Patents by Inventor Chin-Tien Yang

Chin-Tien Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929331
    Abstract: The present disclosure provides a routing structure. The routing structure includes a substrate having a boundary and a first conductive trace configured to be coupled to a first conductive pad disposed within the boundary of the substrate. The first conductive trace is inclined with respect to the boundary of the substrate.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chin-Shen Lin, Wan-Yu Lo, Meng-Xiang Lee, Hao-Tien Kan, Kuo-Nan Yang, Chung-Hsing Wang
  • Patent number: 11774468
    Abstract: A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: October 3, 2023
    Assignee: MPI CORPORATION
    Inventors: Chin-Tien Yang, Yang-Hung Cheng, Yu-Hao Chen, Chin-Yi Tsai, Hui-Pin Yang, Horng-Chuan Sun
  • Publication number: 20230007997
    Abstract: A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 12, 2023
    Applicant: MPI CORPORATION
    Inventors: CHIN-TIEN YANG, YANG-HUNG CHENG, YU-HAO CHEN, CHIN-YI TSAI, HUI-PIN YANG, HORNG-CHUAN SUN
  • Publication number: 20220171249
    Abstract: An optical element comprising a planar substrate with a first large surface functioning as a light-entrance surface, and a second large surface functioning as a light-exit surface. The optical element further comprises a liquid or skeleton matrix arranged between the first and second large surface, and electrophoretically or magnetophoretically movable particles that interact with light of one or several wavelengths or wavelength ranges.
    Type: Application
    Filed: August 18, 2020
    Publication date: June 2, 2022
    Inventors: Andreas BREGULLA, André HEBER, Yannick BOURGIN, Ambrose Peter NARI, Chin Tien YANG, Markus KLIPPSTEIN
  • Patent number: 11346860
    Abstract: A probe head includes a probe seat having upper, middle and lower dies, an electrically conductive layer inside the probe seat, a first spring probe penetrating through the probe seat, and at least two shorter second spring probes penetrating through the lower die in a way that top ends of the second spring probes are located inside the probe seat and abutted against the electrically conductive layer. Another probe head includes the aforesaid probe seat, an electrically conductive layer partially inside the probe seat and partially outside the probe seat, a first spring probe penetrating through the probe seat, and a shorter second spring probe penetrating through the lower die in a way that a top end of the second spring probe is located inside the probe seat and abutted against the electrically conductive layer. As such, fine pitch requirement and different high frequency testing requirements are fulfilled.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: May 31, 2022
    Assignee: MPI CORPORATION
    Inventors: Chin-Tien Yang, Hui-Pin Yang, Shang-Jung Hsieh, Tsung-Yi Chen, Yu-Hao Chen, Jhin-Ying Lyu
  • Publication number: 20220113334
    Abstract: The present invention provides a probe card comprising a probe base, at least one impedance-matching probes, and a plurality of first probes. The probe base has a probing side and a tester side opposite to the probing side. Each impedance-matching probe has a probing part and a signal transmitting part electrically coupled to the probing part, wherein one end of the signal transmitting part is arranged at tester side, and the signal transmitting part has a central probing axis. Each first probe has a probing tip and a cantilever part coupled to the probing tip, wherein the cantilever part is coupled to the probe base and has a first central axis such that an included angle is formed between the central probing axis and the first central axis.
    Type: Application
    Filed: October 13, 2021
    Publication date: April 14, 2022
    Inventors: Chin-Yi Tsai, Chia-Tai Chang, Cheng-Nien Su, Chin-Tien Yang, Chen-Chih Yu
  • Patent number: 11150269
    Abstract: A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: October 19, 2021
    Assignee: MPI CORPORATION
    Inventors: Hui-Pin Yang, Shang-Jung Hsieh, Yu-Wen Chou, Ching-Fang Yu, Huo-Kang Hsu, Chin-Tien Yang
  • Publication number: 20210048452
    Abstract: A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.
