Patents by Inventor Chih-Kung Chang

Chih-Kung Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7704778
    Abstract: A microlens structure and a method of fabrication thereof are provided. The method comprises forming a layer of microlens material over a substrate, which has photo-sensitive elements formed therein. The microlens material, which comprises a photo-resist material, is exposed in accordance with a desired pattern a plurality of times. The energy used with each exposure process is less than the energy required if a single exposure is used. Furthermore, the masks used for each exposure may differ. In an embodiment, the masks are varied so as to create a notch in the upper corner of the microlens.
    Type: Grant
    Filed: July 14, 2005
    Date of Patent: April 27, 2010
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Chang Kao, Chih-Kung Chang, Fu-Tien Weng, Bii-Junq Chang
  • Publication number: 20090104547
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Application
    Filed: December 31, 2008
    Publication date: April 23, 2009
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Patent number: 7507598
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: March 24, 2009
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Patent number: 7505206
    Abstract: A method of manufacturing a microlens device by depositing a microlens material layer over a substrate that includes photo-sensors. The microlens material layer is then exposed and developed to define microlens material elements, including first microlens material elements and second microlens material elements. Each second microlens material element is substantially greater in thickness relative to each first microlens material element. The microlens material elements are then heated to form a microlens array that includes first microlens array elements, each corresponding to a first microlens material element, and second microlens array elements, each corresponding to a second microlens material element. Each first microlens array element has a substantially greater focal length relative to each second microlens array element. For example, each second microlens array element is substantially greater in thickness relative to each first microlens array element.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: March 17, 2009
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Jack Deng, Chih-Kung Chang, Chin Chen Kuo, Ming-Chang Kao, Fu-Tien Weng, Bii-Junq Chang
  • Publication number: 20080007839
    Abstract: A method of manufacturing a microlens device by depositing a microlens material layer over a substrate that includes photo-sensors. The microlens material layer is then exposed and developed to define microlens material elements, including first microlens material elements and second microlens material elements. Each second microlens material element is substantially greater in thickness relative to each first microlens material element. The microlens material elements are then heated to form a microlens array that includes first microlens array elements, each corresponding to a first microlens material element, and second microlens array elements, each corresponding to a second microlens material element. Each first microlens array element has a substantially greater focal length relative to each second microlens array element. For example, each second microlens array element is substantially greater in thickness relative to each first microlens array element.
    Type: Application
    Filed: July 10, 2006
    Publication date: January 10, 2008
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jack DENG, Chih-Kung CHANG, Chin Chen KUO, M. C. KAO, Fu-Tien WENG, Bii-Junq CHANG
  • Publication number: 20070279520
    Abstract: A package module for an image sensing device is provided. The package module includes a substrate having thereon a photoelectric element array, a first optical element array formed on the photoelectric element array, a package lid having thereon a second optical element array opposite to the first optical element array and having an arrangement corresponding to that of the first optical element array; and a spacer disposed on a bonding area between the package lid and the substrate for adjusting a distance between the package lid and the substrate.
    Type: Application
    Filed: February 20, 2007
    Publication date: December 6, 2007
    Applicant: VISERA TECHNOLOGIES COMPANY, LTD.
    Inventors: Hsiao-Wen Lee, Chih-Kung Chang, Pai-Chun Peter Zung, Chien-Pang Lin
  • Patent number: 7264976
    Abstract: A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plurality of patterned photoresist features can then be reflowed inside the grid.
    Type: Grant
    Filed: February 23, 2005
    Date of Patent: September 4, 2007
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jack Deng, Chin Chen Kuo, Fu-Tien Weng, Chih-Kung Chang, Bii-Junq Chang
  • Publication number: 20070018073
    Abstract: A CMOS image sensor cell includes a first pixel area in which at least one first photodiode is disposed for generating a first sense signal in response to a photo-signal of a first color; a second pixel area neighboring the first pixel area, in which at least one second photodiode is disposed for generating a second sense signal in response to a photo-signal of a second color; and a third pixel area neighboring the first and second pixel areas, in which at least one third photodiode is disposed for generating a third sense signal in response to a photo-signal of a third color. A sense amplifier is disposed substantially within the first, second and third pixel areas for amplifying the first, second and third sense signals. The first, second and third pixel areas that substantially occupy an entire area of the image sensor cell are substantially equal in size.
