuit board structure that includes a resin-based conductive adhesive layer is disclosed, in which a conductive layer is arranged between a first circuit board and a second circuit board. The conductive layer includes a first conductive paste layer and the resin-based conductive adhesive layer is formed on the first conductive paste layer. The resin-based conductive adhesive layer contains a sticky resin material and a plurality of conductive particles distributed in the sticky resin material. The plurality of conductive particles establish an electrical connection between the first conductive paste layer and the resin-based conductive adhesive layer.

Abstract: A circuit board structure that includes a resin-based conductive adhesive layer is disclosed, in which a conductive layer is arranged between a first circuit board and a second circuit board. The conductive layer includes a first conductive paste layer and the resin-based conductive adhesive layer is formed on the first conductive paste layer. The resin-based conductive adhesive layer contains a sticky resin material and a plurality of conductive particles distributed in the sticky resin material. The plurality of conductive particles establish an electrical connection between the first conductive paste layer and the resin-based conductive adhesive layer.

Abstract: A pressure adaptive contact structure for a flexible circuit board is disclosed, in which the flexible circuit board is provided with a weakening portion or a partly surrounding weakening portion between a plurality of first contact pads so that contact surfaces of the plurality of first contact pads are respectively contactable with corresponding ones of contact points to generate contact pressing forces applied to the contact points in a manner that the contact pressing forces are adaptively adjustable by the weakening portion to accommodate height differences between adjacent ones of the first contact pads to prevent the first contact pads from being stretched and pulled with respect to each other.

Abstract: A stacked insertion structure for a flexible circuit board is provided. The flexible circuit board has an insertion section that is connected through a bent connection section to a fold-back section. The fold-back section is backward folded, through the bent connection section, toward and stacked on the insertion section such that a second coupling surface of the fold-back section corresponds to and overlap a first coupling surface of the insertion section for being insertable into an insertion socket of a connector. The fold-back section and the insertion section are bonded together with an adhesive layer therebetween or a height adjustment layer is provided therebetween to adjust an overall height of the two.

Abstract: A pressure adaptive contact structure for a flexible circuit board is disclosed, in which the flexible circuit board is provided with a weakening portion or a partly surrounding weakening portion between a plurality of first contact pads so that contact surfaces of the plurality of first contact pads are respectively contactable with corresponding ones of contact points to generate contact pressing forces applied to the contact points in a manner that the contact pressing forces are adaptively adjustable by the weakening portion to accommodate height differences between adjacent ones of the first contact pads to prevent the first contact pads from being stretched and pulled with respect to each other.

Abstract: A stacked flexible printed circuit board assembly with a side connection section is provided, including a first flexible printed circuit board, a second flexible printed circuit board, and a curved connection section. The curved connection section is integrally connected to and between side edges of the first flexible printed circuit board and the second flexible printed circuit board. The first flexible printed circuit board is folded in a direction toward and thus stacked on the second flexible printed circuit board such that a plurality of first contact pads of the first flexible printed circuit board correspond respectively to a plurality of second contact pads of the second flexible printed circuit board. A height adjustment layer or an adhesive layer is provided between the first flexible printed circuit board and the second flexible printed circuit board to suit the need of thickness in plugging or soldering.

Abstract: A stacked flexible printed circuit board assembly with a side connection section is provided, including a first flexible printed circuit board, a second flexible printed circuit board, and a curved connection section. The curved connection section is integrally connected to and between side edges of the first flexible printed circuit board and the second flexible printed circuit board. The first flexible printed circuit board is folded in a direction toward and thus stacked on the second flexible printed circuit board such that a plurality of first contact pads of the first flexible printed circuit board correspond respectively to a plurality of second contact pads of the second flexible printed circuit board. A height adjustment layer or an adhesive layer is provided between the first flexible printed circuit board and the second flexible printed circuit board to suit the need of thickness in plugging or soldering.

Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. A resin-based conductive adhesive layer is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The resin-based conductive adhesive layer is pressed to bond between the conductive paste coating zone and a top insulation layer such that the conductive paste coating zone and the resin-based conductive adhesive layer achieve electrical connection therebetween.

Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.

Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.

Abstract: A signal attenuation reduction structure for a flexible circuit board includes a conductive paste coating zones formed on surfaces of high-frequency signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to a pair of high-frequency signal lines or covers a plurality of pairs of the high-frequency signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.

Abstract: A circuit board structure with selectively corresponding ground layers includes a first ground layer, a second ground layer, and a dielectric layer arranged between the first ground layer and the second ground layer to define a ground layer height difference between the first ground layer and the second ground layer. The first ground layer includes a plurality of non-electromagnetic shield areas. The circuit board includes a plurality of conductor wires formed thereon and selectively classified and divided into a first group of conductor wires and the second group of conductor wires. The first-group conductor wires are arranged to correspond to and electromagnetically couple to the first ground layer, and the second-group conductor wires are arranged to correspond to and electromagnetically couple to the second ground layer through the non-electromagnetic shield areas respectively, so that impedance value control is achieved.

Abstract: A circuit board structure with selectively corresponding ground layers includes a first ground layer, a second ground layer, and a dielectric layer arranged between the first ground layer and the second ground layer to define a ground layer height difference between the first ground layer and the second ground layer. The first ground layer includes a plurality of non-electromagnetic shield areas. The circuit board includes a plurality of conductor wires formed thereon and selectively classified and divided into a first group of conductor wires and the second group of conductor wires. The first-group conductor wires are arranged to correspond to and electromagnetically couple to the first ground layer, and the second-group conductor wires are arranged to correspond to and electromagnetically couple to the second ground layer through the non-electromagnetic shield areas respectively, so that impedance value control is achieved.

Abstract: Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.

Abstract: Disclosed are a method and a structure of penetration and combination for a flexible circuit board with a hinge assembly. A pre-formed flexible circuit board is processed by taking a pre-folding line as a center line to fold a connection section of the flexible circuit board toward the terminal distribution section. Then, the connection section is rolled in a direction toward the terminal distribution section so as to make the connection section forming a rolled body. The rolled body is then put through the bore of the hinge assembly to have the rolled body completely extend through the bore of the hinge assembly so that the extension section of the flexible circuit board is positioned in the bore of the hinge assembly and the first end and the second end are respectively located at opposite sides of the bore of the hinge assembly.

Abstract: An attenuation reduction grounding pattern structure for connection pads of a flexible circuit board includes a plurality of high frequency connection pads formed on a component surface of a substrate and a plurality of differential mode signal lines arranged on the substrate and connected to the high frequency connection pads. The substrate has a grounding surface forming a grounding layer. The grounding layer includes an attenuation reduction grounding pattern structure formed at a location corresponding to the transition zone and including a hollowed area and a protruded portion. The protruded portion extends a predetermined length in a direction from the grounding layer toward the high frequency connection pads and along the adjacent high frequency connection pads to reach the transition zone. The protruded portion and the high frequency connection pads form a polarization-direction-varying electric field in the transition zone.

Abstract: Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof.

Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad. The first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.

Abstract: An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.