Abstract: Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods are disclosed herein. In one embodiment, a substrate includes a first pair and a second pair of electrical contacts on a first surface of the substrate. The first pair of electrical contacts can be configured to receive a first surface-mount capacitor, and the second pair of electrical contacts can be configured to receive a second surface-mount capacitor. The first pair of electrical contacts can be spaced apart by a first space, and the second pair of electrical contacts can be spaced apart by a second space. The first and second spaces can correspond to corresponding to first and second distances between electrical contacts of the first and second surface-mount capacitors.

Abstract: An information handling system includes a battery and a charger. The battery provides a battery voltage to a main power rail of the information handling system and is couplable to the main power rail through a switch. The charger has an output coupled to the main power rail and an input coupled to an external power adapter. The power adapter provides a selectable voltage level to the input. The information handling system selects a particular voltage level that is lower than the battery voltage and directs the switch to decouple the battery from the main power rail when the information handling system is in a soft power-off state.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: Embodiments of the disclosure relate to an optoelectronic device having an epitaxial stack, an array of laser emitters, and a thermal sensor. The epitaxial stack includes a set of epitaxial layers. The array of laser emitters is formed in the set of epitaxial layers. The thermal sensor is coupled to the epitaxial stack at a location adjacent to a laser emitter of the array of laser emitters. The optoelectronic device further includes a controller configured to receive an output of the thermal sensor and determine a temperature at a junction between an active region and an inactive region in the laser emitter by in-situ measurements.

Abstract: Disclosed herein are electronic devices that include arrays of dual function light transmit and receive pixels. The pixels of such arrays include a photodetector (PD) structure and a vertical-cavity, surface-emitting laser (VCSEL) diode, both formed in a common stack of epitaxial semiconductor layers. The pixels of the array may be configured by a controller or processor to function either as a light emitter by biasing the VCSEL diode, or as a light detector or receiver by a different bias applied to the PD structure, and this functionality may be altered in time. The array of dual function pixels may be positioned interior to an optical display of an electronic device, in some cases to provide depth sensing or autofocus. The array of pixels may be registered with a camera of an electronic device, such as to provide depth sensing or autofocus.

Abstract: Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor device is an assembly that includes a package substrate having a front side and a backside opposite the front side. A controller die with a first longitudinal footprint can be attached to the front side of the package substrate. A passive electrical component is also attached to the front side of the package substrate. A stack of semiconductor dies can be attached to the controller die and the passive electrical component. The stack of semiconductor dies has a second longitudinal footprint greater than the first longitudinal footprint in at least one dimension. The controller die and the passive electrical component are positioned at least partially within the second longitudinal footprint, thereby at least partially supporting the stack of semiconductor dies.

Abstract: The present invention discloses a detection device and a probe module thereof, wherein an electrical connection path between a battery detection frame and a battery under test is provided via the probe module. The probe module includes a base, a first polarity plate, a second polarity plate, a first upper connection group, a second upper connection group, a first lower connection member and a second lower connection member. Via the first polarity plate, the first upper connection group is correspondingly coupled to the battery detection frame, and the first lower connection member is correspondingly coupled to the battery under test. Via the second polarity plate, the second upper connection group is correspondingly coupled to the battery detection frame, and the second lower connection member is correspondingly coupled to the battery under test. Thus, it is not necessary to process a cable having been fixed on the battery detection frame when the probe module is replaced.

Abstract: An apparatus includes a substrate for mounting an integrated circuit. The substrate includes a primary layer including a first surface that is a first external surface of the substrate. The substrate includes an inner layer that is located below the primary layer and including a second surface. A portion of the second surface of the inner layer is exposed via an open area associated with the primary layer. The inner layer includes a first multiple of wire bond pads that are exposed via the open area associated with the primary layer.

Abstract: This document discloses techniques, apparatuses, and systems relating to a package substrate for a semiconductor device. A semiconductor device assembly is described that includes a packaged semiconductor device having one or more semiconductor dies coupled to a package-level substrate. The package-level substrate has a first surface at which first contact pads are disposed in a first configuration. The packaged semiconductor device is coupled with an additional package-level substrate that includes a second surface having second contact pads disposed in the first configuration and a third surface having third contact pads disposed in a second configuration different from the first configuration. The additional package-level substrate includes circuitry coupling the second contact pads the third contact pads to provide connectivity at the third contact pads. In doing so, an adaptively compatible semiconductor device may be assembled.

Abstract: Semiconductor devices, and related systems and methods, are disclosed herein. In some embodiments, the stacked semiconductor device includes a package substrate having an inner surface, a die stack carried by the inner surface, and a stacked capacitor device carried by the inner surface adjacent to the die stack. The die stack can include one or more semiconductor dies, each of which can be electrically coupled to the inner surface by one or more bond wires and/or solder structures. The stacked capacitor device can include a first capacitor having a lower surface attached to the inner surface of the package substrate, a interposer having a first side attached to an upper surface of the first capacitor, and a second capacitor attached to a second side of the interposer opposite the first side.