    Type: Application
    Filed: August 25, 2005
    Publication date: January 25, 2007
    Inventors: Tzu-Hsuan Hsu, Dun-Nian Yaung, Chih-Kung Chang
  • Publication number: 20060189062
    Abstract: A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plurality of patterned photoresist features can then be reflowed inside the grid.
    Type: Application
    Filed: February 23, 2005
    Publication date: August 24, 2006
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jack Deng, Chin Kuo, Fu-Tien Weng, Chih-Kung Chang, Bii-Junq Chang
  • Publication number: 20060189024
    Abstract: A microlens structure and a method of fabrication thereof are provided. The method comprises forming a layer of microlens material over a substrate, which has photo-sensitive elements formed therein. The microlens material, which comprises a photo-resist material, is exposed in accordance with a desired pattern a plurality of times. The energy used with each exposure process is less than the energy required if a single exposure is used. Furthermore, the masks used for each exposure may differ. In an embodiment, the masks are varied so as to create a notch in the upper corner of the microlens.
    Type: Application
    Filed: July 14, 2005
    Publication date: August 24, 2006
    Inventors: Ming-Chang Kao, Chih-Kung Chang, Fu-Tien Weng, Bii-Junq Chang
  • Publication number: 20060183027
    Abstract: A method of manufacturing a microlens includes forming a photoresist layer over a substrate having a photo sensor located therein and exposing the photoresist layer in an exposure system having a lower resolution. The exposure uses a photomask having a microlens pattern comprising a plurality of dark regions and clear regions alternately disposed. The photoresist is developed to from the microlens having a curved shape.
    Type: Application
    Filed: February 17, 2005
    Publication date: August 17, 2006
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hua-Tai Lin, J. Chen, Chih-Kung Chang
  • Patent number: 7071032
    Abstract: A new method is provided of treating the wafer prior to the process of singulating the wafer into individual die. A first surface of the wafer over which CMOS image sensor devices have been created is coated with a layer of material that is non-soluble in water. The wafer is attached to a tape by bringing a second surface of the wafer in contact with the tape. The wafer is singulated by approaching the first surface of the wafer and by sawing first through the layer of material that has been coated over the first surface of the wafer and by then sawing through the wafer, stopping at the surface of the tape. A thorough water rinse is applied to the surface of the singulated wafer, followed by a wafer clean applying specific chemicals for this purpose. The singulated die is now removed from the tape and further processed by applying steps of die mount, wire bonding, surrounding the die in a mold compound and marking the package.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: July 4, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hung-Jen Hsu, Yu-Kung Hsiao, Chih-Kung Chang, Sheng-Liang Pan, Fu-Tien Weng
  • Publication number: 20060131710
    Abstract: The present invention provides an advanced cavity structure for optically sensitive devices in wafer level chip scale package and methods of manufacturing thereof. Image sensor or light detection integrated circuits are formed on substrate. Substantially absorptive bleached cavity walls are formed about the image sensor or light detection integrated circuits. Upon attaching a transparent layer to the bleached cavity walls and above the image sensor or light detection integrated circuits, open chambers are formed thereby permitting the image sensor or light detection integrated circuits to receive and manipulate signals without decreasing or decaying the optical sensitivity of the incident light. Furthermore, individual image sensor or light detection integrated circuits may be separated from each other to comprise wafer level chip scale packages of at least one image sensor or light detection integrated circuits, at least one transparent layer, and at least one open chamber.
