Patents by Inventor Chih-Ming Peng
Chih-Ming Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240112969Abstract: An in-mold electronic (IME) device includes a curved substrate, a first conductive layer, a dielectric layer, a gap compensation layer, and a second conductive layer. The curved substrate has a first surface. The first conductive layer is disposed on the first surface. The dielectric layer is disposed on the first conductive layer and has a first thickness. The gap compensation layer is disposed on the first surface and connected to the dielectric layer. The gap compensation layer has a second thickness. The second conductive layer is disposed on the gap compensation layer and electrically connected to the gap compensation layer. A curvature radius of the curved substrate is c, a ratio of the second thickness to the first thickness is r, and c and r satisfy a relationship: r=1.5?0.02c±15%.Type: ApplicationFiled: July 28, 2023Publication date: April 4, 2024Applicant: Industrial Technology Research InstituteInventors: Yu-Ming Peng, Hsiao-Fen Wei, Chih-Chia Chang
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Publication number: 20240096867Abstract: A semiconductor structure is provided and includes a first gate structure, a second gate structure, and at least one local interconnect that extend continuously across a non-active region from a first active region to a second active region. The semiconductor structure further includes a first separation spacer disposed on the first gate structure and first vias on the first gate structure. The first vias are arranged on opposite sides of the first separation spacer are isolated from each other and apart from the first separation spacer by different distances.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Charles Chew-Yuen YOUNG, Chih-Liang CHEN, Chih-Ming LAI, Jiann-Tyng TZENG, Shun-Li CHEN, Kam-Tou SIO, Shih-Wei PENG, Chun-Kuang CHEN, Ru-Gun LIU
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Publication number: 20240088267Abstract: A semiconductor device comprises a fin structure disposed over a substrate; a gate structure disposed over part of the fin structure; a source/drain structure, which includes part of the fin structure not covered by the gate structure; an interlayer dielectric layer formed over the fin structure, the gate structure, and the source/drain structure; a contact hole formed in the interlayer dielectric layer; and a contact material disposed in the contact hole. The fin structure extends in a first direction and includes an upper layer, wherein a part of the upper layer is exposed from an isolation insulating layer. The gate structure extends in a second direction perpendicular to the first direction. The contact material includes a silicon phosphide layer and a metal layer.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Yi PENG, Chih Chieh YEH, Chih-Sheng CHANG, Hung-Li CHIANG, Hung-Ming CHEN, Yee-Chia YEO
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Publication number: 20240014118Abstract: In a flip chip package, lines, an identification line and a dummy line are provided on a first surface of a light-transmissive carrier, and a supportive layer is disposed on a second surface of the light-transmissive carrier. Bumps and an identification bump of a chip are bonded to the lines and the identification line, respectively. Shadows of the dummy line, the identification line and the identification bump which are projected on the second surface are visible from an opening of the supportive layer. The shadows can be inspected through the opening so as to know whether the bumps are bonded to the lines correctly.Type: ApplicationFiled: June 27, 2023Publication date: January 11, 2024Inventors: Chun-Te Lee, Chih-Ming Peng, Pi-Yu Peng, Hui-Yu Huang, Yin-Chen Lin
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Publication number: 20230380053Abstract: A flip-chip bonding structure includes a chip and a circuit board, the chip is bonded to the circuit board by bumps. The circuit board includes a light-transmissive substrate, a first circuit group, a second circuit group, a boundary circuit and an identifying member. The boundary circuit is located between the first and second circuit groups and projects a boundary circuit shadow on light-transmissive substrate. The boundary circuit shadow can be recognized according to the identifying member and is provided to identify the boundary between the first and second circuit groups or identify the position of leads with the smallest pitch.Type: ApplicationFiled: April 13, 2023Publication date: November 23, 2023Inventors: Chun-Te Lee, Chih-Ming Peng, Pi-Yu Peng, Hui-Yu Huang