Abstract: Modular systems in packages, and associated devices, systems, and methods, are disclosed herein. In one embodiment, a system comprises a main module package and an upper module package. The main module package includes a first substrate and a first electronic device mounted on a first side of the first substrate. The upper module package includes a second substrate and one or more second electronic devices mounted on a first side of the second substrate. The second substrate includes a cavity at a second side of the second substrate opposite the first side, and the upper module package is mountable on the first side of the first substrate of the main module package such that the first electronic device is positioned within the cavity and the second substrate generally surrounds at least a portion of a perimeter of the first electronic device.

Abstract: The invention enables automated revision comparison of engineering data within a process control system. In various embodiments, the invention achieves this by (i) receiving user input defining a set of data retrieval parameters that identify change-set data for an engineering data file, (ii) retrieving from among change-sets retrieved based on the data retrieval parameters, a first change-set and a second change-set, (iii) retrieving from an engineering database, first and second revisions of the engineering data file corresponding to the first change-set and the second change-set (iv) comparing the retrieved first and second revisions, and (v) displaying a deviation report that is generated based on the identified deviations between the first and second revisions.

Abstract: The invention enables automated revision comparison of engineering data within a process control system. In various embodiments, the invention achieves this by (i) receiving user input defining a set of data retrieval parameters that identify change-set data for an engineering data file, (ii) retrieving from among change-sets retrieved based on the data retrieval parameters, a first change-set and a second change-set, (iii) retrieving from an engineering database, first and second revisions of the engineering data file corresponding to the first change-set and the second change-set (iv) comparing the retrieved first and second revisions, and (v) displaying a deviation report that is generated based on the identified deviations between the first and second revisions.

Abstract: An aroma diffuser structure includes a base, a holding member, a frame, an adjusting member, and an aroma diffuser. The holding member is mounted on the base and has a screw hole. The frame is mounted on the holding member and has an upper portion provided with a first magnetic member. The adjusting member has an external threaded section extending through the frame and screwed through the screw hole of the holding member. The aroma diffuser has a plurality of air vents. The aroma diffuser is rotatable on the adjusting member and has a top provided with a rotation shaft which is provided with a second magnetic member magnetically attracted with the first magnetic member.

Abstract: An aroma diffuser structure includes a base, a holding member, a frame, an adjusting member, and an aroma diffuser. The holding member is mounted on the base and has a screw hole. The frame is mounted on the holding member and has an upper portion provided with a first magnetic member. The adjusting member has an external threaded section extending through the frame and screwed through the screw hole of the holding member. The aroma diffuser has a plurality of air vents. The aroma diffuser is rotatable on the adjusting member and has a top provided with a rotation shaft which is provided with a second magnetic member magnetically attracted with the first magnetic member.

Abstract: Described are systems and methods for implementation in relation to hard disk drives. The disclosure is direct, at least in part, to a method for writing data in a multiple actuator multiple disk system, and the multiple actuator disk system for performing that method. The method comprises receiving the data and dividing the data into at least a first predetermined portion and a second predetermined portion. The method also includes and writing the first predetermined portion of the data onto a first disk surface of the multiple actuator multiple disk system using a first actuator of the multiple actuators while writing the second predetermined portion of the data onto a second disk surface of the multiple actuator multiple disk system using a second actuator of the multiple actuators.

Abstract: An actuator assembly for crosstalk reduction in hard disk drives (HDDs) is provided. The actuator assembly comprises a base plate; a pivot; a voice coil motor (VCM) with an upper yoke and a lower yoke; and a cut-out insert having a predetermined stiffness and predetermined magnetic properties, wherein the cut-out insert corresponds to a cut-out recess of the base plate, and wherein the lower yoke of the VCM and the pivot are coupled to the cut-out insert.

Abstract: Methods and apparatuses for balancing computing workload via migrating computing tasks are disclosed. An artificial neural network (ANN) is trained based on the workload distribution over time for a host. The ANN predicts the workload for the host, and an indication may be sent to migrate at least one computing task away from the host. The indication is sent when the method is operating in a proactive mode and when the predicted workload is outside of a desired operating range. Some embodiments monitor the workload; and automatically switch the method to the proactive mode, when a difference between the monitored workload and the predicted workload is small. Other embodiments monitor the workload; and automatically switch the method to a reactive mode, when the monitored workload is outside of a failsafe operating range for the particular host.

Abstract: A hand tool includes a central shaft extending along an axis and having a threaded section, a tool head sleeved rotatably on the central shaft, a pressing block sleeved movably on the central shaft, an adjusting member threaded to the threaded section of the central shaft and rotatable to move the pressing block on the central shaft, and an indication unit. The indication unit includes a slide slot formed in a handle, an indicating member disposed movably on the handle and having a guiding projection movable within the slide slot, and a revolution number scale disposed on the handle and adjacent to the slide slot. The indicating member is connected to and co-movable with the adjusting member.