    Type: Application
    Filed: December 21, 2004
    Publication date: June 22, 2006
    Inventors: Chin Kuo, Jack Deng, Fu-Tien Weng, Chih-Kung Chang, Bii-Jung Chang
  • Publication number: 20060019424
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Application
    Filed: June 20, 2005
    Publication date: January 26, 2006
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Patent number: 6964916
    Abstract: A method for processing a semiconductor substrate includes providing a substrate having at least one filter region with a plurality of bond pads in it. Metal is deposited above the bond pads, to reduce the bond pad step height. A planarization layer is formed such that the deposited metal has a height near to a height of the planarization layer. At least one color resist layer is formed above the planarization layer.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: November 15, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chin Chen Kuo, Chih-Kung Chang, Hung-Jen Hsu, Fu-Tien Weng, Te-Fu Tseng
  • Patent number: 6878642
    Abstract: A new method to form passivation openings in the manufacture of an integrated circuit device is achieved. The passivation openings have gradually sloping sidewalls that allow a protective tape to be completely removed without leaving adhesive residue. A semiconductor substrate is provided. A passivation layer is deposited. An organic photoresist layer is deposited overlying the passivation layer. The organic photoresist layer is patterned to expose the passivation layer in areas where passivation openings are planned. The organic photoresist layer is reflowed to create gradually sloping sidewalls on the organic photoresist layer. The passivation layer is etched through to from the passivation openings. The passivation openings are thereby formed with gradually sloping sidewalls. The organic photoresist layer is stripped away. A protective tape is applied overlying the passivation layer and the passivation openings. The protective tape is removed.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: April 12, 2005
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Hung-Jen Hsu, Yu-Kung Hsiao, Chih-Kung Chang, Sheng-Liang Pan, Kuo-Liang Lu
  • Patent number: 6861207
    Abstract: A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been filled. Because of the improved topography, the thickness of the microlens material is more uniform, thereby facilitating the formation of uniformly shaped microlenses.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: March 1, 2005
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Jen Hsu, Chih-Kung Chang, Fu-Tien Weng, Te-Fu Tseng, Chin-Chen Kuo, Chiung-Yuan Chang
  • Patent number: 6849533
    Abstract: A method for fabricating a microelectronic product provides for forming a planarizing layer upon a bond pad and a topographic feature, both formed laterally separated over a substrate. The planarizing layer is formed with a diminished thickness upon the bond pad such that it may be readily etched to expose the bond pad while employing as a mask an additional layer formed over the topographic feature but not over the bond pad. The method is particularly useful for forming color filter sensor image array optoelectronic products with attenuated bond pad corrosion.
    Type: Grant
    Filed: January 29, 2003
    Date of Patent: February 1, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., LTD
    Inventors: Chih-Kung Chang, Yu-Kung Hsiao, Sheng-Liang Pan, Fu-Tien Wong, Chin-Chen Kuo, Chung-Sheng Hsiung, Hung-Jen Hsu, Yi-Ming Dai, Po-Wen Lin, Te-Fu Tseng
  • Publication number: 20040265752
    Abstract: A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been filled. Because of the improved topography, the thickness of the microlens material is more uniform, thereby facilitating the formation of uniformly shaped microlenses.
    Type: Application
    Filed: June 30, 2003
    Publication date: December 30, 2004
    Inventors: Hung-Jen Hsu, Chih-Kung Chang, Fu-Tien Weng, Te-Fu Tseng, Chin-Chen Kuo, Chiung-Yuan Chang
  • Publication number: 20040248384
    Abstract: A method for processing a semiconductor substrate includes providing a substrate having at least one filter region with a plurality of bond pads in it. Metal is deposited above the bond pads, to reduce the bond pad step height. A planarization layer is formed such that the deposited metal has a height near to a height of the planarization layer. At least one color resist layer is formed above the planarization layer.
    Type: Application
    Filed: February 17, 2004
    Publication date: December 9, 2004
    Inventors: Chin Chen Kuo, Chih-Kung Chang, Hung-Jen Hsu, Fu-Tien Weng, Te-Fu Tseng