Patents by Inventor Chih-Tsung Lee
Chih-Tsung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11940727Abstract: A reticle enclosure includes a base including a first surface, a cover including a second surface and coupled to the base with the first surface facing the second surface. The base and the cover form an internal space that includes a reticle. The reticle enclosure includes restraining mechanisms arranged in the internal space and for securing the reticle, and structures disposed adjacent the reticle in the internal space. The structures enclose the reticle at least partially, and limit passage of contaminants between the internal space and an external environment of the reticle enclosure. The structures include barriers disposed on the first and second surfaces. In other examples, a padding is installed in gaps between the barriers and the first and second surfaces. In other examples, the structures include wall structures disposed on the first and second surfaces and between the restraining mechanisms.Type: GrantFiled: March 27, 2023Date of Patent: March 26, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTDInventors: Chih-Tsung Shih, Tsung-Chih Chien, Tsung Chuan Lee, Hao-Shiang Chang
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Publication number: 20240084454Abstract: A chuck vacuum line of a semiconductor processing tool includes a first portion that penetrates a sidewall of a main pumping line of the semiconductor processing tool. The chuck vacuum line includes a second portion that is substantially parallel to the sidewall of the main pumping line and to a direction of flow in the main pumping line. A size of the second portion increases between an inlet end of the second portion and an outlet end of the second portion along the direction of flow in the main pumping line.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: Yung-Tsun LIU, Kuang-Wei CHENG, Sheng-chun YANG, Chih-Tsung LEE, Chyi-Tsong NI
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Patent number: 11851761Abstract: A chuck vacuum line of a semiconductor processing tool includes a first portion that penetrates a sidewall of a main pumping line of the semiconductor processing tool. The chuck vacuum line includes a second portion that is substantially parallel to the sidewall of the main pumping line and to a direction of flow in the main pumping line. A size of the second portion increases between an inlet end of the second portion and an outlet end of the second portion along the direction of flow in the main pumping line.Type: GrantFiled: April 16, 2021Date of Patent: December 26, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yung-Tsun Liu, Kuang-Wei Cheng, Sheng-chun Yang, Chih-Tsung Lee, Chyi-Tsong Ni
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Patent number: 11825730Abstract: A display, including a carrying main body, a flexible carrier film, a double-sided tape, and an adhesive layer, is provided. The flexible carrier film includes a first bonding section and a second bonding section respectively disposed on two opposite sides of the carrying main body, and a bending section connected between the first bonding section and the second bonding section. The flexible carrier film has an inner surface and an outer surface opposite to each other. The inner surface has at least one first groove at the bending section. The flexible carrier film has a display layer thereon. At least a part of the display layer is connected to the outer surface at the second bonding section. The double-sided tape is disposed between the first bonding section and the carrying main body. The adhesive layer is disposed between the inner surface and the carrying main body at the bending section.Type: GrantFiled: July 1, 2020Date of Patent: November 21, 2023Assignee: Au Optronics CorporationInventors: Chih-Tsung Lee, Chih-Chieh Lin, Yi-Wei Tsai, Ko-Chin Chung
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Publication number: 20230299063Abstract: A spherical display device includes an arc substrate and a plurality of display units. The arc substrate has a convex surface and a concave surface opposite to the convex surface. The plurality of display units is disposed on the concave surface of the arc substrate, and a perpendicular distance from the display unit to a central axis of the arc substrate ranges between 1.345 mm and 4.3 mm.Type: ApplicationFiled: December 27, 2022Publication date: September 21, 2023Inventor: Chih-Tsung LEE
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Patent number: 11735436Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.Type: GrantFiled: August 10, 2022Date of Patent: August 22, 2023Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chih-Tsung Lee, Sheng-Chun Yang, Yun-Tzu Chiu, Chao-Hung Wan, Yi-Ming Lin, Chyi-Tsong Ni
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Publication number: 20230257875Abstract: A method of fabricating semiconductor devices includes: loading one or more semiconductor wafers into a plurality of stations provided within a process chamber; applying a process to the semiconductor wafers which deposits a material on the one or more semiconductor wafers within the process chamber; and cleaning the process chamber. Suitably, cleaning the process chamber includes flowing a cleaning gas into the process chamber toward a deflector arranged in the process chamber, the deflector having a first surface upon which the flowed cleaning gas impinges, the first surface directing a first portion of the flowed cleaning gas impinging thereon in a first trajectory toward a first end of the process chamber and directing a second portion of the flowed cleaning gas impinging thereon in a second trajectory toward a second end of the process chamber, the second end being opposite the first end.Type: ApplicationFiled: February 15, 2022Publication date: August 17, 2023Inventors: Kuang-Wei Cheng, Sung-Ju Huang, Yung-Tsun Liu, Chih-Tsung Lee, Chyi-Tsong Ni