    Type: Application
    Filed: August 11, 2020
    Publication date: February 18, 2021
    Applicant: MPI CORPORATION
    Inventors: Hui-Pin YANG, Shang-Jung HSIEH, Yu-Wen CHOU, Ching-Fang YU, Huo-Kang HSU, Chin-Tien YANG
  • Publication number: 20210048451
    Abstract: A probe head includes a probe seat having upper, middle and lower dies, an electrically conductive layer inside the probe seat, a first spring probe penetrating through the probe seat, and at least two shorter second spring probes penetrating through the lower die in a way that top ends of the second spring probes are located inside the probe seat and abutted against the electrically conductive layer. Another probe head includes the aforesaid probe seat, an electrically conductive layer partially inside the probe seat and partially outside the probe seat, a first spring probe penetrating through the probe seat, and a shorter second spring probe penetrating through the lower die in a way that a top end of the second spring probe is located inside the probe seat and abutted against the electrically conductive layer. As such, fine pitch requirement and different high frequency testing requirements are fulfilled.
    Type: Application
    Filed: August 11, 2020
    Publication date: February 18, 2021
    Applicant: MPI CORPORATION
    Inventors: Chin-Tien YANG, Hui-Pin YANG, Shang-Jung HSIEH, Tsung-Yi CHEN, Yu-Hao CHEN, Jhin-Ying LYU
  • Publication number: 20160167080
    Abstract: A coating device is provided, and includes a coater and an electrical field generator. The coater contains a slurry or ink and has an outlet. The slurry or ink is coated on a substrate through the outlet. The substrate is disposed adjacent to the outlet, and loads the slurry or ink from the outlet of the coater to form a wet film. The electrical field generator is disposed under the substrate and provides the electrical field, and thus the wet film stacks tightly on the substrate due to the attraction of the electrical field.
    Type: Application
    Filed: November 23, 2015
    Publication date: June 16, 2016
    Inventors: Chun-An Lu, Yuan-Ling Tsai, Chiung-Hsiung Chen, Jiun-Jang Yu, Chin-Tien Yang
  • Patent number: 9244018
    Abstract: A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: January 26, 2016
    Assignee: MPI Corporation
    Inventors: Chia-Tai Chang, Chin-Yi Tsai, Chiu-Kuei Chen, Chen-Chih Yu, Chien-Chang Lai, Chin-Tien Yang, Hui-Pin Yang, Keng-Shieng Chang, Yun-Ru Huang
  • Patent number: 9201098
    Abstract: A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes a signal probe and a first conductor corresponding to the signal probe and being electrically connected with the ground probe. An insulation layer is disposed between the first conductor and the signal probe.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: December 1, 2015
    Assignee: MPI CORPORATION
    Inventors: Chia-Tai Chang, Chin-Yi Tsai, Chiu-Kuei Chen, Chen-Chih Yu, Chien-Chang Lai, Chin-Tien Yang, Hui-Pin Yang, Keng-Shieng Chang, Yun-Ru Huang
  • Patent number: 8927314
    Abstract: A method of manufacturing a solar cell includes the steps of: providing a substrate having a front side, a back side and a doped region; forming a conductor layer on the front side; firing the conductor layer at a temperature such that the conductor layer is formed with a first portion embedded into the doped region and a second portion other than the first portion; forming an anti-reflection coating (ARC) layer on the front side and the second portion, wherein the ARC layer covers the conductor layer so that the second portion of the conductor layer is disposed in the ARC layer; and removing the ARC layer on the conductor layer so that the conductor layer has an exposed surface exposed out of the ARC layer, wherein the exposed surface of the conductor layer is substantially flush with a first exposed surface of the ARC layer.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: January 6, 2015
    Assignee: Big Sun Energy Technology Inc.
    Inventors: Sheng Yung Liu, Chin-Tien Yang, Chun-Hung Lin
  • Patent number: 8728851
    Abstract: A method of manufacturing a solar cell comprises the steps of: forming a lower conductor layer on a front side of a substrate; firing the lower conductor layer at a first temperature to form a first portion embedded into a doped region of the substrate and a second portion; forming an anti-reflection coating (ARC) layer on the front side and the second portion, wherein the ARC layer covers the lower conductor layer such that the second portion is disposed in the ARC layer; forming an upper conductor layer, corresponding to the lower conductor layer and electrically connected to the lower conductor layer, on the ARC layer; and firing the upper conductor layer at a second temperature to form a first portion embedded into the ARC layer and a second portion, which is exposed out of the ARC layer.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: May 20, 2014
    Assignee: Big Sun Energy Technology Inc.
