Patents by Inventor Chin-Cheng Kuo

Chin-Cheng Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10854533
    Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: December 1, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chung Hao Chen, Chin-Cheng Kuo
  • Publication number: 20200350395
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The magnetic element has a first edge. The semiconductor device structure also includes an adhesive element between the magnetic element and the semiconductor substrate, and the adhesive element has a second edge. The semiconductor device structure further includes an isolation element extending across the magnetic element. The isolation element partially covers a top surface of the magnetic element and partially covers sidewall surfaces of the magnetic element. The isolation element has a third edge, and the second edge is closer to the third edge than the first edge. In addition, the semiconductor device structure includes a conductive line over the isolation element.
    Type: Application
    Filed: July 20, 2020
    Publication date: November 5, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Cheng CHEN, Wei-Li HUANG, Chien-Chih KUO, Hon-Lin HUANG, Chin-Yu KU, Chen-Shien CHEN
  • Patent number: 10795200
    Abstract: A display device includes a display panel, a light shielding unit and a back plate. The display panel includes a first substrate, a second substrate and an upper polarizer. The first substrate is disposed corresponding to the second substrate. The upper polarizer is disposed on the second substrate. The light shielding unit is connected to the upper polarizer. The first substrate is disposed on the back plate.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: October 6, 2020
    Assignee: INNOLUX CORPORATION
    Inventors: Chien-Chih Chen, Chia-Chun Yang, Chin-Cheng Kuo, Hsin-Tien Wu, Chih-Jen Chang
  • Patent number: 10785893
    Abstract: A heat dissipation module and an electronic device are provided. The heat dissipation module includes a first heat transfer member, a second heat transfer member, and a cooling element. The first heat transfer member has a first end and a second end opposite to the first end. The second heat transfer member has a third end and a fourth end opposite to the third end. The cooling element disposed between the second end and the third end is configured to allow or block the heat transferring between the second end and the third end.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: September 22, 2020
    Assignee: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu
  • Patent number: 10756162
    Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming an adhesive layer over a semiconductor substrate and forming a magnetic element over the adhesive layer. The method also includes forming an isolation element extending across the magnetic element. The isolation element partially covers the top surface of the magnetic element and partially covers sidewall surfaces of the magnetic element. The method further includes partially removing the adhesive layer such that an edge of the adhesive layer is laterally disposed between an edge of the magnetic element and an edge of the isolation element. In addition, the method includes forming a conductive line over the isolation element.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: August 25, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Cheng Chen, Wei-Li Huang, Chien-Chih Kuo, Hon-Lin Huang, Chin-Yu Ku, Chen-Shien Chen
  • Publication number: 20200266372
    Abstract: A quantum dot light-emitting diode includes a substrate, an anode electrode layer, a cathode electrode layer, a light-emitting layer, and an electron blocking layer. The anode electrode layer is disposed on the substrate. The cathode electrode layer is disposed on the anode electrode layer. The light-emitting layer is disposed between the cathode electrode layer and the anode electrode layer. The light-emitting layer includes a plurality of first particles. The electron blocking layer is disposed between the light-emitting layer and the anode electrode layer. The electron blocking layer includes a plurality of second particles. The first particles and the second particles are quantum dots. A size of the second particles is smaller than a size of the first particles.
    Type: Application
    Filed: January 15, 2020
    Publication date: August 20, 2020
    Inventors: Ming-Cheng KUO, Yao-Shan CHANG, Po-Liang CHEN, Chin-Cheng TSAI, Yi-Ju HSIAO, Ya-Pei KUO
  • Publication number: 20200233138
    Abstract: A display device is provided. The display device includes a display panel that has a polarizer, a light source assembly, a first spacer, and a second spacer. The first spacer is disposed on the first side of the display panel near the light source assembly. The first spacer is located between the display panel and the light source assembly. The second spacer is disposed on the second side of the display panel, away from the light source assembly. The thickness of the first spacer is different than that of the second spacer.
    Type: Application
    Filed: January 8, 2020
    Publication date: July 23, 2020
    Inventors: Chien-Chih CHEN, Chia-Chun YANG, Chin-Cheng KUO
  • Publication number: 20200201121
    Abstract: An electronic device is provided, including a frame, a working panel and a cover plate. The frame includes a sidewall, and the sidewall includes an outer surface. At least a part of the working panel is disposed in the frame. The cover plate is disposed on the working panel and includes a surface, wherein a surface of the cover plate and an outer surface of the sidewall of the frame are fixed by using an adhesive, and the extension direction of the surface of the cover plate is different than the extension direction of the outer surface of the sidewall of the frame.
    Type: Application
    Filed: December 2, 2019
    Publication date: June 25, 2020
    Inventors: Wen-Cheng HUANG, Ting-Sheng CHEN, Chia-Chun YANG, Chin-Cheng KUO
  • Publication number: 20200175219
    Abstract: A method is disclosed herein. The method includes: adjusting first parameters associated with parameterized cells in a netlist of an integrated circuit (IC) to generate second parameters associated with the parameterized cells in the netlist of the IC; updating the netlist of the IC according to the second parameters; and performing a simulation according to the netlist.
    Type: Application
    Filed: November 22, 2019
    Publication date: June 4, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsun-Yu YANG, Ren-Hong FU, Chin-Cheng KUO, Jui-Feng KUAN
  • Publication number: 20200170143
    Abstract: A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.