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Publication number: 20230257882Abstract: Methods and systems for chemical vapor deposition (CVD) are disclosed. The methods and systems use a showerhead including a domed internal baffle plate. The domed internal baffle plate is perforated. The presence of the domed internal baffle plate improves the uniformity of gas distribution through the holes of the showerhead across the surface area of the showerhead. This improves deposition uniformity on the semiconducting wafer substrate upon which CVD is being performed, or improves the cleaning of the reaction chamber when a cleaning gas is pumped in through the showerhead.Type: ApplicationFiled: February 15, 2022Publication date: August 17, 2023Inventors: Yung-Tsun Liu, Kuang-Wei Cheng, Sung-Ju Huang, Chih-Tsung Lee, Chyi-Tsong Ni
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Patent number: 11685994Abstract: Pumping liners for use in an apparatus for depositing a material on a work piece by chemical vapor deposition includes a plurality of unevenly spaced apertures are disclosed. Uneven spacing of the plurality of apertures produces a uniform flow of processing gases within a processing chamber with which the pumping liner is associated. Films of materials deposited onto a work piece by chemical vapor deposition techniques using disclosed pumping liners exhibit desirable properties such as uniform thickness and smooth and uniform surfaces.Type: GrantFiled: September 13, 2019Date of Patent: June 27, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Sheng-chun Yang, Yi-Ming Lin, Chih-tsung Lee, Yun-Tzu Chiu, Chao-Hung Wan
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Publication number: 20230062038Abstract: A chamber of a semiconductor fabrication facility may include a vent port diffuser. The vent port diffuser may include a first tube member configured to couple the vent port diffuser to a vent port of the chamber. The vent port diffuser may include a second tube member coupled to the first tube member. The second tube member may comprise a plurality of openings spaced along a length of the second tube member, with the plurality of openings configured to receive a fluid from the chamber. Based on the semiconductor fabrication facility including the vent port diffuser, the chamber may be configured to provide an improved flow field of a fluid within the chamber. In this way, the vent port diffuser may reduce defects of semiconductor devices transported through the chamber that might otherwise be caused by contaminants.Type: ApplicationFiled: August 30, 2021Publication date: March 2, 2023Inventors: Yung-Tsun LIU, Chao-Hung WAN, Kuang-Wei CHENG, Chih-Tsung LEE, Chyi-Tsong NI
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Patent number: 11587474Abstract: A flexible device array substrate includes: a substrate, a metal-containing layer, and an electronic component layer. The metal-containing layer is disposed on the substrate. The metal-containing layer includes: a first layer and a second layer. The first layer is located on a side close to the substrate, and the first layer contains a first metal oxide to form a peeling interface in the first layer. The second layer is located on a side away from the substrate, and the second layer contains a second metal oxide. The oxidation number of the metal in the second metal oxide is smaller than the oxidation number of the metal in the first metal oxide. The electronic component layer is disposed above the metal-containing layer. A method of manufacturing the flexible device array substrate is also provided.Type: GrantFiled: July 2, 2020Date of Patent: February 21, 2023Assignee: Au Optronics CorporationInventors: Tsung-Ying Ke, Chih-Tsung Lee, Ting Kang
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Publication number: 20220392782Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.Type: ApplicationFiled: August 10, 2022Publication date: December 8, 2022Inventors: Chih-Tsung LEE, Sheng-chun Yang, Yun-Tzu Chiu, Chao-Hung Wan, Yi-Ming Lin, Chyi-Tsong Ni
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Publication number: 20220367297Abstract: A diaphragm position of a valve may be detected and/or determined such that operation of the diaphragm may be monitored. A sensor included in the valve may generate sensor data that may be used to monitor the position of the diaphragm, which in turn may be used to determine a flow of a fluid through the valve. In this way, the sensor may be used to determine whether the diaphragm is properly functioning, may be used to identify and detect failures of the diaphragm, and/or may be used to quickly terminate operation of an associated deposition tool. This may reduce semiconductor substrate scrap, may reduce device failures on semiconductor substrates that are processed by the deposition tool, may increase semiconductor processing quality of the deposition tool, and/or may increase semiconductor processing yields of the deposition tool.Type: ApplicationFiled: August 27, 2021Publication date: November 17, 2022Inventors: Kuang-Wei CHENG, Yung-Tsun LIU, Chih-Tsung LEE, Chyi-Tsong NI
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Publication number: 20220356574Abstract: Pumping liners for use in an apparatus for depositing a material on a work piece by chemical vapor deposition includes a plurality of unevenly spaced apertures are disclosed. Uneven spacing of the plurality of apertures produces a uniform flow of processing gases within a processing chamber with which the pumping liner is associated. Films of materials deposited onto a work piece by chemical vapor deposition techniques using disclosed pumping liners exhibit desirable properties such as uniform thickness and smooth and uniform surfaces.Type: ApplicationFiled: July 20, 2022Publication date: November 10, 2022Inventors: Sheng-chun YANG, Yi-Ming LIN, Chih-tsung LEE, Yun-Tzu CHIU, Chao-Hung WAN
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Publication number: 20220333240Abstract: A chuck vacuum line of a semiconductor processing tool includes a first portion that penetrates a sidewall of a main pumping line of the semiconductor processing tool. The chuck vacuum line includes a second portion that is substantially parallel to the sidewall of the main pumping line and to a direction of flow in the main pumping line. A size of the second portion increases between an inlet end of the second portion and an outlet end of the second portion along the direction of flow in the main pumping line.Type: ApplicationFiled: April 16, 2021Publication date: October 20, 2022Inventors: Yung-Tsun LIU, Kuang-Wei CHENG, Sheng-chun YANG, Chih-Tsung LEE, Chyi-Tsong NI
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Patent number: 11443961Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.Type: GrantFiled: August 26, 2020Date of Patent: September 13, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, ltd.Inventors: Chih-Tsung Lee, Sheng-Chun Yang, Yun-Tzu Chiu, Chao-Hung Wan, Yi-Ming Lin, Chyi-Tsong Ni
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Patent number: 11358252Abstract: A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.Type: GrantFiled: July 18, 2019Date of Patent: June 14, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shih-Chi Lin, Kun-Tai Wu, You-Hua Chou, Chih-Tsung Lee, Min Hao Hong, Chih-Jen Wu, Chen-Ming Huang, Soon-Kang Huang, Chin-Hsiang Chang, Chih-Yuan Yang
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Patent number: 11177457Abstract: A display apparatus includes a substrate, an element layer, a protective film, a mechanical member, a first adhesive layer and a second adhesive layer. An opening of the protective film is located between a first portion of the protective film and a second portion of the protective film. The first portion of the protective film, the second portion of the protective film and the opening of the protective film are respectively overlapped with a first portion of the substrate, a second portion of the substrate and a third portion of the substrate. The first adhesive layer and the second adhesive layer are respectively disposed on a first surface and a second surface of the mechanical member. The third portion of the substrate is connected between the first portion of the substrate and the second portion of the substrate, and the third portion of the substrate is bent.Type: GrantFiled: October 4, 2019Date of Patent: November 16, 2021Assignee: Au Optronics CorporationInventors: Chih-Tsung Lee, Zih-Shuo Huang, Yi-Wei Tsai, Ko-Chin Chung, Ming-Chang Hsu, Heng-Chia Hsu
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Patent number: 11119539Abstract: A display, including a supporting layer and a flexible display panel, is provided. The supporting layer has at least two extending sections and at least one bending section, connected therebetween and adapted to be bent along an axis as a rotation axis. The supporting layer has at least one groove at the bending section and at least one indentation at a bottom surface of the groove. An extending direction of the groove is parallel to the axis. An extending direction of the indentation is not parallel to the axis. The supporting layer has a first thickness at each extending section, a second thickness at the groove, and a third thickness at the indentation. The first, second, and third thicknesses are different from one another. The flexible display is disposed on the supporting layer. The groove and the flexible display are respectively located on two opposite sides of the supporting layer.Type: GrantFiled: July 9, 2020Date of Patent: September 14, 2021Assignee: Au Optronics CorporationInventors: Chih-Tsung Lee, Zih-Shuo Huang, Kun-Lung Hsieh, Kai-Yu Yu
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Publication number: 20210079524Abstract: Pumping liners for use in an apparatus for depositing a material on a work piece by chemical vapor deposition includes a plurality of unevenly spaced apertures are disclosed. Uneven spacing of the plurality of apertures produces a uniform flow of processing gases within a processing chamber with which the pumping liner is associated. Films of materials deposited onto a work piece by chemical vapor deposition techniques using disclosed pumping liners exhibit desirable properties such as uniform thickness and smooth and uniform surfaces.Type: ApplicationFiled: September 13, 2019Publication date: March 18, 2021Inventors: Sheng-chun YANG, Yi-Ming LIN, Chih-tsung LEE, Yun-Tzu CHIU, Chao-Hung WAN