Patents by Inventor Chin Chiou Hsia

Chin Chiou Hsia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid copper/low k dielectric interconnect integration method and device
    Publication number: 20040251549
    Abstract: A multiple layer metal interconnect process provides for both good electrical properties and good mechanical properties by using a first extremely low k dielectric material at the lower level metal layers, a second extremely low k dielectric material at the middle level metal layers, and a low k dielectric material at the upper level metal layers.
    Type: Application
    Filed: June 24, 2003
    Publication date: December 16, 2004
    Inventors: Tai-Chun Huang, Chih-Hsiang Yao, Kang-Cheng Lin, Chin Chiou Hsia, Mong Song Liang