Abstract: A heat dissipation control method applicable to a portable electronic device is provided. The portable electronic device is adapted to mount a heat dissipation back clip, and the heat dissipation back clip includes a cooling chip and a heat dissipation fan. The cooling chip has an adjustable cooling power consumption, and the heat dissipation fan has a heat removal wattage. The heat dissipation control method includes: detecting a real-time system power consumption of the portable electronic device; obtaining the cooling power consumption and the heat removal wattage; determining whether a sum of the real-time system power consumption and the cooling power consumption is greater than the heat removal wattage; and lowering the cooling power consumption if the sum is greater than the heat removal wattage. An electronic device and a portable electronic device to which the heat dissipation control method is applicable are further provided.

Abstract: A handheld electronic device is provided. The handheld electronic device includes a screen, a back cover, a frame, a main board, and a heat conduction structure. The frame is arranged between the screen and the back cover. The frame and the back cover define a space. The main board is arranged in the space, and includes a front surface and a back surface. The front surface faces the screen and includes a heat source. The heat conduction structure extends from the front surface to the back surface, and includes a first end and a second end opposite to each other. The first end is arranged at the heat source, and the second end extends to the back cover.

Abstract: A power management method for an electronic device is provided. The electronic device includes a processing unit with a core and configured to execute an application program and a functional element. The power management method includes the following steps: determining a maximum frame count per second of a scene; down-tuning a frequency setting value of the core; detecting an actual frame count per second of the scene; determining a change in power consumption of the processing unit and a temperature of the functional element when the actual frame count per second is equal to the maximum frame count per second; and down-tuning the frequency setting value when the power consumption does not increase and the temperature is lower than a preset temperature value, and restoring the frequency setting value when the power consumption increases or the temperature is higher than or equal to the preset temperature value.

Abstract: A fan blade and a fabricating method thereof are provided. The fan blade includes a rough coating layer on a surface thereof. The rough coating layer includes a plurality of recessed regions. A maximum depth of recess of the recessed regions is between 50 ?m to 130 ?m.

Abstract: An electronic device includes a casing, a fan base, a fan side wall and an impeller. The casing has a fan top wall. The fan top wall has an airflow inlet. The fan base is provided in the casing. The fan side wall extends from the casing or the fan base. The fan top wall, the fan base and the fan side wall define a fan space communicated with the airflow inlet and a first airflow outlet communicated with the fan space. The impeller is mounted at the fan base and is located in the fan space.

Abstract: A fan blade and a fabricating method thereof are provided. The fan blade includes a rough coating layer on a surface thereof. The rough coating layer includes a plurality of recessed regions. A maximum depth of recess of the recessed regions is between 50 ?m to 130 ?m.

Abstract: An electronic device includes a casing, a motherboard, a battery, a fan, and a heat dissipation module. The motherboard is arranged in the casing, and defines a first space with the casing. The battery is arranged in the casing and defines a second space with the motherboard. The motherboard separates the first space and the second space. The fan is arranged in the casing and has a first airflow outlet and a second airflow outlet independent of the first airflow outlet. The first airflow outlet communicates with the first space and the second space. The heat dissipation module is arranged in the casing and transfers heat from the motherboard to the second airflow outlet.

Abstract: A head-mounted display device includes a casing, a control circuit board and a fan. The casing has a heat dissipation hole, and a face side and an external side opposite each other. The control circuit board is disposed in the casing. The fan is disposed in the casing and located between the control circuit board and the face side of the casing, and is configured to generate an air flow flowing from the face side toward the heat dissipation hole.

Abstract: A head-mounted display device includes a casing, a control circuit board and a fan. The casing has a heat dissipation hole, and a face side and an external side opposite each other. The control circuit board is disposed in the casing. The fan is disposed in the casing and located between the control circuit board and the face side of the casing, and is configured to generate an air flow flowing from the face side toward the heat dissipation hole.

Abstract: An electronic device includes a casing, a fan base, a fan side wall and an impeller. The casing has a fan top wall. The fan top wall has an airflow inlet. The fan base is provided in the casing. The fan side wall extends from the casing or the fan base. The fan top wall, the fan base and the fan side wall define a fan space communicated with the airflow inlet and a first airflow outlet communicated with the fan space. The impeller is mounted at the fan base and is located in the fan space.

Abstract: An electronic device includes a casing, a motherboard, a battery, a fan, and a heat dissipation module. The motherboard is arranged in the casing, and defines a first space with the casing. The battery is arranged in the casing and defines a second space with the motherboard. The motherboard separates the first space and the second space. The fan is arranged in the casing and has a first airflow outlet and a second airflow outlet independent of the first airflow outlet. The first airflow outlet communicates with the first space and the second space. The heat dissipation module is arranged in the casing and transfers heat from the motherboard to the second airflow outlet.

Abstract: A heat dissipation module and an electronic device are provided. The heat dissipation module includes a first heat transfer member, a second heat transfer member, and a cooling element. The first heat transfer member has a first end and a second end opposite to the first end. The second heat transfer member has a third end and a fourth end opposite to the third end. The cooling element disposed between the second end and the third end is configured to allow or block the heat transferring between the second end and the third end.

Abstract: A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.

Abstract: A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.

Abstract: A heat transferring module includes a first conductor plate, a second conductor plate, a working fluid and a reinforcing layer. The second conductor plate is connected to the first conductor plate to form a cavity. The working fluid is located in the cavity. The reinforcing layer is formed on an outer surface of at least one of the first conductor plate and the second conductor plate, wherein at least one of the first conductor plate and the second conductor plate has a capillary structure. The capillary structure is located on an inner surface of at least one of the first conductor plate and the second conductor plate, and a structural strength of the reinforcing layer is greater than a structural strength of the first conductor plate and a structural strength of the second conductor plate. In addition, a manufacturing method of a heat transferring module is also provided.

Abstract: A recording device includes a camera component, a temperature sensor, and a processing component. The camera component is configured to capture a video to generate video data. The temperature sensor is configured to detect an operating temperature of the recording device. The processing component is configured to process the video data, and to enable the camera component to dynamically adjust at least one of a data rate of the video data and a frame rate of the video data according to the operating temperature during the camera component captures the video.

Abstract: A recording device includes a camera component, a temperature sensor, and a processing component. The camera component is configured to capture a video to generate video data. The temperature sensor is configured to detect an operating temperature of the recording device. The processing component is configured to process the video data, and to enable the camera component to dynamically adjust at least one of a data rate of the video data and a frame rate of the video data according to the operating temperature during the camera component captures the video.