Patents by Inventor Chin Mo KIM

Chin Mo KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11069954
    Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: July 20, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chin Mo Kim, Jae Yeong Kim, Sung Yong An, Sung Nam Cho, Ji Hyung Jung
  • Publication number: 20210151257
    Abstract: A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.
    Type: Application
    Filed: December 24, 2020
    Publication date: May 20, 2021
    Inventors: Chang Hwa PARK, Jin Woo KIM, Min Gi SIN, Byung Hyun PARK, Chin Mo KIM
  • Publication number: 20210111478
    Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).
    Type: Application
    Filed: February 12, 2020
    Publication date: April 15, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chin Mo KIM, Jae Yeong KIM, Sung Yong AN, Sung Nam CHO, Ji Hyung JUNG
  • Publication number: 20210066814
    Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.
    Type: Application
    Filed: January 2, 2020
    Publication date: March 4, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Ji Hyung JUNG, Chin Mo KIM, Sung Nam CHO, Sung Yong AN
  • Publication number: 20210036407
    Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.
    Type: Application
    Filed: March 24, 2020
    Publication date: February 4, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chin Mo KIM, Sung Yong AN, Ji Hyung JUNG, Jae Yeong KIM, Ju Hyoung PARK, Sung Nam CHO
  • Patent number: 10903013
    Abstract: A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: January 26, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hwa Park, Jin Woo Kim, Min Gi Sin, Byung Hyun Park, Chin Mo Kim
  • Publication number: 20200335870
    Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.
    Type: Application
    Filed: February 27, 2020
    Publication date: October 22, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Chin Mo KIM, Ji Hyung JUNG, Sung Nam CHO, Sung Yong AN
  • Publication number: 20200313279
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.
    Type: Application
    Filed: January 2, 2020
    Publication date: October 1, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Sung Nam CHO, Sung Yong AN, Ji Hyung JUNG, Chin Mo KIM
  • Publication number: 20200176191
    Abstract: A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.
    Type: Application
    Filed: February 5, 2020
    Publication date: June 4, 2020
    Inventors: Chang Hwa PARK, Jin Woo KIM, Min Gi SIN, Byung Hyun PARK, Chin Mo KIM
  • Patent number: 10600572
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: March 24, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Ho Lee, Min Gi Sin, Hak Kwan Kim, Chin Mo Kim, Chi Hwa Lee, Hong Seok Kim, Woo Sup Kim, Chang Hwa Park
  • Patent number: 10593482
    Abstract: A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: March 17, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hwa Park, Jin Woo Kim, Min Gi Sin, Byung Hyun Park, Chin Mo Kim
  • Patent number: 10580575
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Ho Lee, Min Gi Sin, Hak Kwan Kim, Chin Mo Kim, Chi Hwa Lee, Hong Seok Kim, Woo Sup Kim, Chang Hwa Park
  • Patent number: 10418178
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: September 17, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Ho Lee, Min Gi Sin, Hak Kwan Kim, Chin Mo Kim, Chi Hwa Lee, Hong Seok Kim, Woo Sup Kim, Chang Hwa Park
  • Publication number: 20190172641
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Application
    Filed: February 5, 2019
    Publication date: June 6, 2019
    Inventors: Jin Woo KIM, Jong Ho LEE, Min Gi SIN, Hak Kwan KIM, Chin Mo KIM, Chi Hwa LEE, Hong Seok KIM, Woo Sup KIM, Chang Hwa PARK
  • Publication number: 20180182557
    Abstract: A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.
    Type: Application
    Filed: July 19, 2017
    Publication date: June 28, 2018
    Inventors: Chang Hwa PARK, Jin Woo KIM, Min Gi SIN, Byung Hyun PARK, Chin Mo KIM
  • Publication number: 20180130601
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Application
    Filed: August 23, 2017
    Publication date: May 10, 2018
    Inventors: Jin Woo KIM, Jong Ho LEE, Min Gi SIN, Hak Kwan KIM, Chin Mo KIM, Chi Hwa LEE, Hong Seok KIM, Woo Sup KIM, Chang Hwa PARK
  • Patent number: 9966179
    Abstract: A common mode filter includes a magnetic substrate in which ferrite particles having anisotropy and a planar structure are disposed to have a planar orientation.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: May 8, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chin Mo Kim, Jung Wook Seo, Eun Hye Na, Hak Kwan Kim, Hyung Jin Jeon, Sung Yong An
  • Publication number: 20160307687
    Abstract: A common mode filter includes a magnetic substrate in which ferrite particles having anisotropy and a planar structure are disposed to have a planar orientation.
    Type: Application
    Filed: April 15, 2016
    Publication date: October 20, 2016
    Inventors: Chin Mo KIM, Jung Wook SEO, Eun Hye NA, Hak Kwan KIM, Hyung Jin JEON, Sung Yong AN