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Patent number: 11792923Abstract: A storage device of the present invention is provided to store flexible circuit packages, each of the flexible circuit packages includes an electronic component and two circuit portions warped at both sides of the electronic component, respectively. The storage device includes a first carrier and a second carrier. The first carrier includes first accommodation elements provided for placement of the flexible circuit packages, and the second carrier includes a first press portion and a second press portion. As the second carrier is placed on the first carrier, the first and second press portions are provided to press the two circuit portions warped upwardly toward the second carrier so as to reduce the warpage of the two circuit portions.Type: GrantFiled: September 9, 2021Date of Patent: October 17, 2023Assignee: CHIPBOND TECHNOLOGY CORPORATIONInventors: Shih-Chieh Chang, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Patent number: 11602047Abstract: A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.Type: GrantFiled: July 20, 2021Date of Patent: March 7, 2023Assignee: CHIPBOND TECHNOLOGY CORPORATIONInventors: Yin-Chen Lin, Ming-Hsiao Ke, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Publication number: 20230044473Abstract: A double-sided flexible circuit board includes a flexible substrate, a first circuit layer, a second circuit layer, an insulating protection layer and a plurality of through circuit lines. The first and second circuit layers are located on a top surface and a bottom surface of the flexible substrate, respectively. The insulating protection layer covers a supporting line of the second circuit layer such that the supporting line is located between the flexible substrate and the insulating protection layer. The insulating protection layer can provide electrical insulation to the supporting line of the second circuit layer to avoid short circuit conditions of the double-sided flexible circuit board during test.Type: ApplicationFiled: June 10, 2022Publication date: February 9, 2023Inventors: Yin-Chen Lin, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Publication number: 20230039895Abstract: A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.Type: ApplicationFiled: May 11, 2022Publication date: February 9, 2023Inventors: Yin-Chen Lin, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Publication number: 20220110209Abstract: A storage device of the present invention is provided to store flexible circuit packages, each of the flexible circuit packages includes an electronic component and two circuit portions warped at both sides of the electronic component, respectively. The storage device includes a first carrier and a second carrier. The first carrier includes first accommodation elements provided for placement of the flexible circuit packages, and the second carrier includes a first press portion and a second press portion. As the second carrier is placed on the first carrier, the first and second press portions are provided to press the two circuit portions warped upwardly toward the second carrier so as to reduce the warpage of the two circuit portions.Type: ApplicationFiled: September 9, 2021Publication date: April 7, 2022Inventors: Shih-Chieh Chang, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Publication number: 20220087017Abstract: A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.Type: ApplicationFiled: July 20, 2021Publication date: March 17, 2022Inventors: Yin-Chen Lin, Ming-Hsiao Ke, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Patent number: 11234328Abstract: A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.Type: GrantFiled: September 25, 2020Date of Patent: January 25, 2022Assignee: CHIPBOND TECHNOLOGY CORPORATIONInventors: Chia-En Fan, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Patent number: 11206735Abstract: A flexible circuit board includes a flexible light-permeable carrier, a circuit layer, a mark and a stiffener. The circuit layer and the mark are located on a top surface of the flexible light-permeable carrier. A predetermined area and a stiffener mounting area corresponding to each other are defined on the top surface and a bottom surface of the flexible light-permeable carrier, respectively. The mark is opaque to create a shadow mark having a longitudinal reference side and a lateral reference side on the bottom surface. The stiffener is adhered to the stiffener mounting area defined on the bottom surface by aligning with the longitudinal reference side and the lateral reference side of the shadow mark.Type: GrantFiled: January 28, 2021Date of Patent: December 21, 2021Assignee: CHIPBOND TECHNOLOGY CORPORATIONInventors: Yin-Chen Lin, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Patent number: 11178756Abstract: A flexible circuit board includes a flexible light-permeable carrier, a circuit layer, a mark and a stiffener. The circuit layer and the mark are located on a top surface of the flexible light-permeable carrier. A predetermined area and a stiffener mounting area corresponding to each other are defined on the top surface and a bottom surface of the flexible light-permeable carrier, respectively. The mark is opaque to create a shadow mark having a longitudinal reference side and a lateral reference side on the bottom surface. The stiffener is adhered to the stiffener mounting area defined on the bottom surface by aligning with the longitudinal reference