    Type: Application
    Filed: May 22, 2019
    Publication date: May 28, 2020
    Applicant: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu
  • Patent number: 10667428
    Abstract: A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: May 26, 2020
    Assignee: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu
  • Publication number: 20200116436
    Abstract: A heat transferring module includes a first conductor plate, a second conductor plate, a working fluid and a reinforcing layer. The second conductor plate is connected to the first conductor plate to form a cavity. The working fluid is located in the cavity. The reinforcing layer is formed on an outer surface of at least one of the first conductor plate and the second conductor plate, wherein at least one of the first conductor plate and the second conductor plate has a capillary structure. The capillary structure is located on an inner surface of at least one of the first conductor plate and the second conductor plate, and a structural strength of the reinforcing layer is greater than a structural strength of the first conductor plate and a structural strength of the second conductor plate. In addition, a manufacturing method of a heat transferring module is also provided.
    Type: Application
    Filed: May 30, 2019
    Publication date: April 16, 2020
    Applicant: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu, Tien-Tso Liu, Shuo-Hsiu Chang
  • Publication number: 20200075708
    Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming an adhesive layer over a semiconductor substrate and forming a magnetic element over the adhesive layer. The method also includes forming an isolation element extending across the magnetic element. The isolation element partially covers the top surface of the magnetic element and partially covers sidewall surfaces of the magnetic element. The method further includes partially removing the adhesive layer such that an edge of the adhesive layer is laterally disposed between an edge of the magnetic element and an edge of the isolation element. In addition, the method includes forming a conductive line over the isolation element.
    Type: Application
    Filed: January 29, 2019
    Publication date: March 5, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Cheng CHEN, Wei-Li HUANG, Chien-Chih KUO, Hon-Lin HUANG, Chin-Yu KU, Chen-Shien CHEN
  • Publication number: 20200060024
    Abstract: A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region, The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.
    Type: Application
    Filed: October 24, 2019
    Publication date: February 20, 2020
    Inventors: Chin-Cheng Kuo, Chia-Chun Yang, Wen-Cheng Huang
  • Patent number: 10531563
    Abstract: A display device and a manufacturing method thereof are provided. The display device includes a first substrate, a second substrate, a drive IC and a protection layer. The first substrate has a first region and a second region. The second substrate is correspondingly disposed on the first region. The drive IC is disposed on the second region. The protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than the height of the drive IC.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: January 7, 2020
    Assignee: INNOLUX CORPORATION
    Inventors: Chin-Cheng Kuo, Chia-Chun Yang, Wen-Cheng Huang
  • Patent number: 10488690
    Abstract: A display device includes a display panel, a first frame, a second frame and an adhesive element. The first frame is disposed corresponding to the display panel and includes a bottom portion and a side wall. The bottom portion is connected to the side wall. The second frame is disposed on the first frame. The display panel is disposed on a part of the second frame. The adhesive element is disposed between the first frame and the second frame. The adhesive element contacts at least a part of the bottom portion and at least a part of the side wall. An assembling method of the display device is also provided.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: November 26, 2019
    Assignee: INNOLUX CORPORATION
    Inventors: Chih-Chiao Yang, Chia-Chun Yang, Chin-Cheng Kuo, Tong-Jung Wang
  • Publication number: 20190295926
    Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.
    Type: Application
    Filed: February 15, 2019
    Publication date: September 26, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chung Hao CHEN, Chin-Cheng KUO
  • Patent number: 10347678
    Abstract: An image sensor is provided. The image sensor includes a microlens array having a plurality of microlenses; and a sensor array having a plurality of photoelectric elements that are arranged into a plurality of macro pixels. Each macro pixel includes a first photoelectric element, a second photoelectric element, a third photoelectric element, and a fourth photoelectric element that receive incident light via a first microlens, a second microlens, a third microlens, and a fourth lens in the plurality of microlenses. The first microlens, the second microlens, the third microlens, and the fourth microlens in each macro pixel have a first initial offset, a second initial offset, a third initial offset, and a fourth initial offset, respectively. The first microlens and the second microlens in each of the plurality of macro pixels further have a first additional offset and a second additional offset, respectively.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: July 9, 2019
    Assignee: Visera Technologies Company Limited
    Inventors: Wu-Cheng Kuo, Kuo-Feng Lin, Tsung-Lin Wu, Chin-Chuan Hsieh
  • Patent number: 10324251
    Abstract: A display module is provided. The display module includes a backlight module with an upper surface, a display panel opposite to the backlight module, and a glue having a first contact surface and a second contact surface located between the display panel and the backlight module, wherein the first contact surface is in contact with the display panel, the second contact surface is in contact with the upper surface of the backlight module, and there is a gap between the display panel and the backlight module. A method for fabricating a display module is also provided.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: June 18, 2019
    Assignee: INNOLUX CORPORATION
    Inventors: Li-Ling Chen, Chien-Chih Chen, Chia-Chun Yang, Chin-Cheng Kuo
  • Patent number: 10317617
    Abstract: A display device and a method for preparing the same are disclosed. The display device includes a display panel and a backlight module. The backlight module is located below the display panel and includes a back plate, a first adhesive layer, a light emitting module and a reflector. The first adhesive layer is disposed on the back plate and the first adhesive layer includes a first area and a second area. The first area is adjacent to the second area. The light emitting module includes a light emitting unit and a print circuit board. The light emitting unit and the print circuit board are electrically connected, and the print circuit board is disposed in the first area of the first adhesive layer. A part of the reflector is disposed in the second area of the first adhesive layer.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: June 11, 2019
    Assignee: INNOLUX CORPORATION
    Inventors: Chih-Chiao Yang, Chia-Chun Yang, Chin-Cheng Kuo, Jia-Sin Li