Patents by Inventor Chih-shen Yang
Chih-shen Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240087917Abstract: The disclosed techniques include a space filling device to be used with a wet bench in chemical replacement procedures. The space filling device has an overall density that is higher than the chemicals used to purge the wet bench. As such, when embedded into the wet bench, or more specifically, the chemical tank of the wet bench, the space filling device will occupy a portion of the interior volume space. As a result, less purging chemicals are used to fill and bath the wet bench.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Inventors: Yen-Ji CHEN, Chih-Shen YANG, Cheng-Yi HUANG
-
Publication number: 20240078370Abstract: Various techniques are disclosed for automatically generating sub-cells for a non-final layout of an analog integrated circuit. Device specifications and partition information for the analog integrated circuit is received. Based on the device specifications and the partition information, first cut locations for a first set of cuts to be made along a first direction of a non-final layout of the analog integrated circuit and second cut locations for a second set of cuts to be made along a second direction in the non-final layout are determined. The first set of cuts are made in the non-final layout at the cut locations to produce a temporary layout. The second set of cuts are made in the temporary layout at the cut locations to produce a plurality of sub-cells.Type: ApplicationFiled: August 10, 2023Publication date: March 7, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Chiang Chang, Wen-Shen Chou, Yung-Chow Peng, Yung-Hsu Chuang, Yu-Tao Yang, Bindu Madhavi Kasina
-
Publication number: 20240014016Abstract: A Faraday shield, a semiconductor processing apparatus, and an etching apparatus are provided. The Faraday shield includes a plurality of conductive slices and a spacer interposed between adjacent two of the conductive slices to electrically isolate the adjacent two of conductive slices from one another. The conductive slices are separately arranged aside one another and oriented along a circumference of the Faraday shield. A coil is wound around the circumference of the Faraday shield.Type: ApplicationFiled: September 22, 2023Publication date: January 11, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Hsiang Chen, Ching-Horng Chen, Yen-Ji Chen, Cheng-Yi Huang, Chih-Shen Yang
-
Patent number: 11854841Abstract: The disclosed techniques include a space filling device to be used with a wet bench in chemical replacement procedures. The space filling device has an overall density that is higher than the chemicals used to purge the wet bench. As such, when embedded into the wet bench, or more specifically, the chemical tank of the wet bench, the space filling device will occupy a portion of the interior volume space. As a result, less purging chemicals are used to fill and bath the wet bench.Type: GrantFiled: July 25, 2022Date of Patent: December 26, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yen-Ji Chen, Chih-Shen Yang, Cheng-Yi Huang
-
Publication number: 20220359236Abstract: The disclosed techniques include a space filling device to be used with a wet bench in chemical replacement procedures. The space filling device has an overall density that is higher than the chemicals used to purge the wet bench. As such, when embedded into the wet bench, or more specifically, the chemical tank of the wet bench, the space filling device will occupy a portion of the interior volume space. As a result, less purging chemicals are used to fill and bath the wet bench.Type: ApplicationFiled: July 25, 2022Publication date: November 10, 2022Inventors: Yen-Ji CHEN, Chih-Shen YANG, Cheng-Yi HUANG
-
Patent number: 11482430Abstract: The disclosed techniques include a space filling device to be used with a wet bench in chemical replacement procedures. The space filling device has an overall density that is higher than the chemicals used to purge the wet bench. As such, when embedded into the wet bench, or more specifically, the chemical tank of the wet bench, the space filling device will occupy a portion of the interior volume space. As a result, less purging chemicals are used to fill and bath the wet bench.Type: GrantFiled: June 3, 2019Date of Patent: October 25, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yen-Ji Chen, Chih-Shen Yang, Cheng-Yi Huang
-
