Abstract: An example discloses a smart ring comprising a processor; a transceiver, wherein the transceiver is coupled to the processor to receive instruction from the processor and the transceiver is coupled to a computing device for transmitting data of the smart ring to the computing device and/or receiving data from the computing device; and a G-sensor, wherein the G-sensor is coupled to the processor and configured to detect up and down movement of the smart ring.

Abstract: A wireless network device including a substrate, a plurality of antennas, a central antenna and a radio frequency (RF) transceiving module is provided. The antennas are disposed near an edge of the substrate. The central antenna is disposed near a central point of the substrate. The RF transceiving module is coupled to the antennas and the central antenna. In a first mode of the wireless network device, the RF transceiving module receives and transmits signals through the antennas. In a second mode of the wireless network device, the RF transceiving module receives and transmits the signals through a part of the antennas and the central antenna.

Abstract: A wireless network device including a substrate, a plurality of antennas, a central antenna and a radio frequency (RF) transceiving module is provided. The antennas are disposed near an edge of the substrate. The central antenna is disposed near a central point of the substrate. The RF transceiving module is coupled to the antennas and the central antenna. In a first mode of the wireless network device, the RF transceiving module receives and transmits signals through the antennas. In a second mode of the wireless network device, the RF transceiving module receives and transmits the signals through a part of the antennas and the central antenna.

Abstract: The invention relates to a display rear shell with waterproof and fireproof properties comprising a main layer of a pulp made from hardwood in an amount from 80% to 90% by weight of the main layer, a pulp waterproof composition in an amount from 5% to 15% by weight of the main layer, and a flame retardant in an amount of a remaining weight percentage by weight of the main layer, a fireproof layer and a waterproof layer, in place of a traditional plastic display rear shell using plastic materials for characteristics as waterproof, fireproof and light weight.

Abstract: A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.

Abstract: A voice coil motor with a lateral attraction force comprising a magnetic device, a lens carrier, a base, a plurality of guide posts, a set of surface coil and a guiding magnetic plate. The first contact structure and the second contact structure of the magnetic device are contacted the plurality of guide posts respectively. There is at least one contacting point between the first contact structure and one of the plurality of guide posts, and there are at least two contacting point between the second contact structure and the other of the plurality of guide posts.

Abstract: A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier s greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant.

Abstract: The invention relates to a display connector with a 4K image resolution. It primarily comprises a first connector, a second connector and a third connector. The present invention is a connector for a display to support high specification images with quad full high definition (QFHD). The third connector is used to connect an existing video playback device merely having the playback function of full high definition (FHD). Then the FHD image data is upscaled through an electrically connected image upscaling module of the first connector, and QFHD image signals with an ultra-high definition resolution is displayed through an electronic display device. Accordingly, the QFHD image signals with the ultra-high definition resolution can be displayed without upgrading the hardware of the player or computer so as to dramatically reduce the required cost of upgrading the hardware.

Abstract: A rotary lighting fixture having a speaker with a playback function is revealed herein, comprising a shell having an opening, a speaker fitted inside the shell, and an annular LED module having plural LEDs fitted at the opening of the shell for illumination and playback functions. In addition, the lighting fixture also combines with a power supply base with a rotary function embedded in a ceiling and a wall for substantially saving space in use thereof, promoting interior designs by its aesthetic appearance and adjusting angles of incidence from the LEDs as desired.

Abstract: The invention relates to a LED display device. Primarily, it comprises a liquid crystal display, a shell, a plurality of lighting modules and two reflective layers. The present invention is a liquid crystal display device which uses the light emitting diode to combine with polymethylmethacrylate (PMMA) as a lighting module. The secondary lens theory composed of different refractive index between air and PMMA and the angle of the reflective layers on the inner surface of the side planes are used to effectively increase the refracted angle of light emitted from the light emitting diode and the distance of the mixed light and to effectively reach the advantages of thinner liquid crystal display and lower power consumption.

Abstract: The invention relates to a display connector with a 4K image resolution. It primarily comprises a first connector, a second connector and a third connector. The present invention is a connector for a display to support high specification images with quad full high definition (QFHD). The third connector is used to connect an existing video playback device merely having the playback function of full high definition (FHD). Then the FHD image data is upscaled through an electrically connected image upscaling module of the first connector, and QFHD image signals with an ultra-high definition resolution is displayed through an electronic display device. Accordingly, the QFHD image signals with the ultra-high definition resolution can be displayed without upgrading the hardware of the player or computer so as to dramatically reduce the required cost of upgrading the hardware.

Abstract: An integrated circuit and a method of fabricating the integrated circuit are provided. In various embodiments, the integrated circuit includes a semiconductor substrate, at least one deep n-well in the semiconductor substrate, at least one p-channel metal-oxide-semiconductor transistor in the deep n-well, at least one n-channel metal-oxide-semiconductor transistor outside of the deep n-well, an first interconnect structure, and a protection component. Both of the p-channel metal-oxide-semiconductor transistor and the n-channel metal-oxide-semiconductor transistor are disposed in the semiconductor substrate, and are electrically coupled by the first interconnect structure. The protection component is disposed in the semiconductor substrate, wherein the protection component is electrically coupled to the deep n-well.

Abstract: An integrated circuit and a method of fabricating the integrated circuit are provided. In various embodiments, the integrated circuit includes a semiconductor substrate, at least one deep n-well in the semiconductor substrate, at least one p-channel metal-oxide-semiconductor transistor in the deep n-well, at least one n-channel metal-oxide-semiconductor transistor outside of the deep n-well, an first interconnect structure, and a protection component. Both of the p-channel metal-oxide-semiconductor transistor and the n-channel metal-oxide-semiconductor transistor are disposed in the semiconductor substrate, and are electrically coupled by the first interconnect structure. The protection component is disposed in the semiconductor substrate, wherein the protection component is electrically coupled to the deep n-well.

Abstract: A rotary lighting fixture having a speaker with a playback function is revealed herein, comprising a shell having an opening, a speaker fitted inside the shell, and an annular LED module having plural LEDs fitted at the opening of the shell for illumination and playback functions. In addition, the lighting fixture also combines with a power supply base with a rotary function embedded in a ceiling and a wall for substantially saving space in use thereof, promoting interior designs by its aesthetic appearance and adjusting angles of incidence from the LEDs as desired.

Abstract: The invention relates to a display rear shell with waterproof and fireproof properties comprising a main layer of a pulp made from hardwood in an amount from 80% to 90% by weight of the main layer, a pulp waterproof composition in an amount from 5% to 15% by weight of the main layer, and a flame retardant in an amount of a remaining weight percentage by weight of the main layer, a fireproof layer and a waterproof layer, in place of a traditional plastic display rear shell using plastic materials for characteristics as waterproof, fireproof and light weight.

Abstract: A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.

Abstract: A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.

Abstract: A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer.