Patents by Inventor Chiung-Ying KUO

Chiung-Ying KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250038084
    Abstract: An electronic device is disclosed. The electronic device includes an electronic component, an input/output (I/O) signal delivery circuit, and a power delivery circuit. The electronic component has a first surface and a second surface opposite to the first surface. The I/O signal delivery circuit is disposed under the first surface of the electronic component. The power delivery circuit is disposed over the second surface of the electronic component and configured to balance a warpage of the electronic device.
    Type: Application
    Filed: July 28, 2023
    Publication date: January 30, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chiung-Ying KUO, Chun-Yen TING, Hung-Chun KUO, Jung Jui KANG, Chang Chi LEE
  • Patent number: 12211780
    Abstract: An electronic package structure is provided. The electronic package structure includes a first carrier, a first electronic component, a first optical channel, and a second electronic component. The first electronic component is disposed on or within the first carrier. The first optical channel is disposed within the first carrier. The first optical channel is configured to provide optical communication between the first electronic component and the second electronic component. The first carrier is configured to electrically connect the first electronic component.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: January 28, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chiung-Ying Kuo, Hung-Chun Kuo
  • Patent number: 12156336
    Abstract: An electronic device is disclosed. The electronic device includes a carrier including a first portion, a second portion over the first portion, and a third portion connecting the first portion and the second portion. The electronic device also includes a first electronic component disposed between the first portion and the second portion. An active surface of the first electronic component faces the second portion. The electronic device also includes a second electronic component disposed over the second portion. The first portion is configured to transmit a first power signal to a backside surface of the first electronic component opposite to the active surface.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: November 26, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chiung-Ying Kuo, Hung-Chun Kuo, Pao-Nan Lee, Jung Jui Kang, Chang Chi Lee
  • Publication number: 20240282694
    Abstract: An electronic package is provided. The electronic package includes a power regulating component, an electronic component, and a circuit structure. The circuit structure separates the power regulating component and the electronic component. The circuit structure is configured to provide a first power to the power regulating component. The power regulating component is configured to provide a second power to the electronic component through the circuit structure.
    Type: Application
    Filed: April 30, 2024
    Publication date: August 22, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chiung-Ying KUO, Hung-Chun KUO
  • Patent number: 11973018
    Abstract: An electronic package is provided. The electronic package includes a power regulating component, an electronic component, and a circuit structure. The circuit structure separates the power regulating component and the electronic component. The circuit structure is configured to provide a first power to the power regulating component. The power regulating component is configured to provide a second power to the electronic component through the circuit structure.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: April 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chiung-Ying Kuo, Hung-Chun Kuo
  • Publication number: 20240008184
    Abstract: An electronic device is disclosed. The electronic device includes a carrier including a first portion, a second portion over the first portion, and a third portion connecting the first portion and the second portion. The electronic device also includes a first electronic component disposed between the first portion and the second portion. An active surface of the first electronic component faces the second portion. The electronic device also includes a second electronic component disposed over the second portion. The first portion is configured to transmit a first power signal to a backside surface of the first electronic component opposite to the active surface.
    Type: Application
    Filed: July 1, 2022
    Publication date: January 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chiung-Ying KUO, Hung-Chun KUO, Pao-Nan LEE, Jung Jui KANG, Chang Chi LEE
  • Publication number: 20230253305
    Abstract: An electronic package is provided. The electronic package includes a power regulating component, an electronic component, and a circuit structure. The circuit structure separates the power regulating component and the electronic component. The circuit structure is configured to provide a first power to the power regulating component. The power regulating component is configured to provide a second power to the electronic component through the circuit structure.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 10, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chiung-Ying KUO, Hung-Chun KUO
  • Publication number: 20230253299
    Abstract: An electronic package is provided. The electronic package includes an electronic component and a leadframe. The electronic component has a passive surface. The leadframe includes a first patterned part under the electronic component and configured to provide a power to the electronic component by the passive surface.
    Type: Application
    Filed: February 10, 2022
    Publication date: August 10, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chiung-Ying KUO, Hung-Chun KUO
  • Publication number: 20230215790
    Abstract: An electronic package structure is provided. The electronic package structure includes a first carrier, a first electronic component, a first optical channel, and a second electronic component. The first electronic component is disposed on or within the first carrier. The first optical channel is disposed within the first carrier. The first optical channel is configured to provide optical communication between the first electronic component and the second electronic component. The first carrier is configured to electrically connect the first electronic component.
    Type: Application
    Filed: January 5, 2022
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chiung-Ying KUO, Hung-Chun KUO