side and the lateral reference side of the shadow mark.Type: GrantFiled: January 28, 2021Date of Patent: November 16, 2021Assignee: CHIPBOND TECHNOLOGY CORPORATIONInventors: Yin-Chen Lin, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Patent number: 11177206Abstract: A layout structure of double-sided flexible circuit board includes a flexible substrate having a first surface and a second surface, a first circuit layer and a second circuit layer. An inner bonding region is defined on the first surface and an inner supporting region is defined on the second surface according to the inner bonding region. The first circuit layer is located on the first surface and includes first conductive lines which each includes an inner lead located on the inner bonding region. The second circuit layer is located on the second surface and includes second conductive lines which each includes an inner supporting segment located on the inner supporting region. A width difference between any two of the inner supporting segment of the second conductive lines is less than 8 ?m.Type: GrantFiled: March 30, 2020Date of Patent: November 16, 2021Assignee: CHIPBOND TECHNOLOGY CORPORATIONInventors: Chun-Te Lee, Chih-Ming Peng, Hui-Yu Huang, Yin-Chen Lin
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Publication number: 20210267047Abstract: A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.Type: ApplicationFiled: September 25, 2020Publication date: August 26, 2021Inventors: Chia-En Fan, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Publication number: 20210267049Abstract: A flexible circuit board includes a flexible light-permeable carrier, a circuit layer, a mark and a stiffener. The circuit layer and the mark are located on a top surface of the flexible light-permeable carrier. A predetermined area and a stiffener mounting area corresponding to each other are defined on the top surface and a bottom surface of the flexible light-permeable carrier, respectively. The mark is opaque to create a shadow mark having a longitudinal reference side and a lateral reference side on the bottom surface. The stiffener is adhered to the stiffener mounting area defined on the bottom surface by aligning with the longitudinal reference side and the lateral reference side of the shadow mark.Type: ApplicationFiled: January 28, 2021Publication date: August 26, 2021Inventors: Yin-Chen Lin, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Publication number: 20210185800Abstract: A circuit board includes a substrate having a through hole, a circuit layer, a first measurement mark and a second measurement mark. According to the first and second measurement marks, an electronic detection device can measure a first distance between a first edge of the through hole and the first measurement mark and a second distance between a second edge of the through hole and the second measurement mark to determine whether the through hole has an undesired size or shift.Type: ApplicationFiled: May 5, 2020Publication date: June 17, 2021Inventors: Yi-Chen Lien, Yen-Ping Huang, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
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Publication number: 20210159159Abstract: A layout structure of double-sided flexible circuit board includes a flexible substrate having a first surface and a second surface, a first circuit layer and a second circuit layer. An inner bonding region is defined on the first surface and an inner supporting region is defined on the second surface according to the inner bonding region. The first circuit layer is located on the first surface and includes first conductive lines which each includes an inner lead located on the inner bonding region. The second circuit layer is located on the second surface and includes second conductive lines which each includes an inner supporting segment located on the inner supporting region. A width difference between any two of the inner supporting segment of the second conductive lines is less than 8 ?m.Type: ApplicationFiled: March 30, 2020Publication date: May 27, 2021Inventors: Chun-Te Lee, Chih-Ming Peng, Hui-Yu Huang, Yin-Chen Lin
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Patent number: 10880993Abstract: A circuit board includes a substrate, a first measurement mark and a second measurement mark, the first and second measurement marks are located on a predetermined punch area of the substrate. After punching, the predetermined punch area is removed such that the circuit board has a through hole and a sheet is separated from the circuit board. By the first and second measurement marks on the sheet, a first distance between a first edge of the sheet and the first measurement mark and a second distance between a second edge of the sheet and the second measurement mark can be measured to determine whether the through hole is shifted or has an incorrect size.Type: GrantFiled: June 24, 2020Date of Patent: December 29, 2020Assignee: CHIPBOND TECHNOLOGY CORPORATIONInventors: Yi-Chen Lien, Yen-Ping Huang, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee