Abstract: A pre-cleaning technique described herein may be used to remove native oxides and/or other contaminants from a semiconductor device in a manner in which the likelihood of chopping, clipping, and/or sidewall spacer thickness reduction is reduced. As described herein, a protection layer is formed on a capping layer over a gate structure of a transistor. A pre-cleaning operation is then performed to remove native oxides from the top surface of a source/drain region of the transistor. In the pre-cleaning operation, the protection layer is consumed instead of the material of the capping layer. In this way, the use of the protection layer reduces the likelihood of removal of material from the capping layer and/or reduces the amount of material that is removed from the capping layer during the pre-cleaning operation.

Abstract: An optical system is provided. The optical system includes a light source module and an adjustment assembly. The light source module emits a light source. The light source includes a first light and a second light. The adjustment assembly corresponds to the first light and the second light. The wavelength of the first light and the wavelength of the second light are different.

Abstract: A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

Abstract: An optical element driving mechanism includes a movable portion, a fixed portion and a driving assembly. The movable portion is configured to connect an optical element having an optical axis. The fixed portion includes a base with a plate structure, wherein the movable portion is movable relative to the fixed portion. The driving assembly is configured to drive the movable portion to move relative to the base. A thickness direction of the base is perpendicular to the optical axis, the base has a recessed structure, and when viewed from the thickness direction of the base, the recessed structure is overlapped with the optical axis.

Abstract: A driving mechanism for moving an optical unit is provided, including a variable aperture module and a Voice Coil Motor module. The variable aperture module has a bottom plate connected to a lens holder of the Voice Coil Motor module. Specifically, the variable aperture module and the Voice Coil Motor are received in the same housing, so as to enhance the structural strength of the driving mechanism.

Abstract: An optical element driving mechanism for corresponding to an optical module, the optical element driving mechanism including a fixed portion, a movable portion, and a first driving assembly. The fixed portion has an aperture. The movable portion is for connecting to an optical element and is movable relative to the fixed portion. The first driving assembly is for driving the movable portion to move relative to the fixed portion. The fixed portion has an elongated structure, and the fixed portion further comprises a first end. The fixed portion further comprising a second end, wherein the first end and the second end are arranged along a first direction. A shortest distance between the optical sensing element and the first end is shorter than a shortest distance between the optical sensing element and the second end.

Abstract: An optical mechanism is provided, including a housing, a holder, a lens received in the holder, a driving assembly, and a base connected to the housing. The holder is movably disposed in the housing, and the lens has a first surface exposed to a first side of the holder and facing a first inner sidewall surface of the housing. The driving assembly is disposed in the housing for driving the holder and the lens to move relative to the housing.

Abstract: A lens driving module includes a base, a frame fixedly connected to the base, and a holder configured to connect an optical lens. The holder is movable relative to the base. The lens driving module also includes a reflecting element configured to reflect light from a light incident direction to a first direction. The first direction is perpendicular to the light incident direction, and the first direction is parallel to an optical axis of the optical lens. The lens driving module further includes a first electromagnetic driving assembly configured to force the holder to move along the first direction relative to the base. The lens driving module has multiple recesses formed on the base and arranged along the first direction. The lens driving module includes multiple the rolling elements disposed on the recesses, and the holder is moved relative to the base via the rolling elements.

Abstract: A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

Abstract: A semiconductor package includes a first substrate and a first semiconductor device. The first semiconductor device is bonded to the first substrate and includes a second substrate, a plurality of first dies and a second die. The first dies are disposed between the first substrate and the second substrate. The second die is surrounded by the first dies. A cavity is formed among the first dies, the first substrate and the second substrate, and a gap is formed between the second die and the first substrate.

Abstract: An optical element driving mechanism is provided and includes a first movable part, a fixed assembly and a first driving assembly. The first movable part is configured to connect a first optical element. The fixed assembly has a first opening for a light beam to pass through, and the first movable part is movable relative to the fixed assembly. The first driving assembly is configured to drive the first movable part to move relative to the fixed assembly. When the first movable part is located in a first position relative to the fixed assembly, the first optical element overlaps the first opening.

Abstract: In some embodiments, a method for generating a random bit is provided. The method includes generating a first random bit by providing a random number generator (RNG) signal to a magnetoresistive random-access memory (MRAM) cell. The RNG signal has a probability of about 0.5 to switch the resistive state of the MRAM cell from a first resistive state corresponding to a first data state to a second resistive state corresponding to a second data sate. The first random bit is then read from the MRAM cell.

Abstract: A driving mechanism for an optical element is provided, including a fixed portion, a movable portion, a first driving assembly, and a positioning assembly. The movable portion is movably disposed on the fixed portion, and includes an optical element. The first driving assembly is at least partially disposed on the fixed portion, and drives the optical element to move in a first direction. The positioning assembly is disposed on the fixed portion or the movable portion, wherein the positioning assembly limits the movable part to a first terminal position or a second terminal position relative to the fixed portion.

Abstract: An optical system configured to perform scans is provided. The optical system includes a carrier portion and an emitting portion. The carrier portion is configured to connect an optical member. The emitting portion is configured to emit a light, wherein the light is emitted toward a sensing object via the optical member.

Abstract: A driving mechanism is provided, including a fixed portion, a movable portion, a driving assembly and a connecting element. The movable portion may move relative to the fixed portion and is used for holding an optical module. The driving assembly moves the movable portion relative to the fixed portion. The connecting element is movably connected to the fixed portion and the movable portion.

Abstract: An optical system is provided. The optical system includes a holder and a first compensation assembly. The holder is connected to an optical module. The first compensation assembly compensates a light. The first compensation assembly includes a first optical element. The light enters the optical module through the first compensation assembly.

Abstract: An optical system is provided and includes a light-sensing element, a reflecting unit and a first driving assembly. The reflecting unit includes a reflecting surface, configured to receive an incident light and to reflect a reflecting light. The reflecting light travels into the light-sensing element. The first driving assembly is configured to control the reflecting unit to move along a first axis direction from a first position to a second position, so as to adjust a focus position of the reflecting light on the light-sensing element, wherein the reflecting surface in the first position is parallel to the reflecting surface in the second position, and a distance between a center of the reflecting unit in the first position and the center of the reflecting unit in the second position is not zero.

Abstract: An optical system includes a fixed module, a movable module and a driving assembly. The movable module moves relative to the fixed module, and the movable module includes a lens unit which includes a first lens, a second lens, a first side wall and a second side wall. The first side wall has a first surface, which directly contacts the second lens, and the second side wall directly contacts the first lens. A portion of the driving assembly is directly disposed on the lens unit, configured to drive the lens unit to move along an optical axis of the first lens. The first side wall further has a second surface opposite to the first surface, and the second surface directly contacts the portion of the driving assembly. The thickness of the first side wall is different from the thickness of the second side wall.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed part, a movable part, a driving assembly, and a positioning assembly. The movable part is movably disposed on the fixed part. The movable part is connected to an optical element. At least a portion of the driving assembly is disposed on the fixed part. The positioning assembly is disposed on the fixed part or the movable part to limit the movable part at an extreme position relative to the fixed part.

Abstract: The present disclosure provides an optical system, including a first optical mechanism. The first optical mechanism includes a first movable part, a fixed assembly, a first driving assembly and a guiding assembly. The first movable part includes an optical element. The first movable part is movable relative to the fixed assembly. The first driving assembly is configured to drive the first movable part to move relative to the fixed assembly. The guiding assembly is configured to guide the first movable part to move relative to the fixed assembly. A friction force is generated between the first movable part and the guiding assembly, and the first movable part is temporarily positioned on the fixed assembly through the friction force.