Abstract: An electronic device is provided. The electronic device includes a base and a conductive layer that is disposed on the base and patterned by a plurality of processes. The plurality of processes include providing a mask substrate. The mask substrate includes a first substrate and a patterned substrate. In the cross-sectional view, the width of the first substrate is greater than or equal to the width of the patterned substrate. The plurality of processes include arranging the mask substrate and the base correspondingly. The plurality of processes also include performing exposure and development processes on the conductive layer for patterning the conductive layer, and removing the mask substrate.

Abstract: The present disclosure provides a routing structure. The routing structure includes a substrate having a boundary and a first conductive trace configured to be coupled to a first conductive pad disposed within the boundary of the substrate. The first conductive trace is inclined with respect to the boundary of the substrate.

Abstract: A frame with an outer silicon layer and a manufacturing method of forming the silicone layer on the outer part of frame are disclosed. The manufacturing method includes a forming step, a combining step and a removing step. First, a pair of mold with a forming space is formed with a silicone carrier including an effective combination region and an ineffective region. An emplacing space is next formed in the effective combination region and a frame is put into the emplacing space. Before putting in the frame, either the outer part of frame or the emplacing space is coated with a silicone coating, and then the effective combination region is combined on the outer part of frame by a secondary sulfurization. Finally, the effective combination region is removed from the ineffective region to form a silicone layer, made of the effective combination region, on the outer part of frame.

Abstract: An injection molding method for a semifinished product includes a semifinished product emplacement step, a semifinished product pre-compression step and a forming step. First, a pair of mold with a forming space is provided. A semifinished product is put into the mold, and a first joint is performed to the mold by a press-fit jig, fixing the semifinished product in the forming space. The semifinished product is also tightly fitted with the mold. Next, a first open-die is performed and the press-fit jig is removed. After that, a second joint is performed, and a forming material is injected into the forming space. Finally, a second open-die is performed, and then a finished product is formed. By the semifinished product pre-compression step, the forming material can be prevented from resulting in spill or burr on the semifinished product, thereby improving the yield of injection molding.

Abstract: An inner module with a retainer is installed primarily inside a wireless earphone, including a circuit loop, an insulation seat to fix the circuit loop, and at least a retainer. The circuit loop includes at least a first circuit board, and at least a second circuit board which is extended from the first circuit board. The insulation seat includes at least a base plate to enclose the first circuit board, and a first side wall which is extended from the base plate. The first side wall is provided with a first positioning slot to accommodate the second circuit board. The retainer is fixed on the first side wall to fix the second circuit board in the first positioning slot. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone.

Abstract: A spring leaf and a manufacturing method of making the spring leaf are disclosed. The spring leaf is installed in a casing to replace a butting part on the casing. The spring leaf includes at least a pole, at least an elastic connector, at least an elastic arm, a contact part which contacts the butting part, and a connecting part which is formed between the elastic arm and the contact part by injection molding. The contact part rotates between a positioning location and an escaping location in the casing through an elastic resetting function which is generated by the elastic arm, so as to quickly replace the butting part on the casing.

Abstract: A frame with an outer silicon layer and a manufacturing method of forming the silicone layer on the outer part of frame are disclosed. The manufacturing method includes a forming step, a combining step and a removing step. First, a pair of mold with a forming space is formed with a silicone carrier including an effective combination region and an ineffective region. An emplacing space is next formed in the effective combination region and a frame is put into the emplacing space. Before putting in the frame, either the outer part of frame or the emplacing space is coated with a silicone coating, and then the effective combination region is combined on the outer part of frame by a secondary sulfurization. Finally, the effective combination region is removed from the ineffective region to form a silicone layer, made of the effective combination region, on the outer part of frame.

Abstract: An injection molding method for a semifinished product includes a semifinished product emplacement step, a semifinished product pre-compression step and a forming step. First, a pair of mold with a forming space is provided. A semifinished product is put into the mold, and a first joint is performed to the mold by a press-fit jig, fixing the semifinished product in the forming space. The semifinished product is also tightly fitted with the mold. Next, a first open-die is performed and the press-fit jig is removed. After that, a second joint is performed, and a forming material is injected into the forming space. Finally, a second open-die is performed, and then a finished product is formed. By the semifinished product pre-compression step, the forming material can be prevented from resulting in spill or burr on the semifinished product, thereby improving the yield of injection molding.

Abstract: A combinatorial inner module is installed primarily inside a wireless earphone, including a circuit loop, a lower cover and an upper cover. The circuit loop is provided with a first circuit board and a second circuit board which is extended from the first circuit board. The upper cover is disposed above the lower cover to fix the first circuit board between the upper cover and the lower cover. Moreover, the upper cover includes a first side wall which is formed with an angle with respect to the lower cover and is used to install the second circuit board, forming an included angle between the second circuit board and the first circuit board. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone, which reduces the labor cost in assembling the wireless earphone significantly.

Abstract: An inner module used in a wireless earphone is installed primarily in a wireless earphone, including a circuit loop and an upper cover. The circuit loop includes at least a first circuit board, at least a second circuit board which is extended from the first circuit board, and a lower cover which encloses the first circuit board. The upper cover is installed on the lower cover, including a first side wall which forms an angle with respect to the lower cover. In addition, the first side wall is provided with a first positioning slot to accommodate the second circuit board. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone, which reduces the labor cost in assembling the wireless earphone significantly.

