Patents by Inventor Chih-Kuie Yang

Chih-Kuie Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9433108
    Abstract: A method for fabricating a circuit board structure having at least an embedded electronic element is disclosed, which includes the steps of: providing a substrate and embedding at least an electronic element in the substrate with an active surface and a plurality of electrode pads of the electronic element exposed from a surface of the substrate; forming a plurality of conductive bumps on the electrode pads of the electronic element; and covering the surface of the substrate and the active surface of the electronic element with a dielectric layer and a metal layer stacked on the dielectric layer, wherein the conductive bumps penetrate the dielectric layer so as to be in contact with the metal layer, thereby simplifying the fabrication process, reducing the fabrication cost and saving the fabrication time.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: August 30, 2016
    Assignee: Unimicron Technology Corporation
    Inventors: Yung-Ching Lin, Chih-Kuie Yang, Ta-Han Lin
  • Publication number: 20140201992
    Abstract: A method for fabricating a circuit board structure having at least an embedded electronic element is disclosed, which includes the steps of: providing a substrate and embedding at least an electronic element in the substrate with an active surface and a plurality of electrode pads of the electronic element exposed from a surface of the substrate; forming a plurality of conductive bumps on the electrode pads of the electronic element; and covering the surface of the substrate and the active surface of the electronic element with a dielectric layer and a metal layer stacked on the dielectric layer, wherein the conductive bumps penetrate the dielectric layer so as to be in contact with the metal layer, thereby simplifying the fabrication process, reducing the fabrication cost and saving the fabrication time.
    Type: Application
    Filed: December 5, 2013
    Publication date: July 24, 2014
    Applicant: UNIMICRON TECHNOLOGY CORPORATION
    Inventors: Yung-Ching Lin, Chih-Kuie Yang, Ta-Han Lin