Publication number: 20220333246Abstract: A gas tube, a gas supply system containing the same and a semiconductor manufacturing method using the same are provided. The gas tube includes a porous material body and a resistant sheath surrounding the porous material body. The porous material body has a hollow tube structure and an empty cavity inside the hollow tube structure. The porous material body is hydrophobic and has a plurality of pores therein. The resistant sheath is disposed on the porous material body and surrounds the porous material body. The resistant sheath includes a plurality of holes penetrating through the resistant sheath.Type: ApplicationFiled: June 29, 2022Publication date: October 20, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Shiung Chen, Cheng-Yi Huang, Chih-Shen Yang, Shou-Wen Kuo, Po-Wen Chai
-
Patent number: 11414757Abstract: A gas tube, a gas supply system containing the same and a semiconductor manufacturing method using the same are provided. The gas tube includes a porous material body and a resistant sheath surrounding the porous material body. The porous material body has a hollow tube structure and an empty cavity inside the hollow tube structure. The porous material body is hydrophobic and has a plurality of pores therein. The resistant sheath is disposed on the porous material body and surrounds the porous material body. The resistant sheath includes a plurality of holes penetrating through the resistant sheath.Type: GrantFiled: October 28, 2018Date of Patent: August 16, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Shiung Chen, Cheng-Yi Huang, Chih-Shen Yang, Shou-Wen Kuo, Po-Wen Chai
-
Patent number: 11270950Abstract: An apparatus and a method for forming alignment marks are disclosed. The method for forming alignment marks is a photolithography-free process and includes the following operations. A laser beam is provided. The laser beam is divided into a plurality of laser beams separated from each other. The plurality of laser beams is shaped into a plurality of patterned beams, so that the plurality of patterned beams is shaped with patterns corresponding to alignment marks. The plurality of patterned beams is projected onto a semiconductor wafer.Type: GrantFiled: March 2, 2020Date of Patent: March 8, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yen-Chen Liu, Cheng-Hao Yu, Cheng-Yi Huang, Chao-Li Shih, Chih-Shen Yang
-
Patent number: 11075104Abstract: A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.Type: GrantFiled: August 27, 2019Date of Patent: July 27, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Fu-Zen Lin, Chien-Hsiang Chen, Chih-Shen Yang, Hsu-Shui Liu, Cheng-Yi Huang
-
Publication number: 20210098390Abstract: An apparatus and a method for forming alignment marks are disclosed. The method for forming alignment marks is a photolithography-free process and includes the following operations. A laser beam is provided. The laser beam is divided into a plurality of laser beams separated from each other. The plurality of laser beams is shaped into a plurality of patterned beams, so that the plurality of patterned beams is shaped with patterns corresponding to alignment marks. The plurality of patterned beams is projected onto a semiconductor wafer.Type: ApplicationFiled: March 2, 2020Publication date: April 1, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yen-Chen Liu, Cheng-Hao Yu, Cheng-Yi Huang, Chao-Li Shih, Chih-Shen Yang
-
Patent number: 10964559Abstract: A wafer etching apparatus and a method for controlling an etch bath of a wafer is provided. The wafer etching apparatus includes an etching tank comprising an etch bath, an etch bath recycle system connected to the etching tank, a real time monitor (RTM) system connected to the etching tank, and a control system coupled with the RTM system and the etch bath recycle system. The wafer etching apparatus and the method for controlling an etch bath of the wafer both control the silicate concentration in the etch bath to stable an etching selectivity with respect to silicon oxide and silicon nitride.Type: GrantFiled: June 30, 2014Date of Patent: March 30, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tai-I Yang, Chih-Shen Yang, Tien-Lu Lin
-
Publication number: 20210066108Abstract: A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.Type: ApplicationFiled: August 27, 2019Publication date: March 4, 2021Inventors: Fu-Zen Lin, Chien-Hsiang Chen, Chih-Shen Yang, Hsu-Shui Liu, Cheng-Yi Huang
-
Publication number: 20210066054Abstract: A Faraday shield, a semiconductor processing apparatus, and an etching apparatus are provided. The Faraday shield includes a plurality of conductive slices and a spacer interposed between adjacent two of the conductive slices to electrically isolate the adjacent two of conductive slices from one another. The conductive slices are separately arranged aside one another and oriented along a circumference of the Faraday shield. A coil is wound around the circumference of the Faraday shield.Type: ApplicationFiled: July 14, 2020Publication date: March 4, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chien-Hsiang Chen, Ching-Horng Chen, Yen-Ji Chen, Cheng-Yi Huang, Chih-Shen Yang