    Inventors: Sheng Yung Liu, Chin-Tien Yang, Chun-Hung Lin
  • Publication number: 20140069613
    Abstract: A cooling apparatus is disclosed. The cooling apparatus includes a carrier and a flat-plate type cooling conduit. The flat-plate type cooling conduit is made of a high thermal conductive material and disposed on or in the carrier. The flat-plate type cooling conduit includes a conduit portion and a flat plate portion. The conduit portion has a conducting hole for conducting a coolant, and the flat plate portion is adhered to the carrier for allowing the coolant to perform heat exchange through a large contact area between the flat plate portion and the carrier. In addition, a cooling source gel can be used to perform heat exchange with the coolant in the conducting hole in order to improve the heat exchange efficiency of the cooling apparatus, and to effectively reduce the temperature of the carrier.
    Type: Application
    Filed: August 13, 2013
    Publication date: March 13, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Chia-Ming LIU, Lien-Tai CHEN, Tsing-Tang SONG, Chin-Tien YANG, Szu-Ju LI
  • Publication number: 20140016123
    Abstract: A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips.
    Type: Application
    Filed: July 12, 2013
    Publication date: January 16, 2014
    Inventors: Chia-Tai CHANG, Chin-Yi TSAI, Chiu-Kuei CHEN, Chen-Chih YU, Chien-Chang LAI, Chin-Tien YANG, Hui-Pin YANG, Keng-Shieng CHANG, Yun-Ru HUANG
  • Publication number: 20140015561
    Abstract: A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one N-type ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes an N-type signal probe and a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe. An insulation layer is disposed between the first conductor and the N-type signal probe.
    Type: Application
    Filed: July 12, 2013
    Publication date: January 16, 2014
    Inventors: Chia-Tai CHANG, Chin-Yi TSAI, Chiu-Kuei CHEN, Chen-Chih YU, Chien-Chang LAI, Chin-Tien YANG, Hui-Pin YANG, Keng-Shieng CHANG, Yun-Ru HUANG
  • Publication number: 20140016124
    Abstract: An optical inspection device includes a circuit board having at least one first opening, a mounting plate disposed on a top or bottom surface of the circuit board and having at least one second opening corresponding to the at least one first opening respectively, at least one lens holder received in the at least one second opening, and at least one probe module disposed on a bottom surface of the mounting plate or the bottom surface of the circuit board, corresponding to the at least one lens holder respectively, and having probes electrically connected with the circuit board. Each lens holder has an accommodation for accommodating a lens, and is operatable to do a position adjusting motion in the corresponding second opening.
    Type: Application
    Filed: July 12, 2013
    Publication date: January 16, 2014
    Inventors: Chia-Tai CHANG, Chin-Yi TSAI, Chiu-Kuei CHEN, Chen-Chih YU, Chien-Chang LAI, Chin-Tien YANG, Hui-Pin YANG, Keng-Shieng CHANG, Yun-Ru HUANG, Chien-Hung CHEN
  • Publication number: 20140004652
    Abstract: A method of fabricating solar cell uses simplified processes to form a lightly-doped region having a textured surface and a heavily-doped region having a flat surface. A flat interface is formed between the heavily-doped region and an electrode, which has a relative lower contact resistance.
    Type: Application
    Filed: June 17, 2013
    Publication date: January 2, 2014
    Inventors: Ming-Jeng Huang, Wen-Chin Lo, Chin-Tien Yang
  • Patent number: 8575791
    Abstract: A manufacturing-process equipment has a platform assembly, a measurement feedback assembly and a laser-working assembly. The platform assembly has a base and a hybrid-moving platform. The base has a mounting frame. The hybrid-moving platform is mounted on the base and has a long-stroke moving stage and a piezo-driven micro-stage. The long-stroke moving stage has a benchmark set and a driving device. The piezo-driven micro-stage is connected to the long-stroke moving stage and has a working platform. The measurement feedback assembly is securely mounted on the platform assembly and has a laser interferometer, a reflecting device and a signal-receiving device. The laser-working assembly is mounted on the platform assembly, is electrically connected to the measurement feedback assembly and has a laser direct-writing head, a controlling interface device and a positioning interface device.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: November 5, 2013
    Assignee: National Formosa University
    Inventors: Wen-Yuh Jywe, Jing-Chung Shen, Chin-Tien Yang, Chien-Hung Liu, Jau-Jiu Ju, Chia-Hung Wu, Chun-Chieh Huang, Lili Duan, Yuan-Chin Lee