Abstract: A cable-holding device with sealing assembly includes a body having a main unit, a first connecting portion and a second connecting portion, a sealing assembly on the body, and an adjustment element on the second connecting portion. The body has a connecting hole, and the second connecting portion is extended with plural clamping arms. The sealing assembly includes a first sealing portion outside the first connecting portion, a second sealing portion inside the clamping arms to form a tightening port, and a connecting portion between the first sealing portion and the second sealing portion. On the second connecting portion, the adjustment element includes a first movement state which forms a tightening state on the tightening port, and a second movement state which changes the tightening port from the tightening state into a non-tightening state gradually.

Abstract: An inner module assembly formed by a metal tape is installed primarily inside a wireless earphone. The inner module assembly includes a circuit loop having a first circuit board and a second circuit board, with the circuit loop being formed with plural junctions; a first metal tape which fixes the second circuit board and includes a first extension section extending to the outside of the second circuit board and having a first cut-off face; and an insulation seat which is formed on the first circuit board to enclose the circuit loop and the first metal tape, with part of the junctions and the first cut-off face being exposed on a surface of the insulation seat. Therefore, the inner module assembly is formed into a modularized design to simplify the assembly procedure of the wireless earphone.

Abstract: A lens structure formed by materials in different refractive indexes includes a sphere which is a round ball formed by a first portion and a second portion, a first lens which is formed on the first portion, a separation layer which is disposed between the sphere and the first lens, a second lens which is formed on the second portion, and a third lens which is formed on the second lens and opposite to the sphere. The first lens, the second lens and the third lens are formed respectively by a material in different refractive index and are provided respectively with a light absorption curve in different curvature, so that a light beam can pass through these light absorption curves to form plural times of light condensing effect.

Abstract: A lens structure formed by materials in different refractive indexes includes a transparent sphere in a first refractive index as well as a transparent second lens in a second refractive index. The first refractive index is different from the second refractive index, and the sphere is a round ball formed by a first portion and a second portion which are equipped with a first light condensing effect. The first lens is formed on the first portion of the sphere, the second portion of the sphere is exposed out of the first lens, and the first lens is provided with a first light absorption curve opposite to the first portion of the sphere, so that a light beam can pass through the second portion of the sphere to form the first light condensing effect, and then pass through the first light absorption curve to form a second light condensing effect.

Abstract: A lens structure formed by materials in different refractive indexes includes a sphere, a first lens and a separation layer which is disposed between the sphere and the first lens. The sphere and the first lens have a different refractive index and the sphere is a round ball. The first lens is formed on the sphere that part of the sphere is exposed out of the first lens, and the first lens includes a first light absorption curve. The separation layer includes a transparent section opposite to the first light absorption curve. When a light beam passes through the second portion of the sphere to form a first light condensing effect and enter the sphere, the light beam will then pass through the transparent section to enter the first lens, forming a second light condensing effect after passing through the first light absorption curve.

Abstract: An inner module used in a wireless earphone is installed primarily in a wireless earphone, including a circuit loop and an upper cover. The circuit loop includes at least a first circuit board, at least a second circuit board which is extended from the first circuit board, and a lower cover which encloses the first circuit board. The upper cover is installed on the lower cover, including a first side wall which forms an angle with respect to the lower cover. In addition, the first side wall is provided with a first positioning slot to accommodate the second circuit board. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone, which reduces the labor cost in assembling the wireless earphone significantly.

Abstract: An inner module with a retainer is installed primarily inside a wireless earphone, including a circuit loop, an insulation seat to fix the circuit loop, and at least a retainer. The circuit loop includes at least a first circuit board, and at least a second circuit board which is extended from the first circuit board. The insulation seat includes at least a base plate to enclose the first circuit board, and a first side wall which is extended from the base plate. The first side wall is provided with a first positioning slot to accommodate the second circuit board. The retainer is fixed on the first side wall to fix the second circuit board in the first positioning slot. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone.

Abstract: An inner module assembly formed by a metal tape is installed primarily inside a wireless earphone. The inner module assembly includes a circuit loop having a first circuit board and a second circuit board, with the circuit loop being formed with plural junctions; a first metal tape which fixes the second circuit board and includes a first extension section extending to the outside of the second circuit board and having a first cut-off face; and an insulation seat which is formed on the first circuit board to enclose the circuit loop and the first metal tape, with part of the junctions and the first cut-off face being exposed on a surface of the insulation seat. Therefore, the inner module assembly is formed into a modularized design to simplify the assembly procedure of the wireless earphone.

Abstract: A combinatorial inner module is installed primarily inside a wireless earphone, including a circuit loop, a lower cover and an upper cover. The circuit loop is provided with a first circuit board and a second circuit board which is extended from the first circuit board. The upper cover is disposed above the lower cover to fix the first circuit board between the upper cover and the lower cover. Moreover, the upper cover includes a first side wall which is formed with an angle with respect to the lower cover and is used to install the second circuit board, forming an included angle between the second circuit board and the first circuit board. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone, which reduces the labor cost in assembling the wireless earphone significantly.

Abstract: A cable-holding device with sealing assembly includes a body having a main unit, a first connecting portion and a second connecting portion, a sealing assembly on the body, and an adjustment element on the second connecting portion. The body has a connecting hole, and the second connecting portion is extended with plural clamping arms. The sealing assembly includes a first sealing portion outside the first connecting portion, a second sealing portion inside the clamping arms to form a tightening port, and a connecting portion between the first sealing portion and the second sealing portion. On the second connecting portion, the adjustment element includes a first movement state which forms a tightening state on the tightening port, and a second movement state which changes the tightening port from the tightening state into a non-tightening state gradually.