-
Publication number: 20200168484Abstract: The disclosed techniques include a space filling device to be used with a wet bench in chemical replacement procedures. The space filling device has an overall density that is higher than the chemicals used to purge the wet bench. As such, when embedded into the wet bench, or more specifically, the chemical tank of the wet bench, the space filling device will occupy a portion of the interior volume space. As a result, less purging chemicals are used to fill and bath the wet bench.Type: ApplicationFiled: June 3, 2019Publication date: May 28, 2020Inventors: Yen-Ji Chen, Chih-Shen Yang, Cheng-Yi Huang
-
Publication number: 20190145003Abstract: A gas tube, a gas supply system containing the same and a semiconductor manufacturing method using the same are provided. The gas tube includes a porous material body and a resistant sheath surrounding the porous material body. The porous material body has a hollow tube structure and an empty cavity inside the hollow tube structure. The porous material body is hydrophobic and has a plurality of pores therein. The resistant sheath is disposed on the porous material body and surrounds the porous material body. The resistant sheath includes a plurality of holes penetrating through the resistant sheath.Type: ApplicationFiled: October 28, 2018Publication date: May 16, 2019Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yi-Shiung Chen, Cheng-Yi Huang, Chih-Shen Yang, Shou-Wen Kuo, Po-Wen Chai
-
Publication number: 20150380323Abstract: A wafer etching apparatus and a method for controlling an etch bath of a wafer is provided. The wafer etching apparatus includes an etching tank comprising an etch bath, an etch bath recycle system connected to the etching tank, a real time monitor (RTM) system connected to the etching tank, and a control system coupled with the RTM system and the etch bath recycle system. The wafer etching apparatus and the method for controlling an etch bath of the wafer both control the silicate concentration in the etch bath to stable an etching selectivity with respect to silicon oxide and silicon nitride.Type: ApplicationFiled: June 30, 2014Publication date: December 31, 2015Inventors: Tai-I YANG, Chih-Shen YANG, Tien-Lu LIN
-
Patent number: 7141739Abstract: A sealing device effects a seal between a first member and a second member of a hermetic chamber. The sealing device includes a body having an elongated shape forming a closed loop. The body of the sealing device includes magnetic material and further includes a) a first and a second sealing portions, and b) at least one internal compartment formed by walls undulatingly extending between the first and second sealing portions. A sealing apparatus includes a first member of a hermetic chamber, a second member of the hermetic chamber, and the above sealing device.Type: GrantFiled: April 30, 2004Date of Patent: November 28, 2006Inventors: Yuen-Sheng Hua, Chih-Shen Yang, Min-Jhe Chiang
-
Publication number: 20050241844Abstract: A sealing device effects a seal between a first member and a second member of a hermetic chamber. The sealing device comprises body having an elongated shape forming a closed loop. The body of the sealing device comprises magnetic material and further includes a) a first and a second sealing portions, and b) at least one internal compartment formed by walls undulatingly extending between the first and second sealing portions. A sealing apparatus comprises a first member of a hermetic chamber, a second member of the hermetic chamber, and the above sealing device.Type: ApplicationFiled: April 30, 2004Publication date: November 3, 2005Inventors: Yuen-Sheng Hua, Chih-Shen Yang, Min-Jhe Chiang
-
Patent number: 6336787Abstract: A wafer transfer method using a robot arm for sucking the front-side of the uppermost one of a plurality of wafers stored in a cassette, and for transferring the wafer having a tape adhered to the front-side thereof to a semiconductor tape-peeling device for tape-peeling. Although the wafer warps, the undesired effect that the robot arm crashes any of the wafers can be avoided by using this method.Type: GrantFiled: April 17, 2000Date of Patent: January 8, 2002Assignee: Mosel Vitelic, Inc.Inventors: Chin-hsiang Chang, Yun-liang Ouyang, Chih-shen Yang, Kuei-chang Tsai