Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: A foldable device may include a foldable layer and a hinge mechanism. The hinge mechanism may include at least one gear module that provides for synchronized movement of the hinge mechanism about a central plane of the hinge mechanism. A lock module may be coupled the hinge mechanism. The lock module may include a cam and a plate including a plurality of recesses. The lock module may selectively lock the hinge mechanism, and the foldable device, in one of a plurality of positions, based on a position of the cam in one of the recesses.

Abstract: A foldable device may include a foldable layer and a hinge mechanism. The hinge mechanism may include at least one synchronizing module, at least one torsion module, and a cover module. The at least one synchronizing module may include a synchronizing gear assembly including a first linking gear in meshed engagement with a first rotating link, a second linking gear in meshed engagement with a second rotating link, and at least one intermediate gear in meshed engagement with the first linking gear and the second linking gear. The first rotating link may be coupled to a first housing of a computing device and the second rotating link may be coupled to a second housing of the computing device. The meshed engagement of the first and second rotating links may provide of synchronized, symmetric movement of the first and second housings about a central axis of the computing device.