Patents by Inventor Chin Teong Ong

Chin Teong Ong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11203704
    Abstract: Hot melt processable adhesive compositions to mask electronic components include at least one block copolymer, at least one tackifying resin, at least one semi-crystalline polyolefin polymer, at least one plasticizer, and at least one anti-oxidant. The adhesive composition is a hot melt processable pressure sensitive adhesive composition that is thermally stable, such that the composition when disposed on a surface withstands heating to 260° C. without degradation or flowing, remains optically transparent, and after heating to 260° C. remains cleanly removable.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: December 21, 2021
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Richard Yufeng Liu, Yi Lin Sim, Chin Teong Ong, Roger A. Grisle, Michael C. Martin, Nathaniel I. Lehn
  • Publication number: 20210032513
    Abstract: Hot melt processable adhesive compositions to mask electronic components include at least one block copolymer, at least one tackifying resin, at least one semi-crystalline polyolefin polymer, at least one plasticizer, and at least one anti-oxidant. The adhesive composition is a hot melt processable pressure sensitive adhesive composition that is thermally stable, such that the composition when disposed on a surface withstands heating to 260° C. without degradation or flowing, remains optically transparent, and after heating to 260° C. remains cleanly removable.
    Type: Application
    Filed: March 20, 2019
    Publication date: February 4, 2021
    Inventors: Richard Yufeng Liu, Yi Lin Sim, Chin Teong Ong, Roger A. Grisle, Michael C. Martin, Nathaniel I. Lehn
  • Patent number: 9889461
    Abstract: The present invention discloses a display panel substrate assembly and an apparatus and method for forming a display panel substrate assembly, wherein the substrate assembly includes a first substrate and a second substrate. At least one of the first substrate and the second substrate is optically clear. The method includes the steps of screen printing a non-sag adhesive composition onto a surface of the first substrate, bringing the non-sag adhesive composition into contact with a surface of the second substrate in an environment having a pressure of less than or equal to about 5000 pascals, and curing the non-sag adhesive composition to yield an adhesive layer. The non-sag adhesive composition is of a type which is optically clear after curing.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: February 13, 2018
    Assignees: 3M INNOVATIVE PROPERTIES COMPANY, TRIMECH TECHNOLOGY PTE. LTD
    Inventors: Stanley C. Busman, Chin Teong Ong, Yi Lin Sim, Wee Hock Chan, Xinhe Chen, Meng Sheng Toy
  • Patent number: 9169422
    Abstract: A method for making an optical assembly is disclosed. The method involves disposing a liquid optically clear composition with a coating head. The liquid optically clear composition is disposed onto a target substrate to form an optically clear adhesive layer for adhering elements in an optical assembly. The optical assembly includes a display panel bonded to another optical component and may be used in a display device.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: October 27, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Jonathan J. O'Hare, Christopher J. Campbell, Albert I. Everaerts, Chin Teong Ong, Yi Lin Sim
  • Patent number: 9067395
    Abstract: A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer. The curative layer is coated and then dried of solvent. Then an epoxy layer is laminated to a top and a bottom of the curative layer. The epoxy tape is placed between two parts being bonded together and then heated to temperatures of bottom up to about 110° C. to activate and disperse the active curative. A semi-structural bond is formed. Also, a method of making the epoxy tape is provided.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: June 30, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: David J. Plaut, Sean M. Tsuji, Chin Teong Ong, Siang Kwang Lee
  • Publication number: 20150037593
    Abstract: There is a method for forming a laminated product having a first substrate and a second substrate. The method may comprise applying a liquid adhesive on a surface of the first substrate for bonding the first substrate to the second substrate. The liquid adhesive located on a circumferential periphery of the first substrate for limiting movement of the liquid adhesive within the circumferential adhesive wall structure. Pressure may be applied on a bond area between the first substrate and the second substrate in a vacuum environment to incrementally increase the bond area between the first substrate and the second substrate to incrementally bond the first substrate to the second substrate. The liquid adhesive may be cured to bond the first and second substrates.
    Type: Application
    Filed: November 22, 2012
    Publication date: February 5, 2015
    Applicants: 3M Innovative Properties Company, Trimech Technology PTE. LTD.
    Inventors: Wee Hock Chan, Xinhe Chen, Jia Tow, Chin Teong Ong, Yi Lin Sim
  • Publication number: 20140234553
    Abstract: A method for making an optical assembly is disclosed. The method involves disposing a liquid optically clear composition with a coating head. The liquid optically clear composition is disposed onto a target substrate to form an optically clear adhesive layer for adhering elements in an optical assembly. The optical assembly includes a display panel bonded to another optical component and may be used in a display device.
    Type: Application
    Filed: September 26, 2012
    Publication date: August 21, 2014
    Inventors: Jonathan J. O'Hare, Christopher J. Campell, Albert I. Everaerts, Chin Teong Ong, Yi Lin Sim
  • Publication number: 20130333838
    Abstract: A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer. The curative layer is coated and then dried of solvent. Then an epoxy layer is laminated to a top and a bottom of the curative layer. The epoxy tape is placed between two parts being bonded together and then heated to temperatures of bottom up to about 110° C. to activate and disperse the active curative. A semi-structural bond is formed. Also, a method of making the epoxy tape is provided.
    Type: Application
    Filed: August 17, 2011
    Publication date: December 19, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: David J. Plaut, Sean M. Tsuji, Chin Teong Ong, Siang Kwang Lee
  • Publication number: 20130295337
    Abstract: The present invention discloses a display panel substrate assembly and an apparatus and method for forming a display panel substrate assembly, wherein the substrate assembly includes a first substrate and a second substrate. At least one of the first substrate and the second substrate is optically clear. The method includes the steps of screen printing a non-sag adhesive composition onto a surface of the first substrate, bringing the non-sag adhesive composition into contact with a surface of the second substrate in an environment having a pressure of less than or equal to about 5000 pascals, and curing the non-sag adhesive composition to yield an adhesive layer. The non-sag adhesive composition is of a type which is optically clear after curing.
    Type: Application
    Filed: September 9, 2011
    Publication date: November 7, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Stanley C. Busman, Chin Teong Ong, Yi Lin Sim, Wee Hock Chan, Xinhe Chen, Meng Sheng Toy