Patents by Inventor Chin-Chung Tu

Chin-Chung Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanism and process for compressing chips
    Patent number: 7219824
    Abstract: A chip compressing mechanism is provided. The chip compressing mechanism essentially comprises a loading component, a head component and a gimbal. The head component is disposed under the loading component, with a gap in-between. The gimbal is disposed between the loading component and the head component to support the gap therebetween.
    Type: Grant
    Filed: September 15, 2004
    Date of Patent: May 22, 2007
    Assignee: Chunghwa Picture Tubes, Ltd.
    Inventors: Chin-Chung Tu, Zheng-Jie Huang
  • MECHANISM AND PROCESS FOR COMPRESSING CHIPS
    Publication number: 20070085223
    Abstract: A chip compressing mechanism is provided. The chip compressing mechanism essentially comprises a loading component, a head component, a gimbal and a plurality of fixing pieces. The head component is disposed under the loading component, with a gap in-between. The gimbal is disposed between the loading component and the head component to support the gap therebetween. The fixing pieces run through the loading component and nail down the head component, wherein the fixing pieces can slide correlatively to the loading component.
    Type: Application
    Filed: November 24, 2006
    Publication date: April 19, 2007
    Applicant: CHUNGHWA PICTURE TUBES, LTD.
    Inventors: Chin-Chung Tu, Zheng-Jie Huang
  • Flat panel display device and method of correcting bonding misalignment of driver IC and flat panel display
    Publication number: 20070052344
    Abstract: A method of correcting bonding misalignment between flat display panel and driver IC is provided. First, the contact pads of the bonding flat display panel and the bumps of the driver IC are bonded, wherein the flat display panel further includes a plurality of alignment marks around each contact pad. A bonding misalignment variation between the flat display panel and the driver IC may be identified by matching the position of the alignment mark and the position of the corresponding bump. Thereafter, a correction may be performed according to the bonding misalignment variation.
    Type: Application
    Filed: September 7, 2005
    Publication date: March 8, 2007
    Inventors: Yu-Liang Wen, Chin-Chung Tu, Zheng-Jie Huang, Huang-Chang Wang
  • MECHANISM AND PROCESS FOR COMPRESSING CHIPS
    Publication number: 20060027916
    Abstract: A chip compressing mechanism is provided. The chip compressing mechanism essentially comprises a loading component, a head component and a gimbal. The head component is disposed under the loading component, with a gap in-between. The gimbal is disposed between the loading component and the head component to support the gap therebetween.
    Type: Application
    Filed: September 15, 2004
    Publication date: February 9, 2006
    Inventors: Chin-Chung Tu, Zheng-Jie Huang